Abstract: Devices, components and methods containing one or more light emitter devices, such as light emitting diodes (LEDs) or LED chips, are disclosed. In one aspect, a light emitter device component can include a ceramic body having a top surface, one or more light emitter devices mounted directly or indirectly on the top surface, and one or more electrical components mounted on the top surface and electrically coupled to the one or more light emitter devices, wherein the one or more electrical components can be spaced from the ceramic body by one or more non-metallic layers. Components disclosed herein can result in improved light extraction and thermal management.

Abstract: Submount based surface mount design (SMD) light emitter components and related methods are disclosed. In some aspects, light emitter components can include a submount with a first side having a first surface area, first and second electrical contacts disposed on the first side of the submount, and at least one light emitter chip on the first side. In some aspects, the electrical contact area can be less than half of the first surface area of the first side of the submount. Components disclosed herein can include low profile parts or domes where a ratio between a dome height and a dome width is less than 0.5. A method of providing components can include providing a panel of material and LED chips, dispensing a liquid encapsulant material over the panel, and singulating the panel into individual submount based components after the encapsulant material has hardened.

Abstract: An LED wafer includes LED dies on an LED substrate. The LED wafer and a carrier wafer are joined. The LED wafer that is joined to the carrier wafer is shaped. Wavelength conversion material is applied to the LED wafer that is shaped. Singulation is performed to provide LED dies that are joined to a carrier die. The singulated devices may be mounted in an LED fixture to provide high light output per unit area.

Abstract: An LED wafer includes LED dies on an LED substrate. The LED wafer and a carrier wafer are joined. The LED wafer that is joined to the carrier wafer is shaped. Wavelength conversion material is applied to the LED wafer that is shaped. Singulation is performed to provide LED dies that are joined to a carrier die. The singulated devices may be mounted in an LED fixture to provide high light output per unit area.

Abstract: Light emitting devices and substrates are provided with improved plating. In one embodiment, a light emitting device can include a submount and one or more light emitting diodes (LED) chips disposed over the submount. In one embodiment, the submount can include a copper (Cu) substrate, a first metallic layer of material that is highly reflective disposed over the Cu substrate for increased brightness of the device, and a second metallic layer disposed between the Cu substrate and the first metallic layer for forming a barrier therebetween.

Abstract: Light emitter device packages, modules and methods are disclosed having a body and a cavity that can be formed from a single substrate of material. The material can be thermally conductive and/or metallic. A light emitter device package can have at least one isolating layer creating at least a first isolated portion of the body and/or first isolated portion of the cavity. The isolating layer can be formed from the same material as the single substrate which forms the package body and cavity, and can be a layer which is thermally and electrically isolated. A light emitter or light emitter device, such as an LED chip can be mounted upon a surface of the cavity and upon at least a portion of the isolating layer.

Abstract: Solid state lighting apparatuses and related methods are described. In some aspects, a solid state lighting apparatus includes a substrate. The substrate includes a non-metallic body having a first surface and one or more electrical components supported on the first surface of the substrate. At least one electrical component is spaced from the non-metallic body by one or more non-metallic layers. The apparatus can also include an array of solid state light emitters supported by the first surface of the substrate and electrically coupled to the one or more electrical components thereof. The apparatus can further include a receiver supported by the first surface of the substrate, wherein the receiver is adapted to receive alternating current (AC) directly from an AC power source. Related systems and methods are also disclosed.

Abstract: A lamp has an optically transmissive enclosure and a base. A tower extends from the base into the enclosure and supports an LED assembly in the enclosure. The LED assembly comprises a plurality of LEDs operable to emit light when energized through an electrical path from the base. The tower and the LED assembly are arranged such that the plurality of LEDs are disposed about the periphery of the tower in a band and face outwardly toward the enclosure to create a source of the light that appears as a glowing filament. The tower forms part of a heat sink that transmits heat from the LED assembly to the ambient environment. The LED assembly has a three-dimensional shape. An electrical interconnect connects a conductor to the heat sink where the conductor is in the electrical path between the LED assembly and the base.

Abstract: A method is disclosed for forming a blended phosphor composition. The method includes the steps of firing precursor compositions that include europium and nitrides of at least calcium, strontium and aluminum, in a refractory metal crucible and in the presence of a gas that precludes the formation of nitride compositions between the nitride starting materials and the refractory metal that forms the crucible. The resulting compositions can include phosphors that convert frequencies in the blue portion of the visible spectrum into frequencies in the red portion of the visible spectrum.

Abstract: Light emitter devices with improved light extraction and related methods are disclosed. In one embodiment, the light emitter device can include a submount, at least one light emitting chip disposed over the submount, and a lens disposed over the light emitting chip. The lens can include a lens base that can have substantially the same geometry as a geometry of the submount.

Abstract: Solid state lighting components are provided with improved color rendering, improved color uniformity, and improved directional lighting, and that are suitable for use in high output lighting applications and can be used in place of CDMH bulb lighting. Exemplary solid state lighting components include a substrate comprising a light emitter surface and or more light emitters disposed on and/or over the light emitter surface. Exemplary components include a light directing optic and/or a diffusing optic for mixing light. The light directing optic may be disposed at least partially around a perimeter of the light emitter surface. The diffusing optic may be disposed between portions of the light directing optic and spaced apart from the light emitter surface.

