Abstract: Light-emitting devices and, more particularly, light-emitting devices with pseudo-exponential encoding and related methods are disclosed. Pseudo-exponential encoding or pseudo-exponential transformation refers to encoding and decoding techniques that include placement of certain data bits while at least one data bit is introduced in a manner that deviates from exponential transformation. The deviation involves introducing the at least one data bit to avoid duplicate zero values that may otherwise be present during decoding. Exemplary light-emitting devices include light-emitting diode (LED) packages and/or LED displays. Pseudo-exponential encoding as described herein provides bit shifting and manipulation for increased dynamic range with reduced complexity and size of hardware resources.

Abstract: Light emitting diode (LED) devices, methods and systems are provided. An example apparatus can include an underfill layer separate from a bonding layer. The apparatus can further include a dark encapsulating layer comprising an epoxy-molded compound which is applied using a powder-coating process. A method for providing a powder-coated encapsulation and for producing an LED panel with such an encapsulant is disclosed.

Abstract: Active control of light emitting diodes (LEDs) and LED packages within LED displays is disclosed. LED packages are disclosed that include a plurality of LED chips that form at least one LED pixel for an LED display. Each LED package may include an active electrical element that is configured to receive a control signal and actively maintain an operating state, such as brightness or grey level while other LED packages are being addressed. Active electrical elements may include active circuitry that includes one or more of a driver device, a signal conditioning or transformation device, a memory device, a decoder device, an electrostatic discharge (ESD) protection device, a thermal management device, and a detection device, among others. In this regard, each LED pixel of an LED display may be configured for operation with active matrix addressing.

Abstract: Solid state lighting apparatuses, systems, and related methods are provided. An example apparatus can include one or more light emitting diodes (LEDs) and a dark or black encapsulation layer surrounding and/or disposed between the one or more LEDs. The apparatus can include, e.g., a substrate or a leadframe for mounting the LEDs. A method for producing a panel of LEDs can include joining the LEDs to the panel, e.g., by bump bonding, and flooding the panel with dark or black encapsulation material so that the LED chips are surrounded by the dark or black encapsulation material.

Abstract: Light-emitting devices and, more particularly, design for test (DFT) scanning in light-emitting diode (LED) packages and related methods are disclosed. LED packages include one or more LED chips and an active electrical element capable of initiating DFT scanning. The active electrical element may be configured to receive scan initiation commands via a same data stream that includes other commands and data for controlling operation of the one or more LED chips. By using a same data stream, the active electrical element and LED package may be configured to implement DFT scanning without requiring separate ports for receiving DFT specific signals. The active electrical element may generate a test mode select (TMS) signal that is internal to the active electrical element upon receipt of a scan initiation command, and the TMS signal is used to trigger DFT scanning within the active electrical element.

Abstract: Active control of light emitting diodes (LEDs) and LED packages within LED displays is disclosed. LED packages are disclosed that include a plurality of LED chips that form at least one LED pixel for an LED display. Each LED package may include an active electrical element that is configured to receive a control signal and actively maintain an operating state, such as brightness or grey level while other LED packages are being addressed. Active electrical elements may include active circuitry that includes one or more of a driver device, a signal conditioning or transformation device, a memory device, a decoder device, an electrostatic discharge (ESD) protection device, a thermal management device, and a detection device, among others. In this regard, each LED pixel of an LED display may be configured for operation with active matrix addressing.

Abstract: Light-emitting devices and, more particularly, light-emitting devices with pseudo-exponential encoding and related methods are disclosed. Pseudo-exponential encoding or pseudo-exponential transformation refers to encoding and decoding techniques that include placement of certain data bits while at least one data bit is introduced in a manner that deviates from exponential transformation. The deviation involves introducing the at least one data bit to avoid duplicate zero values that may otherwise be present during decoding. Exemplary light-emitting devices include light-emitting diode (LED) packages and/or LED displays. Pseudo-exponential encoding as described herein provides bit shifting and manipulation for increased dynamic range with reduced complexity and size of hardware resources.

