Abstract: Active control of light emitting diodes (LEDs) and LED packages within LED displays is disclosed. LED packages are disclosed that include a plurality of LED chips that form at least one LED pixel for an LED display or an LED panel. Each LED package may include an active electrical element that is configured to receive a control signal and actively maintain an operating state, such as brightness or grey level while other LED packages are being addressed. The control signal may be provided in a data stream that includes a plurality of data packets. Each data packet may include an identifier that enables each LED package of an array that receives the data packet to take one or more actions based on the identifier or a series of identifiers.

Abstract: Active control of light emitting diodes (LEDs) and LED packages within LED displays is disclosed. LED packages are disclosed that include a plurality of LED chips that form at least one LED pixel for an LED display or an LED panel. Each LED package may include an active electrical element that is configured to receive a control signal and actively maintain an operating state, such as brightness or grey level while other LED packages are being addressed. The control signal may be provided in a data stream that includes a plurality of data packets. Each data packet may include an identifier that enables each LED package of an array that receives the data packet to take one or more actions based on the identifier or a series of identifiers.

Abstract: Light-emitting diode (LED) packages and more particularly a light collector for light mixing in LED packages to improve the far field emission pattern (FFP) of the LED packages are disclosed. The LED package can include one or more LED chips with different wavelength ranges, and the light collector placed over the LED chips can have a reflective surface, save for a reduced aperture through which the light from the LED chips can be emitted after mixing in the light collector. The LED package can also include a lens to further improve the FFP. In an embodiment, the light collector can include diffuser material to facilitate the mixing of the light within the light collector. The LED package with the light collector mixes multiple emission point sources into a single point source, or reduced-area source, that considerably improves the FFP of multi-colored LED chips of the LED package.

Abstract: Light-emitting diode (LED) packages, and more particularly to a light collector for light mixing in LED packages to improve the far field emission pattern (FFP) of the LED packages are disclosed. The LED package can include one or more LED chips with different wavelength ranges, and the light collector placed over the LED chips can have a reflective surface, save for a reduced aperture through which the light form the LED chips can be emitted after mixing in the light collector. The LED package can also include a lens to further improve the FFP. In an embodiment the light collector can include diffuser material to facilitate the mixing of the light within the light collector. The LED package with the light collector mixes multiple emission point sources into a single point source, or reduced-area source, that considerably improves the FFP of multi-colored LED chips of the LED package.

Abstract: Synchronization for light emitting diode (LED) pixels in an LED display is provided so that one or more actions of all LED pixels are able to be initiated at the same time, or within a millisecond. LED displays and corresponding systems may include a controller that is configured for sending communication signals to one or more strings of LED pixels. Active electrical elements within each LED pixel may be configured to receive the communication signals, generate corresponding synchronization signals, and respond in a manner that is coordinated with all other LED pixels in a particular LED display. Failure mitigation of LED pixel failures within an LED string is provided where the controller is configured with bidirectional communication ports for communication with the LED string. In a failure mitigation process, the bidirectional communication ports may switch directions to provide communication signals to both sides of an LED string.

Abstract: Synchronization for light emitting diode (LED) pixels in an LED display is provided so that one or more actions of all LED pixels are able to be initiated at the same time, or within a millisecond. LED displays and corresponding systems may include a controller that is configured for sending communication signals to one or more strings of LED pixels. Active electrical elements within each LED pixel may be configured to receive the communication signals, generate corresponding synchronization signals, and respond in a manner that is coordinated with all other LED pixels in a particular LED display. Failure mitigation of LED pixel failures within an LED string is provided where the controller is configured with bidirectional communication ports for communication with the LED string. In a failure mitigation process, the bidirectional communication ports may switch directions to provide communication signals to both sides of an LED string.

Abstract: Light-emitting diode (LED) packages and, more particularly, LED packages with transformation and shifting of pulse width modulation (PWM) signals and related methods are disclosed. Discrete LED packages are arranged for cascade communication. Each LED package includes one or more LED chips, and each LED package is separately capable of receiving communication from a data stream, controlling operation of the one or more LED chips, and performing transformation and shifting of received PWM signals. Transformation may include compression and/or decompression of received PWM signals by each LED package to provide increased accessible dynamic range. After transformation, LED packages are capable of shifting transformed values to compensate for turn-on delay of LED chips, thereby reducing light drop-off problems at low intensity levels.

