Power semiconductor module

- Infineon Technologies AG
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Description

FIG. 1 is a bottom plan view of a power semiconductor module showing our new design;

FIG. 2 is a top plan view thereof;

FIG. 3 is a side elevational view thereof;

FIG. 4 is another side elevational view thereof; and,

FIG. 5 is a top, side perspective view thereof.

All surfaces not shown form no part of the claimed design.

Claims

The ornamental design for a power semiconductor module, as shown and described.

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Patent History
Patent number: D776071
Type: Grant
Filed: Feb 18, 2015
Date of Patent: Jan 10, 2017
Assignee: Infineon Technologies AG (Neubiberg)
Inventors: Stefan Edenharter (Unterhaching), Christoph Koch (Salzkotten), Sven Schennetten (Balve)
Primary Examiner: Elizabeth J Oswecki
Application Number: 29/517,910