Abstract: Solid state lighting components are provided with improved color rendering, improved color uniformity, and improved directional lighting, and that are suitable for use in high output lighting applications and can be used in place of CDMH bulb lighting. Exemplary solid state lighting components include a substrate comprising a light emitter surface and or more light emitters disposed on and/or over the light emitter surface. Exemplary components include a light directing optic and/or a diffusing optic for mixing light. The light directing optic may be disposed at least partially around a perimeter of the light emitter surface. The diffusing optic may be disposed between portions of the light directing optic and spaced apart from the light emitter surface.

Abstract: Active control of light emitting diodes (LEDs) and LED packages within LED displays is disclosed. LED packages are disclosed that include a plurality of LED chips that form at least one LED pixel for an LED display or an LED panel. Each LED package may include an active electrical element that is configured to receive a control signal and actively maintain an operating state, such as brightness or grey level while other LED packages are being addressed. The control signal may be provided in a data stream that includes a plurality of data packets. Each data packet may include an identifier that enables each LED package of an array that receives the data packet to take one or more actions based on the identifier or a series of identifiers.

Abstract: Active control of light emitting diodes (LEDs) and LED packages within LED displays is disclosed. LED packages are disclosed that include a plurality of LED chips that form at least one LED pixel for an LED display. Each LED package may include an active electrical element that is configured to receive a control signal and actively maintain an operating state, such as brightness or grey level while other LED packages are being addressed. Active electrical elements may include active circuitry that includes one or more of a driver device, a signal conditioning or transformation device, a memory device, a decoder device, an electrostatic discharge (ESD) protection device, a thermal management device, and a detection device, among others. In this regard, each LED pixel of an LED display may be configured for operation with active matrix addressing.

Abstract: Active control of light emitting diodes (LEDs) and LED packages within LED displays is disclosed. LED packages are disclosed that include a plurality of LED chips that form at least one LED pixel for an LED display or an LED panel. Each LED package may include an active electrical element that is configured to receive a control signal and actively maintain an operating state, such as brightness or grey level while other LED packages are being addressed. Active electrical elements are disclosed that are configured to provide both forward and reverse bias states to LEDs to detect adverse operating conditions including reverse leakage and deviations to forward voltage levels. LED packages are also disclosed that may self-configure based on the manner in which various input or output lines are connected.

Abstract: Active control of LEDs, LED packages, and related LED displays by way of pulse wide modulation (PWM) is disclosed. Effective PWM frequencies for LEDs are increased by segmenting duty cycles in which LEDs are electrically activated within individual PWM periods. Segmented duty cycles may be provided by transforming or re-ordering a sequence in which control signals are provided to LEDs. As such, LEDs may be electrically activated and deactivated multiple times within each PWM period. Active electrical elements that are incorporated into one or more LED packages of an LED display may be capable of segmenting the duty cycle within each LED package. Active electrical elements may also be capable of receiving reset signals from a data stream to either initiate a reset action or pass the reset signals along to other active electrical elements of a display.

Abstract: A method is disclosed for forming a blended phosphor composition. The method includes the steps of firing precursor compositions that include europium and nitrides of at least calcium, strontium and aluminum, in a refractory metal crucible and in the presence of a gas that precludes the formation of nitride compositions between the nitride starting materials and the refractory metal that forms the crucible. The resulting compositions can include phosphors that convert frequencies in the blue portion of the visible spectrum into frequencies in the red portion of the visible spectrum.

Abstract: Solid-state lighting devices including light-emitting diodes (LEDs) and more particularly LED packages are disclosed. A light-altering material may be provided in particular configurations within an LED package to redirect light toward a primary emission direction. The light-altering material may be arranged on any of a first face, a second face, or a plurality of sidewalls of an LED chip in the LED package. In certain embodiments, a lumiphoric material may be arranged on one or more of the sidewalls. A superstrate may be arranged to mechanically support the LED chip from the first face. The light-altering material may be arranged on or dispersed within the superstrate. In certain embodiments, the primary emission direction of the LED package is substantially parallel to the second face of the LED chip in the LED package. An overall thickness or height of the LED package may be less than or equal to 0.25 mm.

