Abstract: A memory device includes a repair circuit including a fail bit location information table configured to store row and column addresses of a defective cell in a normal area of a memory cell array. The repair circuit also includes a row address comparison unit configured to compare the row address of the defective cell with a row address of a first access cell received from the outside, and to output a first row match signal when the defective cell's row address matches the row address of the first access cell, and a column address comparison unit configured to compare the column address of the defective cell with a column address of the first access cell received from the outside, and to output a first column address replacement signal if the column address of the defective cell is the same as the column address of the first access cell.

Abstract: In a memory device and in a method for controlling a memory device, the memory device comprises a magnetic structure that stores information in a plurality of domains of the magnetic structure. A read unit reads information from at least one of the plurality of domains of the magnetic structure by applying a read current to the magnetic structure. A position detector unit compares the information read by a read current from the read unit from multiple domains of the plurality of domains of the magnetic structure to identify the presence of an expected information pattern at select domains of the plurality of domains.

Abstract: A nonvolatile memory device comprises a nonvolatile cell array comprising a memory cell and a reference cell, a clamping circuit electrically connected to the memory cell and configured to clamp a voltage applied to a data sensing line during a read operation, and a clamping voltage generation unit configured to generate a clamping voltage responsive to a first voltage having a level based on the reference cell, and to feed back the clamping voltage to the clamping circuit.

Abstract: A semiconductor device includes a first memory region including a plurality of memory cells; a test unit configured to test the first memory region, and detect a weak bit from among the plurality of memory cells; and a second memory region configured to store a weak bit address (WBA) of the first memory region, and data intended to be stored in the weak bit, wherein the first memory region and the second memory region include different types of memory cells.

Abstract: A non-volatile memory device including a cell array, which includes a plurality of memory cells, and a sense amplification circuit. The sense amplification circuit is configured to receive a data voltage of a memory cell, a first reference voltage and a second reference voltage during a data read operation of the memory cell, generate differential output signals based on a voltage level difference between the data voltage and the first and second reference voltages, and output the differential output signals as data read from the memory cell.

Abstract: A memory device comprises a memory cell array and a bad page map. The memory cell array comprises a plurality of memory cells arranged in pages and columns, wherein the memory cell array is divided into a first memory block and a second memory block each corresponding to an array of the memory cells. The bad page map stores bad page location information indicating whether each of the pages of the first memory block is good or bad. A fail page address of the first memory block is replaced by a pass page address of the second memory block according to the bad page location information.

Abstract: A resistive memory device and a system and method for testing the resistive memory device are provided. The resistive memory device includes a plurality of bit lines comprising at least one dummy bit line to which a plurality of resistive memory cells are connected, a conducting wire connected to the dummy bit line, a first switching element positioned between the dummy bit line and an external device outside the resistive memory device, and a second switching element positioned between the conducting wire and the external device. Accordingly, the operational reliability of the resistive memory device may be increased.

Abstract: An anti-fuse circuit includes an array of anti-fuses. Each anti-fuse has a tunneling magneto-resistance (TMR) element series connected with a transistor, such that breakdown of a magnetic tunnel junction (MTJ) in response to an applied first voltage stores fuse information. A sensing circuit senses and amplifies respective output signals provided by the anti-fuses.

Abstract: A liquid crystal display apparatus includes a backlight unit, a second polarization layer, a liquid crystal layer disposed between the backlight unit and the second polarization layer, a first polarization layer disposed between the backlight unit and the liquid crystal layer. In an embodiment, a surface of the first polarization layer facing the backlight unit includes a reflective surface and a surface of the first polarization layer facing the backlight unit includes an absorbent surface. In another embodiment, the first polarization layer includes grids, which include a metal, and absorbing members, which include dielectric materials. In another embodiment, the first polarization layer includes grids, each of which includes a first component including a dielectric material and a second component including a metal.

Abstract: A method of performing write operations in a memory device including a plurality of banks is performed. Each bank includes two or more sub-banks including at least a first sub-bank and a second sub-bank. The method comprises: performing a first row cycle for writing to a first word line of the first sub-bank, the first row cycle including a plurality of first sub-periods, each sub-period for performing a particular action; and performing a second row cycle for writing to a first word line of the second sub-bank, the second row cycle including a plurality of second sub-periods of the same type as the plurality of first sub-periods. The first row cycle overlaps with the second row cycle, and a first type sub-period of the first sub-periods overlaps with a second type sub-period of the second sub-periods, the first type and second type being different types.