Abstract: Mixed clock domain signaling and, more particularly, mixed clock domain signaling for light-emitting diode (LED) packages arranged for cascade communication is disclosed. Mixed clock domain signaling involves digital communication where time-positions of bit pulse edges in a communication channel are derived from multiple uncorrelated clock domains, including an original clock domain from a master controller and a local clock domain. In the context of LED displays, serial strings of LED packages are arranged as LED pixels to receive cascade communication signals, and the original clock domain is derived from a master controller and a local clock domain is derived at each LED package. By providing for the bit period to be maintained and correlated to the original clock domain throughout the repeated cascade communication, problems associated with multiple uncorrelated clock domains in the communication channel, such as sampling jitter, may be averted, thus avoiding loss of data integrity.

Abstract: Light-emitting diode (LED) packages and, more particularly, real-time digital communication for LED packages and related methods are disclosed. Discrete LED packages are arranged for cascade communication. Each LED package is separately capable of receiving communication from a data stream, controlling operation of one or more LED chips, and performing real-time processing on at least one alterable data value of the data stream. LED packages may include real-time processors capable of processing data from a data value of the data stream and introducing the processed or altered data back into the data stream in the same data value. LED packages are disclosed that may be assembled together in arrays where each LED package may separately process data and send the processed data to the next downstream LED package. Such real-time processing may be performed while also providing various bit delays within each LED package.

Abstract: Light-emitting diode (LED) packages and, more particularly, LED packages with transformation and shifting of pulse width modulation (PWM) signals and related methods are disclosed. Discrete LED packages are arranged for cascade communication. Each LED package includes one or more LED chips, and each LED package is separately capable of receiving communication from a data stream, controlling operation of the one or more LED chips, and performing transformation and shifting of received PWM signals. Transformation may include compression and/or decompression of received PWM signals by each LED package to provide increased accessible dynamic range. After transformation, LED packages are capable of shifting transformed values to compensate for turn-on delay of LED chips, thereby reducing light drop-off problems at low intensity levels.

Abstract: Mixed clock domain signaling and, more particularly, mixed clock domain signaling for light-emitting diode (LED) packages arranged for cascade communication is disclosed. Mixed clock domain signaling involves digital communication where time-positions of bit pulse edges in a communication channel are derived from multiple uncorrelated clock domains, including an original clock domain from a master controller and a local clock domain. In the context of LED displays, serial strings of LED packages are arranged as LED pixels to receive cascade communication signals, and the original clock domain is derived from a master controller and a local clock domain is derived at each LED package. By providing for the bit period to be maintained and correlated to the original clock domain throughout the repeated cascade communication, problems associated with multiple uncorrelated clock domains in the communication channel, such as sampling jitter, may be averted, thus avoiding loss of data integrity.

Abstract: Light-emitting diode (LED) packages and more particularly error detection in LED packages is disclosed. LED packages are arranged for cascade communication as part of a larger LED display. A separate active electrical element is integrated with each LED package for facilitating active matrix addressing from a data stream, checking input error detection codes, and generating new output error detection codes to the data stream. Each electrical element within each LED package is separately capable of changing one or more portions of received data in the data stream, transmitting the changed data to the next downstream LED package, and generating output error detection codes based on the changed data. When the active electrical element identifies corrupted data based on input error detection codes, the generated output error detection codes may be intentionally corrupted so downstream LED packages will also identify the respective data as being corrupted.

Abstract: Light-emitting devices including solid-state light-emitting devices, light-emitting diode (LED) devices, and LED packages with support elements for improved near-field and far-field emissions are disclosed. LED chips may be mounted to support elements in a manner that directs light through the support elements in desired emission directions. Support elements include optical structures that spread and mix light laterally within the support element. Optical structures include interior mixing chambers bounded by light-altering layers, such as light-diffusing layers or light-reflective layers, that effectively increase internal reflections within the mixing chambers for lateral spreading of light. Support elements as described may be well suited for low profile LED devices where device heights are less than or equal to device widths.