Abstract: Light-emitting diode (LED) packages and, more particularly, LED packages with varying current pulse width modulation (PWM) signals and related methods are disclosed. Varying current PWM is provided by having multiple current sources at different current levels for each LED chip in an LED package. An output PWM signal for each LED chip is routed to selectively turn on and off different combinations of current sources to provide varying current levels associated with varying brightness levels for each LED chip. By providing multiple current sources for each LED chip, the dynamic range of current levels and corresponding brightness levels may be increased for a same PWM clock frequency.

Abstract: Light-emitting diode (LED) packages and more particularly anchored light mixing structures in LED packages and related methods are disclosed. LED packages include one or more LED chips and integrated light mixing structures, such as light collectors, that are placed over the LED chips to modify far field patterns. Light mixing structures are provided within recesses of LED package housings in positions over the LED chips. Sidewalls of recesses may include alignment features with shapes configured to receive corresponding shapes of light mixing structures. Alternative configurations, alone or in combination with the sidewall alignment features, may include alignment features on top surfaces of the LED packages outside of a recess. As disclosed herein, alignment features are arranged to effectively anchor a light mixing structure in place during package assembly. Additional package structures, such as encapsulants and/or epoxies, may further hold the light mixing structures in place.

Abstract: Active control of light emitting diodes (LEDs) and LED packages within LED displays is disclosed. LED packages are disclosed that include a plurality of LED chips that form at least one LED pixel for an LED display or an LED panel. Each LED package may include an active electrical element that is configured to receive a control signal and actively maintain an operating state, such as brightness or grey level while other LED packages are being addressed. The control signal may be provided in a data stream that includes a plurality of data packets. Each data packet may include an identifier that enables each LED package of an array that receives the data packet to take one or more actions based on the identifier or a series of identifiers.

Abstract: Active control of light emitting diodes (LEDs) and LED packages within LED displays is disclosed. LED packages are disclosed that include a plurality of LED chips that form at least one LED pixel for an LED display or an LED panel. Each LED package may include an active electrical element that is configured to receive a control signal and actively maintain an operating state, such as brightness or grey level while other LED packages are being addressed. The control signal may be provided in a data stream that includes a plurality of data packets. Each data packet may include an identifier that enables each LED package of an array that receives the data packet to take one or more actions based on the identifier or a series of identifiers.

Abstract: Light-emitting diode (LED) packages, and more particularly to a light collector for light mixing in LED packages to improve the far field emission pattern (FFP) of the LED packages are disclosed. The LED package can include one or more LED chips with different wavelength ranges, and the light collector placed over the LED chips can have a reflective surface, save for a reduced aperture through which the light form the LED chips can be emitted after mixing in the light collector. The LED package can also include a lens to further improve the FFP. In an embodiment the light collector can include diffuser material to facilitate the mixing of the light within the light collector. The LED package with the light collector mixes multiple emission point sources into a single point source, or reduced-area source, that considerably improves the FFP of multi-colored LED chips of the LED package.

Abstract: Light-emitting diode (LED) packages and more particularly a light collector for light mixing in LED packages to improve the far field emission pattern (FFP) of the LED packages are disclosed. The LED package can include one or more LED chips with different wavelength ranges, and the light collector placed over the LED chips can have a reflective surface, save for a reduced aperture through which the light from the LED chips can be emitted after mixing in the light collector. The LED package can also include a lens to further improve the FFP. In an embodiment, the light collector can include diffuser material to facilitate the mixing of the light within the light collector. The LED package with the light collector mixes multiple emission point sources into a single point source, or reduced-area source, that considerably improves the FFP of multi-colored LED chips of the LED package.

Abstract: Synchronization for light emitting diode (LED) pixels in an LED display is provided so that one or more actions of all LED pixels are able to be initiated at the same time, or within a millisecond. LED displays and corresponding systems may include a controller that is configured for sending communication signals to one or more strings of LED pixels. Active electrical elements within each LED pixel may be configured to receive the communication signals, generate corresponding synchronization signals, and respond in a manner that is coordinated with all other LED pixels in a particular LED display. Failure mitigation of LED pixel failures within an LED string is provided where the controller is configured with bidirectional communication ports for communication with the LED string. In a failure mitigation process, the bidirectional communication ports may switch directions to provide communication signals to both sides of an LED string.

