Abstract: A display device including a substrate, a cholesteric liquid crystal layer, and a transparent electrode layer that are sequentially stacked is provided. The cholesteric liquid crystal layer includes cholesteric liquid crystal molecules and a plurality of transparent photoresist structures. Each of the transparent photoresist structures is a closed structure, and the cholesteric liquid crystal molecules are respectively accommodated in a plurality of patterned areas respectively surrounded by the transparent photoresist structures, so as to form a plurality of cholesteric liquid crystal patterns. The transparent electrode layer includes a plurality of sub-electrodes. The cholesteric liquid crystal patterns are respectively driven by the sub-electrodes. An orthogonal projection of each of the transparent photoresist structures on the substrate falls in an orthogonal projection of a corresponding sub-electrode of the sub-electrodes on the substrate.

Abstract: A semiconductor power device includes a ceramic-metal composite circuit substrate, a flip chip and a metal thermal-conducting layer. The ceramic-metal composite circuit substrate includes first electric-conducting metal pads and a first thermal-conducting metal pad. The first thermal-conducting metal pad is not electrically connected to the first electric-conducting metal pads. The flip chip includes electric-conducting pads and a floating thermal-conducting metal pad. The electric-conducting pads are electrically connected to the first electric-conducting metal pads. The floating thermal-conducting metal pad is not electrically connected to the electric-conducting pads. The metal thermal-conducting layer is disposed on the flip chip.

Abstract: A chip package structure is provided. The chip package structure includes a chip. The chip package structure includes a conductive ring-like structure over and electrically insulated from the chip. The conductive ring-like structure surrounds a central region of the chip. The chip package structure includes a first solder structure over the conductive ring-like structure. The first solder structure and the conductive ring-like structure are made of different materials.

Abstract: The present invention provides a supporting hook structure, comprising a sleeve, a fixing rod, a first limit unit, a hook and a fixing device. The fixing rod is connected to the side surface of the sleeve. The hook body is connected to one end of the sleeve. The first limit unit is arranged on the side surface of the sleeve and adjacent to the hook body. The first limit unit makes the hook body rotates with the axis direction of the sleeve as a rotation axis. The fixing device is connected to the other end of the sleeve to fix the rotating position of the hook body. Through the above, the hook part enters the proximal thigh from a surgical entrance and the hook part rotates to make the hook part abut against the proximal femur to complete the positioning and fixation of the femur hook structure to the femur.

Abstract: A fluid delivery apparatus comprises a first piston body, a second piston body, a fluid delivery pipe, and a sealing element. The first piston body has a first through hole, a first connecting portion, an accommodation space and a buffer space. The second piston body has a second through hole and a second connecting portion disposed inside the accommodation space. The fluid delivery pipe is accommodated in the first through hole and the second through hole, and movable between a first position and a second position. The sealing element encircles the fluid delivery pipe. When the fluid delivery pipe is at the first position, the sealing element is accommodated in the accommodation space. When the fluid delivery pipe is at the second position, a first part of the sealing element is accommodated in the accommodation space, and a second part of the sealing element is accommodated in the buffer space.

Abstract: A compound of Formula (I) below, or a pharmaceutically acceptable salt, stereoisomer, solvate, or prodrug thereof: in which R1, R2, R3, R5, R6, and R7 are defined as in the SUMMARY section. Further disclosed are a method of using the above-described compound, salt, stereoisomer, solvate, or prodrug for treating microbial infections and a pharmaceutical composition containing the same.

Abstract: The present invention discloses an integrated choke assembly comprising: a base having a main body structure, a first protruding part and a second protruding part. A first choke has a first magnetic core and a first winding, wherein the first protruding part is arranged through the first opening of the first magnetic core so that the first choke is arranged on the upper surface of the main body structure, and the first winding is wound on the first magnetic core. A second choke has a second magnetic core and a second winding, wherein the second protruding part is arranged through the second opening of the second magnetic core so that the second choke is arranged on the lower surface of the main body structure, and the second winding is wound on the second magnetic core.

Abstract: Disclosed herein is related to a method for treating a symptom associated with senescence in a subject by administering to the subject with an effective amount of corylin and/or neobavaisoflavone, wherein the symptom associated with senescence is loss of muscle strength, muscle weakness, loss of motor coordination, loss of balance, skin wrinkle, or a poor blood biochemical parameter.

Abstract: The present disclosure provides a chemical supply system, including a chamber, a tubing extending into the chamber, an interlock apparatus, including a fixture for fastening the tubing, and means for determining whether the tubing is fastened by the fixture.

Abstract: An intelligent exercise intensity assessing system includes an exercise testing machine, a physiological information sensor, a signal transmitter connected with the physiological information sensor, a central control host connected with the signal transmitter, and a cloud database connected with the central control host. The physiological information sensor senses physiological information of an exerciser before and after the exerciser operates the exercise testing machine. The physiological information is transmitted by the signal transmitter to the central control host, and transmitted by the central control host to the cloud database. The cloud database analyzes the physiological information to obtain a corresponding forecasted watt value, and obtains a resistance level of different fitness apparatuses according to the forecasted watt value.

