Portion of a matrix for surface mount package leadframe

- GEM Services, Inc.
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Description

FIG. 1 is a top plan view of a portion of a matrix for surface mount package leadframes showing my new design;

FIG. 2 is a top plan view of an enlarged fragment of the portion of a matrix for surface mount package leadframe; and,

FIG. 3 is a perspective view of a matrix for surface mount package leadframes showing my new design.

Claims

The ornamental design for a portion of a matrix for surface mount package leadframe, as shown and described.

Referenced Cited
U.S. Patent Documents
4118859 October 10, 1978 Busler
4234666 November 18, 1980 Gursky
4298883 November 3, 1981 Komatsu et al.
4633582 January 6, 1987 Ching et al.
4809054 February 28, 1989 Waldner
4818960 April 4, 1989 Satoh et al.
4852250 August 1, 1989 Andrews
4865193 September 12, 1989 Shimamoto et al.
5115299 May 19, 1992 Wright
5554886 September 10, 1996 Song
5900582 May 4, 1999 Tomita et al.
6016918 January 25, 2000 Ziberna
D465207 November 5, 2002 Williams et al.
Patent History
Patent number: D483336
Type: Grant
Filed: Nov 15, 2002
Date of Patent: Dec 9, 2003
Assignee: GEM Services, Inc. (San Jose, CA)
Inventors: James Harnden (Hollister, CA), Richard K. Williams (Cupertino, CA), Anthony Chia (Singapore), Chu Weibing (Shanghai)
Primary Examiner: Philip S. Hyder
Assistant Examiner: Selina Sikder
Attorney, Agent or Law Firm: Townsend and Townsend and Crew LLP
Application Number: 29/171,086
Classifications
Current U.S. Class: Semiconductor, Transistor Or Integrated Circuit (24) (D13/182)
International Classification: 1303;