Patents by Inventor Chu Weibing

Chu Weibing has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Surface mount package
    Publication number: 20030062601
    Abstract: Space-efficient packaging of microelectronic devices permits greater functionality per unit PC board surface area. In certain embodiments, packages having leads of a reverse gull wing shape reduce peripheral footprint area occupied by the leads, thereby permitting maximum space in the package footprint to be allocated to the package body and to the enclosed die. Embodiments of packages in accordance with the present invention may also reduce the package vertical profile by featuring recesses for receiving lead feet ends, thereby reducing clearance between the package bottom and the PC board. Providing a linear lead foot underlying the package and slightly inclined relative to the PC board further reduces vertical package profile by eliminating additional clearance associated with radiuses of curvature of J-shaped leads.
    Type: Application
    Filed: June 29, 2001
    Publication date: April 3, 2003
    Inventors: James Harnden, Richard K. Williams, Anthony Chia, Chu Weibing
  • Surface mount package
    Patent number: D461170
    Type: Grant
    Filed: May 15, 2001
    Date of Patent: August 6, 2002
    Assignee: GEM Services, Inc.
    Inventors: Richard Williams, James Harnden, Anthony Chia, Chu Weibing
  • Surface mount package
    Patent number: D461459
    Type: Grant
    Filed: July 17, 2001
    Date of Patent: August 13, 2002
    Assignee: GEM Services, Inc.
    Inventors: James Harnden, Richard Williams, Anthony Chia, Chu Weibing
  • Surface mount package
    Patent number: D461783
    Type: Grant
    Filed: June 8, 2001
    Date of Patent: August 20, 2002
    Assignee: Gem Services, Inc.
    Inventors: Richard K. Williams, James Harnden, Anthony Chia, Chu Weibing
  • Surface mount package
    Patent number: D461784
    Type: Grant
    Filed: July 17, 2001
    Date of Patent: August 20, 2002
    Assignee: GEM Services, Inc.
    Inventors: James Harnden, Richard K. Williams, Anthony Chia, Chu Weibing
  • Surface mount package
    Patent number: D462062
    Type: Grant
    Filed: May 18, 2001
    Date of Patent: August 27, 2002
    Assignee: GEM Services, Inc.
    Inventors: Richard K. Williams, James Harnden, Anthony Chia, Chu Weibing
  • Leadframe matrix for a surface mount package
    Patent number: D465207
    Type: Grant
    Filed: June 8, 2001
    Date of Patent: November 5, 2002
    Assignee: GEM Services, Inc.
    Inventors: Richard K. Williams, James Harnden, Anthony Chia, Chu Weibing
  • Surface mount package
    Patent number: D467231
    Type: Grant
    Filed: July 17, 2001
    Date of Patent: December 17, 2002
    Assignee: GEM Services, Inc.
    Inventors: James Harnden, Richard K. Williams, Anthony Chia, Chu Weibing
  • Surface mount package
    Patent number: D467560
    Type: Grant
    Filed: July 17, 2001
    Date of Patent: December 24, 2002
    Assignee: GEM Services, Inc.
    Inventors: James Harnden, Richard Williams, Anthony Chia, Chu Weibing
  • Surface mount package
    Patent number: D467884
    Type: Grant
    Filed: May 15, 2001
    Date of Patent: December 31, 2002
    Assignee: GEM Services, Inc.
    Inventors: Richard Williams, James Harnden, Anthony Chia, Chu Weibing
  • Surface mount package
    Patent number: D467885
    Type: Grant
    Filed: July 18, 2001
    Date of Patent: December 31, 2002
    Assignee: GEM Services, Inc.
    Inventors: James Harnden, Richard K. Williams, Anthony Chia, Chu Weibing
  • Surface mount package
    Patent number: D471165
    Type: Grant
    Filed: May 15, 2001
    Date of Patent: March 4, 2003
    Assignee: GEM Services, Inc.
    Inventors: Richard K. Williams, James Harnden, Anthony Chia, Chu Weibing
  • Portion of a matrix for surface mount package leadframe
    Patent number: D483336
    Type: Grant
    Filed: November 15, 2002
    Date of Patent: December 9, 2003
    Assignee: GEM Services, Inc.
    Inventors: James Harnden, Richard K. Williams, Anthony Chia, Chu Weibing
  • Portion of a matrix for surface mount package leadframe
    Patent number: D483337
    Type: Grant
    Filed: November 25, 2002
    Date of Patent: December 9, 2003
    Assignee: GEM Services, Inc.
    Inventors: James Harnden, Richard K. Williams, Anthony Chia, Chu Weibing
  • Portion of a matrix for surface mount package leadframe
    Patent number: D484103
    Type: Grant
    Filed: November 15, 2002
    Date of Patent: December 23, 2003
    Assignee: GEM Services, Inc.
    Inventors: James Harnden, Richard K. Williams, Anthony Chia, Chu Weibing
  • Portion of a matrix for surface mount package leadframe
    Patent number: D484104
    Type: Grant
    Filed: November 25, 2002
    Date of Patent: December 23, 2003
    Assignee: GEM Services, Inc.
    Inventors: James Harnden, Richard K. Williams, Anthony Chia, Chu Weibing
  • Portion of a matrix for surface mount package leadframe
    Patent number: D484858
    Type: Grant
    Filed: November 15, 2002
    Date of Patent: January 6, 2004
    Assignee: GEM Services, Inc.
    Inventors: James Harnden, Richard K. Williams, Anthony Chia, Chu Weibing
  • Portion of a matrix for surface mount package leadframe
    Patent number: D484859
    Type: Grant
    Filed: February 7, 2003
    Date of Patent: January 6, 2004
    Assignee: GEM Services, Inc.
    Inventors: James Harnden, Richard K. Williams, Anthony Chia, Chu Weibing
  • Portion of a matrix for surface mount package leadframe
    Patent number: D485243
    Type: Grant
    Filed: October 22, 2002
    Date of Patent: January 13, 2004
    Assignee: GEM Services, Inc.
    Inventors: James Harnden, Richard K. Williams, Anthony Chia, Chu Weibing
  • Portion of a matrix for surface mount package leadframe
    Patent number: D485244
    Type: Grant
    Filed: December 17, 2002
    Date of Patent: January 13, 2004
    Assignee: GEM Services, Inc.
    Inventors: James Harnden, Richard K. Williams, Anthony Chia, Chu Weibing