Abstract: A manufacturing method of an active layer of a thin film transistor is provided. The method includes following steps. First a substrate is provided, and a semiconductor precursor solution is then prepared through a liquid process. Thereafter, the semiconductor precursor solution is provided on the substrate to form a semiconductor precursor thin film. After that, a light source is used to irradiate the semiconductor precursor thin film to remove residual solvent and allow the semiconductor precursor thin film to produce semiconductor property, so as to form a semiconductor active layer.

Abstract: A method of fabricating an active layer thin film by a metal-chalcogenide precursor solution is provided, including the steps of: synthesizing a metal-chalcogenide precursor containing benzyl or benzyl derivative; dissolving the precursor in a solvent to produce a precursor solution, wherein a chalcogen element or compound can be added to the precursor solution to adjust the molar ratio of metal ion to chalcogen; and then applying the precursor solution onto a substrate in a specific coating manner, to form a film of the metal-chalcogenide after a curing process.

Abstract: A direct patterning method for manufacturing a metal layer of a semiconductor device is provided. The claimed method reduces the materials and hours required by prior methods such as the thin film depositing method for a substrate, and the photolithographic method for manufacturing a transistor. The preferred embodiment of the present invention comprises a step of defining the pattern of the seeder material and a step of selectively thin film deposition. The direct patterned technology for the seeder and a chemical bath deposition (CBD) are utilized to provide the thin film growing method with non-vacuum and selective deposition. The object of the invention is applied to produce the wire or electrode, within the semiconductor device, or to deposit and manufacture the thin film in the large-area transistor array or a reflective layer.

Abstract: A memory card is provided. The memory card comprises a substrate, a plurality of electronic package devices, a molding compound and a plastic forming material. The substrate has at least a plurality of outer contacts and a plurality of inner contacts and the outer contacts are electrically connected to the inner contacts. The electronic package devices are located on the substrate and the electronic package devices electrically connect to the inner contacts, respectively. The molding compound is covering the electronic package devices and the corresponding inner contacts. The plastic forming material is covering the molding compound and the substrate, and the plastic forming material exposes the outer contacts.

Abstract: A memory card structure comprising a substrate, a plurality of memory chips, some package material and an ultra-thin plastic shell is provided. To fabricate the memory card, a substrate having a first surface and a second surface is provided. The first surface has a plurality of outer contacts and the second surface has at least a cavity. There is a plurality of inner contacts around the cavity. Furthermore, the outer contacts and the inner contacts are electrically connected to each other. The memory chips are stacked up inside the cavity and electrically connected to the inner contacts of the substrate. Then, the memory chips and the inner contacts are encapsulated using the molding compound. Thereafter, the ultra-thin plastic shell is placed over the second surface and attached to the substrate. That portion of the ultra-thin plastic shell covering the memory chips has a thickness of about 0.1˜0.15 mm.

Abstract: A memory card structure comprising a substrate, a plurality of memory chips, some molding compound and an ultra-thin plastic shell is provided. To fabricate the memory card, a substrate having a first surface and a second surface is provided. The first surface has a plurality of outer contacts and the second surface has a cavity and a plurality of inner contacts around the cavity. The outer contacts and the inner contacts are electrically connected to each other. The memory chips are stacked up in the same area inside the cavity. Furthermore, the memory chips are electrically connected to the inner contacts. Then, the memory chips and the inner contacts are encapsulated. Thereafter, the ultra-thin plastic shell is placed over the second surface and attached to the substrate. That portion of the ultra-thin plastic shell covering the memory chips has a thickness of about 0.1˜0.4 mm.

Abstract: A doorframe structure is composed of a doorframe, spring locks, and decorative panels fastened to the doorframe. The doorframe is provided with pluralities of fish-eye holes and grooves. By way of piercing screws through the fish-eye hoes, the doorframe is fastened to the pre-constructed holes on the wall. Each of the spring locks includes a base and an insertion locking device, which are installed inside the groove and on the backside of the decorative panel, respectively. By way of the spring locks, the decorative panels can be fastened to the doorframe to accomplish a novel doorframe structure. Accordingly, the doorframe structure can be installed after the wall has been completed constructed, thus avoiding the inconvenience occurred in construction of the doorframe of the prior art, i.e., the doorframe must be installed before completing the construction of the wall.

Abstract: A high-voltage discharge lamps parallel and driving arrangement includes a first and a second high-voltage discharge lamp bank having a plurality of parallelly connected high-voltage discharge lamps each, and being electrically connected to a first and a second output at a secondary side of a transformer, respectively. A primary side of the transformer is connected to a driving circuit. The lamps are allowed to charge and discharge directly without any current-limiting capacitance. Since the first and the second high-voltage discharge lamp bank are electrically connected to the outputs of a common transformer, the number of transformers used could be reduced to allow increased volume of the transformer, and easy production at high good yield and reduced manufacturing cost.