Abstract: Synchronization for light emitting diode (LED) pixels in an LED display is provided so that one or more actions of all LED pixels are able to be initiated at the same time, or within a millisecond. LED displays and corresponding systems may include a controller that is configured for sending communication signals to one or more strings of LED pixels. Active electrical elements within each LED pixel may be configured to receive the communication signals, generate corresponding synchronization signals, and respond in a manner that is coordinated with all other LED pixels in a particular LED display. Failure mitigation of LED pixel failures within an LED string is provided where the controller is configured with bidirectional communication ports for communication with the LED string. In a failure mitigation process, the bidirectional communication ports may switch directions to provide communication signals to both sides of an LED string.

Abstract: Light-emitting diode (LED) packages and, more particularly, LED packages with transformation and shifting of pulse width modulation (PWM) signals and related methods are disclosed. Discrete LED packages are arranged for cascade communication. Each LED package includes one or more LED chips, and each LED package is separately capable of receiving communication from a data stream, controlling operation of the one or more LED chips, and performing transformation and shifting of received PWM signals. Transformation may include compression and/or decompression of received PWM signals by each LED package to provide increased accessible dynamic range. After transformation, LED packages are capable of shifting transformed values to compensate for turn-on delay of LED chips, thereby reducing light drop-off problems at low intensity levels.

Abstract: Mixed clock domain signaling and, more particularly, mixed clock domain signaling for light-emitting diode (LED) packages arranged for cascade communication is disclosed. Mixed clock domain signaling involves digital communication where time-positions of bit pulse edges in a communication channel are derived from multiple uncorrelated clock domains, including an original clock domain from a master controller and a local clock domain. In the context of LED displays, serial strings of LED packages are arranged as LED pixels to receive cascade communication signals, and the original clock domain is derived from a master controller and a local clock domain is derived at each LED package. By providing for the bit period to be maintained and correlated to the original clock domain throughout the repeated cascade communication, problems associated with multiple uncorrelated clock domains in the communication channel, such as sampling jitter, may be averted, thus avoiding loss of data integrity.

Abstract: Light-emitting diode (LED) packages and, more particularly, real-time digital communication for LED packages and related methods are disclosed. Discrete LED packages are arranged for cascade communication. Each LED package is separately capable of receiving communication from a data stream, controlling operation of one or more LED chips, and performing real-time processing on at least one alterable data value of the data stream. LED packages may include real-time processors capable of processing data from a data value of the data stream and introducing the processed or altered data back into the data stream in the same data value. LED packages are disclosed that may be assembled together in arrays where each LED package may separately process data and send the processed data to the next downstream LED package. Such real-time processing may be performed while also providing various bit delays within each LED package.

Abstract: Light-emitting diode (LED) packages and, more particularly, LED packages with transformation and shifting of pulse width modulation (PWM) signals and related methods are disclosed. Discrete LED packages are arranged for cascade communication. Each LED package includes one or more LED chips, and each LED package is separately capable of receiving communication from a data stream, controlling operation of the one or more LED chips, and performing transformation and shifting of received PWM signals. Transformation may include compression and/or decompression of received PWM signals by each LED package to provide increased accessible dynamic range. After transformation, LED packages are capable of shifting transformed values to compensate for turn-on delay of LED chips, thereby reducing light drop-off problems at low intensity levels.

Abstract: Mixed clock domain signaling and, more particularly, mixed clock domain signaling for light-emitting diode (LED) packages arranged for cascade communication is disclosed. Mixed clock domain signaling involves digital communication where time-positions of bit pulse edges in a communication channel are derived from multiple uncorrelated clock domains, including an original clock domain from a master controller and a local clock domain. In the context of LED displays, serial strings of LED packages are arranged as LED pixels to receive cascade communication signals, and the original clock domain is derived from a master controller and a local clock domain is derived at each LED package. By providing for the bit period to be maintained and correlated to the original clock domain throughout the repeated cascade communication, problems associated with multiple uncorrelated clock domains in the communication channel, such as sampling jitter, may be averted, thus avoiding loss of data integrity.