Abstract: An information storage device includes a first portion comprising at first at least one magnetic track, each of the at least one magnetic track in the first portion including a first plurality of magnetic domains and being configured to store a first type of data therein and a second portion comprising a second at least one magnetic track, each of the at least one magnetic track in the second portion including a second plurality of magnetic domains and being configured to store a second type of data therein, the second type of data being related to the first type of data.

Abstract: A method of changing a parameter in a semiconductor device is provided. The method includes receiving and storing data in a storage region; and changing at least one between a DC characteristic and an AC timing characteristic of a parameter, used to access a non-volatile memory cell included in a memory core of the semiconductor device, according to the data stored in the storage.

Abstract: A resistive memory device comprises a memory cell array comprising a plurality of memory units. The memory device performs a refresh read operation to check a condition of each of the memory units. Then, it determines whether to refresh each memory unit based on data read by performing the refresh read operation, and refreshes the memory unit according to a result of the determination. The refresh read operation uses a reference resistance with a smaller margin from a resistance distribution than a normal read operation.

Abstract: A memory device includes a stacked resistive memory cell array comprising a plurality of resistive memory cell layers stacked on a semiconductor substrate, wherein respective memory cell layers are configured to store data according to respective program modes comprising a number of bits per cell. The memory device further includes a control circuit configured to identify a program mode of a selected memory cell layer responsive to an address signal and to access the selected memory cell layer responsive to the address signal according to the identified program mode. The program modes may include a single-level cell mode and at least one multi-level cell mode.

Abstract: At least one refresh without scrubbing is performed on a corresponding portion of the memory device with a first frequency. In addition, at least one refresh with scrubbing is performed on a corresponding portion of the memory device with a second frequency less than the first frequency. Accordingly, refresh operations with data scrubbing are performed to prevent data error accumulation. Furthermore, refresh operations without data scrubbing are also performed to reduce undue power consumption from the data scrubbing.

Abstract: A refresh address is generated with a refresh period for refreshing a memory device with refresh leveraging. A respective refresh is performed on a weak cell having a first address when the refresh address is a second address instead of on a first strong cell having the second address. A respective refresh is performed on one of the first strong cell or a second strong cell having a third address when the refresh address is the third address. Address information is stored for only one of the first, second, and third addresses such that memory capacity may be reduced. In alternative aspects, a respective refresh is performed on one of a weak cell, a first strong cell, or a second strong cell depending on a flag when the refresh address is any of at least one predetermined address to result in refresh leveraging.

Abstract: A liquid crystal display (LCD) and method for driving the LCD using one or more polarity inversion methods is provided. In one embodiment, the invention relates to a method of driving an LCD comprising a liquid crystal panel partitioned by a plurality of gate lines and data lines and including a plurality of liquid crystal cells arranged in a matrix and auxiliary lines adjacent to and parallel to the gate lines, the auxiliary lines coupled with the plurality of liquid crystal cells, the method including supplying an auxiliary voltage that increases from a low level to a high level on a first pair of auxiliary lines adjacent to each other for a jth frame period, supplying an auxiliary voltage that decreases from a high level to a low level on a second pair of auxiliary lines adjacent to each other for the jth frame period, supplying the auxiliary voltages at levels opposite to the levels of the jth frame period on the first and second pairs of auxiliary lines in a (j+1)th frame period.

Abstract: Provided are nonvolatile memory devices and program methods thereof, an integrated circuit memory system includes a memory array comprising at least one magnetic track, each of the at least one magnetic track including a plurality of magnetic domains and at least one read/write unit coupled thereto, decoding circuitry coupled to the memory array that is operable to select at least one of the magnetic domains, a read/write controller coupled to the memory array that is operable to read data from at least one of the plurality of magnetic domains and to write data to at least one of the plurality of magnetic domains via the at least one read/write unit coupled to each of the at least one magnetic track, and a domain controller coupled to memory array that is operable to move data between the magnetic domains on each of the at least one magnetic track.

Abstract: To control operations of a resistive memory device, an input-output operation of an error check and correction (ECC) code is separated from an input-output operation of data. A condition of the input-output operation of the ECC code is determined stricter than a condition of the input-output operation of the data. reliability of the input-output operation of the ECC code may be enhanced, thereby reducing errors due to defect memory cells, noise, etc.

Abstract: A semiconductor memory device including a bit line connected to a memory cell and a sense amplifier configured to drive a voltage level of a global bit line in response to a voltage level of the bit line. The sense amplifier provides data that is complementary to data stored in the memory cell to the global bit line and provides the complementary data of the global bit line to the memory cell during an active operation of the memory cell.