Abstract: A memory card structure comprising a substrate, a plurality of memory chips, some package material and an ultra-thin plastic shell is provided. To fabricate the memory card, a substrate having a first surface and a second surface is provided. The first surface has a plurality of outer contacts and the second surface has at least a cavity. There is a plurality of inner contacts around the cavity. Furthermore, the outer contacts and the inner contacts are electrically connected to each other. The memory chips are stacked up inside the cavity and electrically connected to the inner contacts of the substrate. Then, the memory chips and the inner contacts are encapsulated using the molding compound. Thereafter, the ultra-thin plastic shell is placed over the second surface and attached to the substrate. That portion of the ultra-thin plastic shell covering the memory chips has a thickness of about 0.1˜0.15 mm.

Abstract: A memory card structure comprising a substrate, a plurality of memory chips, some molding compound and an ultra-thin plastic shell is provided. To fabricate the memory card, a substrate having a first surface and a second surface is provided. The first surface has a plurality of outer contacts and the second surface has a cavity and a plurality of inner contacts around the cavity. The outer contacts and the inner contacts are electrically connected to each other. The memory chips are stacked up in the same area inside the cavity. Furthermore, the memory chips are electrically connected to the inner contacts. Then, the memory chips and the inner contacts are encapsulated. Thereafter, the ultra-thin plastic shell is placed over the second surface and attached to the substrate. That portion of the ultra-thin plastic shell covering the memory chips has a thickness of about 0.1˜0.4 mm.

Abstract: A memory card. The memory card comprises a substrate, a plurality of electronic package devices, a molding compound and a plastic forming material. The substrate has at least a plurality of outer contacts and a plurality of inner contacts and the outer contacts are electively connected to the inner contacts. The electronic package devices are located on the substrate and the electronic package devices electively connect to the inner contacts, respectively. The molding compound is covering the electronic package devices and the corresponding inner contacts. The plastic forming material is covering the molding compound and the substrate, and the plastic forming material exposes the outer contacts.

Abstract: A skirting board structure is primarily composed of a positioning board and a decorative board. The positioning board is in form of a thin sheet, the top of which is provided with a gap such that the adjacent side of the gap will form an engagement flake. The positioning board can be firmly fastened to the bottom of a wall. The decorative board has a slot between a long side and a short side, such that after the positioning board is fastened to the wall bottom, the decorative board can be combined with the positioning board by way of engaging the slot with the engagement flake of the positioning board.

Abstract: Carbon nanotubes are directly grown on a substrate surface having three metal layers thereon by a thermal chemical vapor deposition at low-temperature, which can be used as an electron emission source for field emission displays. The three layers include a layer of an active metal catalyst sandwiched between a thick metal support layer formed on the substrate and a bonding metal layer. The active metal catalyst is iron, cobalt, nickel or an alloy thereof; the metal support and the bonding metal independently are Au, Ag, Cu, Pd, Pt or an alloy thereof; and they can be formed by sputtering, chemical vapor deposition, physical vapor deposition, screen printing or electroplating.

Abstract: Carbon nanotubes are directly grown on a substrate surface having three metal layers thereon by a thermal chemical vapor deposition at low-temperature, which can be used as an electron emission source for field emission displays. The three layers include a layer of an active metal catalyst sandwiched between a thick metal support layer formed on the substrate and a bonding metal layer. The active metal catalyst is iron, cobalt, nickel or an alloy thereof; the metal support and the bonding metal independently are Au, Ag, Cu, Pd, Pt or an alloy thereof; and they can be formed by sputtering, chemical vapor deposition, physical vapor deposition, screen printing or electroplating.

Abstract: A construction method for one-step grout fixed window frames on external walls of a concrete-structured building includes the following steps. A window frame including vertical and horizontal sections is fixed with vertical lining boards to the inner side of its vertical sections to form a window frame assembly, and is then supported on an upper supporting board which has been securely attached to a concrete template of an external wall of the building. Template sealing strips are separately attached to an exterior edge and an interior edge of the vertical sections and the upper horizontal section of the window frame assembly, so that a complete molding cavity is formed. Into this molding cavity the grouting concrete is grouted and the window frame is inlaid in the concrete after the concrete is set and the concrete templates are removed.

Abstract: A construction method for one-step grout fixed window frames on external walls of a concrete-structured building includes the following steps. A window frame including vertical and horizontal sections is fixed with vertical lining boards to the inner side of its vertical sections to form a window frame assembly, and is then supported on an upper supporting board which has been securely attached to a concrete template of an external wall of the building. Template sealing strips are separately attached to an exterior edge and an interior edge of the vertical sections and the upper horizontal section of the window frame assembly, so that a complete moulding cavity is formed. Into this moulding cavity the grouting concrete is grouted and the window frame is inlaid in the concrete after the concrete is set and the concrete templates are removed.

Abstract: Stable Bobber for Rod Fishing consists of a stream-line conic rod with a plurality of proper holes at the side of its lower portion, or with two stream-line sections in reverse direction wherein one section is formed by cutting off its lower portion; these two kinds of bobber are either suitable for an open water region or for a close water region and are both very stable and sensitive. When the bobber is floating on the water and the color-striped post is affected by discontinual resistance force from waves and wind to oscillate and fall on the surface of water, the bobber can turn its stream-line to the proper direction and maintain itself upright and stable either by rotating itself to balance the back pressure or by gaining a negative pressure, and thus maintain its stability and sensibility.