Abstract: An apparatus and associated method for high speed and/or mass transfer of electronic components onto a substrate comprises transferring, using an ejector assembly, electronics components (e.g., light emitting devices) from a die sheet onto an adhesive receiving structure to form a predefined pattern including electronic components thereon, and then transferring the electronic components defining the predefined pattern onto a substrate (e.g., a translucent superstrate) for light emission therethrough to create a high-density (e.g., high resolution) display device utilizing, for example, mini- or micro-LED display technologies.

Abstract: Solid state lighting components are provided with improved color rendering, improved color uniformity, and improved directional lighting, and that are suitable for use in high output lighting applications and can be used in place of CDMH bulb lighting. Exemplary solid state lighting components include a substrate comprising a light emitter surface and or more light emitters disposed on and/or over the light emitter surface. Exemplary components include a light directing optic and/or a diffusing optic for mixing light. The light directing optic may be disposed at least partially around a perimeter of the light emitter surface. The diffusing optic may be disposed between portions of the light directing optic and spaced apart from the light emitter surface.

Abstract: Light emitting diode (LED) packages and LED displays utilizing the LED packages are disclosed. LED packages can have a plurality of cavities with each having one or more LEDs. The LEDs can be individually controllable so that the LED package emits the desired color combination of light from the package. The LED packages are arranged with an encapsulant over the cavities that shape the LED package emission to a wide angle or pitch. Some of the LED packages can have three cavities, while others can have four or more cavities. The packages can comprise an encapsulant that forms lenses over the cavities and continues beyond the cavities to cover surfaces of the LED package body. The body can include different anchoring features to improve package reliability by anchoring the encapsulant to the body. One embodiment of an LED display according to the present invention comprises a plurality of LED packages, at least some having a plurality of cavities.

Abstract: Solid-state lighting devices including light-emitting diodes (LEDs) and more particularly LED packages are disclosed. A light-altering material may be provided in particular configurations within an LED package to redirect light toward a primary emission direction. The light-altering material may be arranged on any of a first face, a second face, or a plurality of sidewalls of an LED chip in the LED package. In certain embodiments, a lumiphoric material may be arranged on one or more of the sidewalls. A superstrate may be arranged to mechanically support the LED chip from the first face. The light-altering material may be arranged on or dispersed within the superstrate. In certain embodiments, the primary emission direction of the LED package is substantially parallel to the second face of the LED chip in the LED package. An overall thickness or height of the LED package may be less than or equal to 0.25 mm.

Abstract: Solid-state lighting devices including light-emitting diodes (LEDs) and more particularly LED packages are disclosed. A light-altering material may be provided in particular configurations within an LED package to redirect light toward a primary emission direction. The light-altering material may be arranged on any of a first face, a second face, or a plurality of sidewalls of an LED chip in the LED package. In certain embodiments, a lumiphoric material may be arranged on one or more of the sidewalls. A superstrate may be arranged to mechanically support the LED chip from the first face. The light-altering material may be arranged on or dispersed within the superstrate. In certain embodiments, the primary emission direction of the LED package is substantially parallel to the second face of the LED chip in the LED package. An overall thickness or height of the LED package may be less than or equal to 0.25 mm.

Abstract: Light emitting diode (LED) packages and LED displays utilizing the LED packages are disclosed. LED packages can have a cavity with emitters arranged in close proximity to approximate a point light source, with each of the packages emitting a color combination of light from the emitters. The LED packages are arranged with an encapsulant or lens over the cavity that shapes the LED package emission to a wide angle or pitch. One embodiment of an LED package according to the present invention comprises a cavity with a plurality LEDs. The LED package also comprises a lens over the cavity to shape the emission of the LEDs to a wider angle along an axis compared to emission of the LEDs without the lens. The LEDs are individually controllable, with the LED package emitting different color combinations of emission from the LEDs. One embodiment of an LED display according to the present invention comprises a plurality of LED packages, at least some having a cavity with a plurality of LEDs.