Abstract: An exercise intensity assessing system includes a physiological information sensor, a signal transmitter connected with the physiological information sensor, a central control host connected with the signal transmitter, and a cloud database connected with the central control host. The physiological information sensor senses physiological information of an exerciser before and after the exerciser exercises. The physiological information is transmitted by the signal transmitter to the central control host, and transmitted by the central control host to the cloud database for being diagnosed and analyzed by a fitness instructor. The cloud database obtains a forecasted watt value corresponding to the physiological information, and obtains a resistance level of different fitness apparatuses according to the forecasted watt value.

Abstract: A semiconductor memory device includes a bottom electrode, a magnetic tunnel junction (MTJ) structure disposed over the bottom electrode, a seed layer disposed between the MTJ structure and the bottom electrode, and a non-magnetic amorphous insertion layer disposed between the seed layer and the bottom electrode.

Abstract: A power converter having a multi-slope compensation mechanism is provided. A multi-slope compensation circuit of the power converter includes a plurality of first capacitors, a comparator and a plurality of first resistors. A first terminal of each of the plurality of first capacitors and a node between a second terminal of a high-side switch and a first terminal of a low-side switch are connected to an inductor. A plurality of first input terminals of a comparator are respectively connected to second terminals of the plurality of first capacitors, and are respectively connected to first terminals of the plurality of first resistors. Second terminals of the plurality of first resistors are coupled to a second reference voltage. A second input terminal of the comparator is coupled to a first reference voltage. An output terminal of the comparator is connected to an input terminal of a driver circuit.

Abstract: A light source module includes a circuit substrate, a plurality of light-emitting diodes, a cover layer and a plurality of first scattering particles. The plurality of light-emitting diodes is disposed on the circuit substrate. The cover layer covers the plurality of light-emitting diodes, and an upper surface of the cover layer has a plurality of recesses, wherein orthogonal projections of the plurality of recesses on the circuit substrate overlap the circuit substrate between the plurality of light-emitting diodes. The plurality of first scattering particles is located in the plurality of recesses.

Abstract: A light source module includes a circuit substrate, a plurality of light-emitting diodes, a cover layer and a plurality of first scattering particles. The plurality of light-emitting diodes is disposed on the circuit substrate. The cover layer covers the plurality of light-emitting diodes, and an upper surface of the cover layer has a plurality of recesses, wherein orthogonal projections of the plurality of recesses on the circuit substrate overlap the circuit substrate between the plurality of light-emitting diodes. The plurality of first scattering particles is located in the plurality of recesses.

Abstract: An optical transceiver module includes a first housing, a second housing, an engagement component, a conductive body, and a circuit board. The first housing has a first sidewall and a first groove. The first groove is closer to a central line of a major axis of the first housing than the first sidewall. The second housing is assembled with the first housing. The second housing has a second sidewall. The second sidewall is extended into the first groove. The engagement component has a first engagement portion. The first engagement portion is extended between the first sidewall and the second sidewall. The conductive body is disposed between the first groove and the second sidewall. The circuit board is disposed between the first housing and the second housing to perform photoelectric conversion. Therefore, the stroke of the engagement component can be fixed, and the electromagnetic interference can be reduced.

Abstract: A glitch-free low-pass filter circuit includes an integrating circuit, a Schmitt trigger, a first feedback logic circuit and a second feedback logic circuit. The integrating circuit is used to integrate an input signal to generate an integral signal. The Schmitt trigger is used to receive the integral signal to generate a hysteresis signal. The first feedback logic circuit is used to pull the integral signal to a reset voltage or up to the set voltage based on an inverted input signal and an inverted hysteresis signal, wherein the inverted input signal and the inverted hysteresis signal are generated by performing an inversion process. The second feedback logic circuit is used to pull the integral signal down to the reset voltage or up to the set voltage based on the inverted hysteresis signal and an output signal, wherein the output signal is generated by performing the inversion process twice.

Abstract: A device includes a first III-V compound layer, a second III-V compound layer, a dielectric layer, a contact, a metal-containing layer, and a metal contact. The second III-V compound layer is over the first III-V compound layer. The dielectric layer is over the second III-V compound layer. The contact extends through the dielectric layer to the second III-V compound layer. The contact is in contact with a top surface of the dielectric layer and an inner sidewall of the dielectric layer. The metal-containing layer is over and in contact with the contact, and a portion of the metal-containing layer is directly above the dielectric layer. The metal contact is over and in contact with the metal-containing layer.

Abstract: A semiconductor component is provided in the present invention. The semiconductor component includes a substrate, a semiconductor working layer disposed on the substrate, an insulating layer disposed on an upper surface of the semiconductor working layer, plural conducting electrodes, and at least a metal layer floated on the upper surface of the semiconductor working layer and within the insulating layer. The conducting electrodes include plural working electrodes disposed within the insulating layer and plural connecting electrodes disposed over the upper surface of the semiconductor working layer. By floating the at least a metal layer on the semiconductor working layer and controlling occupied area of the metal layer and the conducting electrodes on the upper surface of the semiconductor working layer, heat dissipation performance of the semiconductor component can be effectively increased.

Abstract: A power chip package and a power module are provided. The power chip package includes a metal cover, a power chip, and a thermal conductive material. A recess is formed on a side surface of the metal cover. The power chip is bonded on the metal cover and is located in the recess. The thermal conductive material fills the recess and surrounds the power chip. At least one first electrode of the power chip is exposed out of the thermal conductive material. The power module includes a circuit board, plural power chip packages and a polymeric resin. The power chip packages are disposed on the circuit board. The polymeric resin packages the power chip packages on the circuit board.