Abstract: Light-emitting devices including solid-state light-emitting devices, light-emitting diode (LED) devices, and LED packages with support elements for improved near-field and far-field emissions are disclosed. LED chips may be mounted to support elements in a manner that directs light through the support elements in desired emission directions. Support elements include optical structures that spread and mix light laterally within the support element. Optical structures include various light-altering layers, such as light-diffusing layers or light-reflective layers, that are arranged to effectively increase internal reflections for lateral spreading of light. Patterned arrangements of light-altering layers include portions that mask direct emissions for LED chips, thereby redistributing emissions laterally to increase near-field and/or far-field uniformity across an increased portion of emitting surfaces.

Abstract: An LED wafer includes LED dies on an LED substrate. The LED wafer and a carrier wafer are joined. The LED wafer that is joined to the carrier wafer is shaped. Wavelength conversion material is applied to the LED wafer that is shaped. Singulation is performed to provide LED dies that are joined to a carrier die. The singulated devices may be mounted in an LED fixture to provide high light output per unit area.

Abstract: An area lamp includes an emitter array and driver circuitry. The emitter array includes a number of solid-state light emitters. Each one of the solid-state light emitters is configured to provide light suitable for general illumination within a field of view such that light emitted from a first subset of the number of solid-state light emitters is provided to a different portion of the field of view than light emitted from a second subset of the number of solid-state light emitters. The driver circuitry is coupled to the emitter array and configured to provide drive signals to the emitter array such that the light provided from each one of the solid-state light emitters is independently controllable and a number of drive signals is less than the number of solid-state light emitters.

Abstract: Active control of light emitting diodes (LEDs) and LED packages within LED displays is disclosed. LED packages are disclosed that include a plurality of LED chips that form at least one LED pixel for an LED display or an LED panel. Each LED package may include an active electrical element that is configured to receive a control signal and actively maintain an operating state, such as brightness or grey level while other LED packages are being addressed. Active electrical elements are disclosed that are configured to provide both forward and reverse bias states to LEDs to detect adverse operating conditions including reverse leakage and deviations to forward voltage levels. LED packages are also disclosed that may self-configure based on the manner in which various input or output lines are connected.

Abstract: Active control of light emitting diodes (LEDs) and LED packages within LED displays is disclosed. LED packages are disclosed that include a plurality of LED chips that form at least one LED pixel for an LED display or an LED panel. Each LED package may include an active electrical element that is configured to receive a control signal and actively maintain an operating state, such as brightness or grey level while other LED packages are being addressed. Active electrical elements are disclosed that are configured to provide both forward and reverse bias states to LEDs to detect adverse operating conditions including reverse leakage and deviations to forward voltage levels. LED packages are also disclosed that may self-configure based on the manner in which various input or output lines are connected.

Abstract: Active control of LEDs, LED packages, and related LED displays by way of pulse wide modulation (PWM) is disclosed. Effective PWM frequencies for LEDs are increased by segmenting duty cycles in which LEDs are electrically activated within individual PWM periods. Segmented duty cycles may be provided by transforming or re-ordering a sequence in which control signals are provided to LEDs. As such, LEDs may be electrically activated and deactivated multiple times within each PWM period. Active electrical elements that are incorporated into one or more LED packages of an LED display may be capable of segmenting the duty cycle within each LED package. Active electrical elements may also be capable of receiving reset signals from a data stream to either initiate a reset action or pass the reset signals along to other active electrical elements of a display.

Abstract: Active control of light emitting diodes (LEDs) and LED packages within LED displays is disclosed. LED packages are disclosed that include a plurality of LED chips that form at least one LED pixel for an LED display. Each LED package may include an active electrical element that is configured to receive a control signal and actively maintain an operating state, such as brightness or grey level while other LED packages are being addressed. Active electrical elements may include active circuitry that includes one or more of a driver device, a signal conditioning or transformation device, a memory device, a decoder device, an electrostatic discharge (ESD) protection device, a thermal management device, and a detection device, among others. In this regard, each LED pixel of an LED display may be configured for operation with active matrix addressing.