Abstract: An adaptive electrical routing system for constructing an LED device. The system takes into account placement errors and tolerance regions for connection of one or more LEDs on a substrate. An optical device captures an image (e.g., comprising positional data of components of the LED device) of the LED device showing the actual placement of LEDs on the substrate and transfers the image to an analysis program. A customized pattern (e.g., a customized electrical routing pattern) can be created in one of several possible ways.

Abstract: An apparatus and associated method for high speed and/or mass transfer of electronic components onto a substrate comprises transferring, using an ejector assembly, electronics components (e.g., light emitting devices) from a die sheet onto an adhesive receiving structure to form a predefined pattern including electronic components thereon, and then transferring the electronic components defining the predefined pattern onto a substrate (e.g., a translucent superstrate) for light emission therethrough to create a high-density (e.g., high resolution) display device utilizing, for example, mini- or micro-LED display technologies.

Abstract: Solid-state lighting devices, for example, light-emitting diodes (LEDs), which include a primary light-extraction face and a secondary light-extraction face that generally opposes the primary light-extraction face are disclosed. In some embodiments, mirrors internal to the LED may be omitted, and omnidirectional light from the active region is allowed to freely exit the primary light-extraction face and the secondary light-extraction face. In other embodiments, the first light-extraction face and second light-extraction face include opposing sidewalls of an LED. In such embodiments, mirrors internal to the LED may be utilized to direct omnidirectional light from the active region toward the first light-extraction face and the second light-extraction face.

Abstract: Light emitting diode (LED) devices and systems include a superstrate (e.g., a light-transmissive layer), at least one region of wavelength-conversion material in the light-transmissive layer, and LEDs attached to the superstrate at the location of the wavelength-conversion material. An encapsulant layer is formed over and/or around the LEDs with an opaque or clear material. Additional color filter layers are optionally applied to the light-transmissive layer. A method for producing LED devices and systems includes providing a superstrate with a wavelength-conversion material region formed therein, attaching LEDs to the superstrate at the die-attach layer, forming conductive surfaces on a side of the LED opposite the die-attach layer, dispensing an encapsulant layer to at least partially encapsulate the LEDs, and forming one or more electrical traces to electrically interconnect the conductive surfaces of at least some of the LEDs with each other.

Abstract: Light emitter packages, components, and related methods for providing improved chemical resistance are provided herein. In one aspect, a component of a light emitter package is provided. The component can include a base material, a silver (Ag) containing material at least partially disposed over the base material, and a portion of phenyl containing silicone encapsulant at least partially disposed over the Ag portion. The component can be incorporated within a surface mount device (SMD) type light emitter package.

Abstract: Light emitting diode (LED) devices, methods and systems are provided. An example apparatus can include an underfill layer separate from a bonding layer. The apparatus can further include a dark encapsulating layer comprising an epoxy-molded compound which is applied using a powder-coating process. A method for providing a powder-coated encapsulation and for producing an LED panel with such an encapsulant is disclosed.

Abstract: Solid-state lighting devices, for example, light-emitting diodes (LEDs), which include a primary light-extraction face and a secondary light-extraction face that generally opposes the primary light-extraction face are disclosed. In some embodiments, mirrors internal to the LED may be omitted, and omnidirectional light from the active region is allowed to freely exit the primary light-extraction face and the secondary light-extraction face. In other embodiments, the first light-extraction face and second light-extraction face include opposing sidewalls of an LED. In such embodiments, mirrors internal to the LED may be utilized to direct omnidirectional light from the active region toward the first light-extraction face and the second light-extraction face.