Abstract: A power semiconductor module includes a power semiconductor chip, an external contact electrically coupled to the power semiconductor chip, the external contact being configured to carry an alternating current and the external contact comprising an opening, and a current sensor assembly including a current sensor and being at least partially arranged in the opening, wherein the current sensor is configured to measure the alternating current.

Abstract: A semiconductor arrangement includes a circuit board having a metallization layer with first and second conductor tracks, and individual semiconductor chips each having a controllable semiconductor element, first and second load electrodes, and a control electrode. The first conductor track has a base section and further sections extending from the base section. The second conductor track has sections. The further sections of the first conductor track and the sections of the second conductor track extend parallel to one another in a first direction at least over a same lateral dimension of the individual semiconductor chips. The further sections of the first conductor track alternate with the sections of the second conductor track in a second direction orthogonal to the first direction. The individual semiconductor chips are arranged on the sections of the second conductor track. The first load electrodes are connected to the further sections of the first conductor track.

Abstract: A semiconductor arrangement includes a circuit board having a metallization layer with first and second conductor tracks, and individual semiconductor chips each having a controllable semiconductor element, first and second load electrodes, and a control electrode. The first conductor track has a base section and further sections extending from the base section. The second conductor track has sections. The further sections of the first conductor track and the sections of the second conductor track extend parallel to one another in a first direction at least over a same lateral dimension of the individual semiconductor chips. The further sections of the first conductor track alternate with the sections of the second conductor track in a second direction orthogonal to the first direction. The individual semiconductor chips are arranged on the sections of the second conductor track. The first load electrodes are connected to the further sections of the first conductor track.

Abstract: A semiconductor arrangement includes a circuit board having a metallization layer with first and second conductor tracks. The first conductor track has a base section and first, second and third sections, the third section arranged between the first and second sections. The second conductor track has first and second sections. The first section of the second conductor track is arranged between the first and third sections of the first conductor track. The second section of the second conductor track is arranged between the second and third sections of the first conductor track. The third section of the first conductor track is arranged between the first and second sections of the second conductor track. First and second subsets of semiconductor chips are arranged on the first section of the second conductor track. Third and fourth subsets of semiconductor chips are arranged on the second section of the second conductor track.

Abstract: A communication system for providing secure point-to-point communication comprising a communication network, a first client device and a second client device configured to communicate with each other via communication network, wherein each of the first and second client devices is adapted to run a selected communication application using a communication service provided by the communication network to communicate with each other, wherein the communication application which provides the highest communication service security level is selected from a group of communication applications using communication services with different communication service security levels and being available on the first and second client devices.

Abstract: A new type of burning device for producing hydrohalogen compounds.

Abstract: A computer system and computer implemented method that obtains coordinated results from at least two queries by utilizing context data of each query. Specifically, the computer system and computer implemented method facilitates enhanced querying functionality by matching entangled queries to achieve coordinated results.

Abstract: A semiconductor arrangement includes a circuit board having a metallization layer with first and second conductor tracks. The first conductor track has a base section and first, second and third sections, the third section arranged between the first and second sections. The second conductor track has first and second sections. The first section of the second conductor track is arranged between the first and third sections of the first conductor track. The second section of the second conductor track is arranged between the second and third sections of the first conductor track. The third section of the first conductor track is arranged between the first and second sections of the second conductor track. First and second subsets of semiconductor chips are arranged on the first section of the second conductor track. Third and fourth subsets of semiconductor chips are arranged on the second section of the second conductor track.

Abstract: One aspect of the invention relates to a semiconductor module with an outer housing having four side walls, and a circuit carrier, which is mounted on the outer housing and has an upper side and a lower side opposite the upper side. A semiconductor chip is arranged on the upper side and in the outer housing. A first gripping socket, which is formed as an indentation, extends from the outer side of the outer housing into a first of the side walls.

Abstract: A new type of burning device for producing hydrohalogen compounds.

Abstract: The object of the present invention was to be able to determine predictions as to database performance in a user-friendly manner with little effort at an early stage in the development process. With the help of said predictions, weaknesses in the database design and the database accesses that have been implemented are intended to be able to be effectively detected and, where relevant, corrected, before potentially serious performance problems result from these weaknesses at a later point in time. The expensive generation of (test) data is intended to be dispensed in this procedure. In order to achieve the object, the present invention describes a method for generating synthetic database statistics on the basis of existing and suitably formalized application knowledge—the PIs. Building on these statistics, explain mechanisms can then be used for lightweight and efficient prediction of the database performance.

Abstract: A method of producing a semiconductor module arrangement includes providing a first subassembly having a number N1 of first adjustment openings, a second subassembly having a number N2 of second adjustment openings and a third subassembly having a plurality of adjustment pins which are fixedly connected to one another, the first subassembly, the second subassembly and the third subassembly being independent of one another and not connected to one another. The first subassembly, the second subassembly and the third subassembly are arranged relative to one another in such a way that each of the adjustment pins engages into one of the first adjustment openings and/or into one of the second adjustment openings.

Abstract: A semiconductor module arrangement is provided having a first subassembly, a second subassembly and a third subassembly. The third subassembly has a quantity of adjustment pins which are fixedly connected to one another. The first subassembly has a number N1 of first adjustment openings, and the second subassembly has a number N2 of second adjustment openings. Each of the adjustment pins engages into a different one of the first adjustment openings and/or into one of the second adjustment openings. A corresponding method of producing the semiconductor module arrangement is also provided.

Abstract: A hand-held power tool includes a drive device in a housing. The drive device is intended to drive a tool accommodated in a tool-accommodating region. An adjusting motion of the hand-held power tool by the user is detected via a sensor device. A controlled variable for setting the drive device is generated in an open-loop or closed-loop control device in the hand-held power tool according to the detected adjusting motion.

Abstract: An autonomous working device, in particular an autonomous lawn mower, is configured to travel across a surface that is to be worked. The working device includes a processing unit configured to divide the surface that is to be worked into at least two dynamic partial surfaces to be traveled across separately by the working device.

Abstract: A communication system for providing secure point-to-point communication comprising a communication network, a first client device and a second client device configured to communicate with each other via said communication network, wherein each of the first and second client devices is adapted to run a selected communication application using a communication service provided by said communication network to communicate with each other, wherein the communication application which provides the highest communication service security level is selected from a group of communication applications using communication services with different communication service security levels and being available on the first and second client devices.

Abstract: An autonomous working device, in particular an autonomous lawn mower, comprising a computing unit. The autonomous working device is configured to cover a surface to be treated in strips. The computing unit is configured to adjust an overlap of the strips according to at least one parameter.