Abstract: Solid state lighting apparatuses, systems, and related methods are provided. An example apparatus can include one or more light emitting diodes (LEDs) and a dark or black encapsulation layer surrounding and/or disposed between the one or more LEDs. The apparatus can include, e.g., a substrate or a leadframe for mounting the LEDs. A method for producing a panel of LEDs can include joining the LEDs to the panel, e.g., by bump bonding, and flooding the panel with dark or black encapsulation material so that the LED chips are surrounded by the dark or black encapsulation material.

Abstract: Light emitter devices and methods are provided herein. In some aspects, emitter devices and methods provided herein are for light emitting diode (LED) chips, and can include providing a substrate and a plurality of LED chips over the substrate. The devices and methods described herein can further include providing a plurality of integral lenses over the LED chips, where at least some of the lenses can be distorted. In some aspects, the distorted lenses can be compressed towards each other along one or more directions.

Abstract: A method is disclosed for forming a blended phosphor composition. The method includes the steps of firing precursor compositions that include europium and nitrides of at least calcium, strontium and aluminum, in a refractory metal crucible and in the presence of a gas that precludes the formation of nitride compositions between the nitride starting materials and the refractory metal that forms the crucible. The resulting compositions can include phosphors that convert frequencies in the blue portion of the visible spectrum into frequencies in the red portion of the visible spectrum.

Abstract: Light emitter devices, such as light emitting diode (LED) devices and related methods are disclosed. A light emitter device includes a ceramic based substrate, at least one LED chip disposed on the substrate, and a filling material. The ceramic substrate can include one or more surface features. The filling material can be disposed over and/or within a portion of the one or more surface features. Surface features can include one or more pedestals, trenches, holes, indentions, depressions, waves, and/or convexly or concavely curved surfaces. Surface features can improve optics of the LED device, for example, improving brightness, reflection, and/or light extraction associated with the device. Related methods are disclosed.

Abstract: A lamp has an optically transmissive enclosure and a base. A tower extends from the base into the enclosure and supports an LED assembly in the enclosure. The LED assembly comprises a plurality of LEDs operable to emit light when energized through an electrical path from the base. The tower and the LED assembly are arranged such that the plurality of LEDs are disposed about the periphery of the tower in a band and face outwardly toward the enclosure to create a source of the light that appears as a glowing filament. The tower forms part of a heat sink that transmits heat from the LED assembly to the ambient environment. The LED assembly has a three-dimensional shape. An electrical interconnect connects a conductor to the heat sink where the conductor is in the electrical path between the LED assembly and the base.

Abstract: A gas cooled LED lamp and submount is disclosed. The centralized nature of the LEDs allows the LEDs to be configured near the central portion of the optical envelope of the lamp. In some embodiments, the LEDs can be mounted on or fixed to a light transmissive submount. In some embodiments, LEDs can be disposed on both sides of a two-sided submount, or on thee or more sides if the submount structure includes three or more mounting surfaces. In example embodiments, the LEDs can be cooled and/or cushioned by a gas in thermal communication with the LED array to enable the LEDs to maintain an appropriate operating temperature for efficient operation and long life. In some embodiments, the gas is at a pressure of from about 0.5 to about 10 atmospheres and has a thermal conductivity of at least about 60 mW/m-K.

Abstract: A lamp has an optically transmissive enclosure and a base defining a longitudinal axis of the lamp extending from the base to the free end of the enclosure. A heat sink is at least partially located in the enclosure and includes a tower that extends along the longitudinal axis of the lamp. An LED assembly is positioned in the optically transmissive enclosure. The LED assembly comprises a lead frame circuit or a flex circuit where LEDs are attached to the circuits. The lead frame and flex circuit are formed into a three-dimensional shape and are thermally coupled to the tower.

Abstract: Solid state lighting apparatuses, systems, and related methods are described. A solid state lighting apparatus includes an array of solid state light emitters arranged on or over the substrate and a plurality of driving components arranged on or over the substrate. The driving components are configured to independently activate and deactivate at least some of the solid state light emitters of the array of solid state light emitters during a portion of an alternating current (AC) cycle. A method of providing a solid state lighting apparatus includes providing a substrate, mounting an array of solid state light emitters on or over the substrate, and providing a plurality of driving components on or over the substrate. A solid state lighting system includes a solid state lighting apparatus having an array of solid state light emitters, driving components, and a rectifying circuit for rectifying current supplied to the driving components.

Abstract: Solid state lighting apparatuses, systems, and related methods for improved heat distribution are described. A solid state lighting apparatus can include a substrate and an array of solid state light emitters of varying power arranged on or over the substrate, wherein a predetermined group of the solid state light emitters includes solid state light emitters non-uniformly spaced apart from one another. A method of providing a solid stare lighting apparatus can include providing a substrate, and mounting an array of solid state light emitters of varying power on or over the substrate such that a predetermined group of the solid state light emitters includes solid state light emitters non-uniformly spaced apart from one another.