Abstract: A memory system is provided which includes multiple semiconductor memories having arrays of memory cells and a memory controller configured to provide an address in common to the multiple memories. First and second addresses corresponding to first and second rows of memory cells in first and second memories are selected according to the address in common. The first row and its adjacent rows in the first memory can all be different from the second row and its adjacent rows in the second semiconductor memory. Different conversion schemes can provide scramble information used to convert the address in common into the first and second addresses.

Abstract: A memory module includes a master memory device and at least one slave memory device. The master memory device may generate a refresh clock signal, and perform a refresh operation in synchronization with the refresh clock signal. The slave memory device may be connected to receive the refresh clock signal, and perform a refresh operation in synchronization with the refresh clock signal.

Abstract: A stacked semiconductor memory device comprises memory cell array layers that are stacked in an inverted wedge shape and have different redundancy sizes from each other. The stacked semiconductor memory device has space for vertical connection between layers, a relatively small size, and a relatively high yield.

Abstract: A memory module includes a plurality of memory devices and a buffer chip. The buffer chip manages the memory devices. The buffer chip includes a refresh control circuit that groups a plurality of memory cell rows of the memory devices into a plurality of groups according to a data retention time of tire memory cell rows. The buffer chip selectively refreshes each of the plurality of groups in each of a plurality of refresh time regions that are periodically repeated and applies respective refresh periods to the plurality of groups, respectively.

Abstract: A memory device comprises a memory cell array and a bad page map. The memory cell array comprises a plurality of memory cells arranged in pages and columns, wherein the memory cell array is divided into a first memory block and a second memory block each corresponding to an array of the memory cells. The bad page map stores bad page location information indicating whether each of the pages of the first memory block is good or bad. A fail page address of the first memory block is replaced by a pass page address of the second memory block according to the bad page location information.

Abstract: A resistive memory device and a system and method for testing the resistive memory device are provided. The resistive memory device includes a plurality of bit lines comprising at least one dummy bit line to which a plurality of resistive memory cells are connected, a conducting wire connected to the dummy bit line, a first switching element positioned between the dummy bit line and an external device outside the resistive memory device, and a second switching element positioned between the conducting wire and the external device. Accordingly, the operational reliability of the resistive memory device may be increased.

Abstract: In one example embodiment, a memory system includes a memory module and a memory controller. The memory module is configured generate density information of the memory module based on a number of the bad pages of the memory module, the bad pages being pages that have a fault. The memory controller is configured to map a continuous physical address to a dynamic random access memory (dram) address of the memory module based on the density information received from the memory module.

Abstract: In one example embodiment, a memory module includes a plurality of memory devices and a buffer chip configured to manage the plurality of memory device. The buffer chip includes a memory management unit having an error correction unit configured to perform error correction operation on each of the plurality of memory devices. Each of the plurality of memory devices includes at least one spare column that is accessible by the memory management unit, and the memory management unit is configured to correct errors of the plurality of memory devices by selectively using the at least one spare column based on an error correction capability of the error correction unit.

Abstract: In one example embodiment, a memory device includes a cell array configured to receive data at an associated address in response to a write command. The memory device further includes a storage unit configured to receive the associated address and the data in response to the write command and output the data to the associated address of the cell array in response to a rewrite command. The memory device further includes a violation determining unit configured to determine violation data, count a number of the violation data and determine data written to the storage unit as the violation data if a storage duration of the written data is less than a write recovery time (tWR).

Abstract: A resistive memory device and method of initialization are provided. The resistive memory device includes a first group of resistive memory cells connected between bit lines and a first plate and a second group connected between bit lines and a second plate. First and second initialization voltages are respectively applied to the first and second plates outside a normal path associated with a normal operation of the resistive memory cells.

Abstract: Semiconductor memory device having a stacking structure including resistor switch based logic circuits. The semiconductor memory device includes a first conductive line that includes a first line portion and a second line portion, wherein the first line portion and the second line portion are electrically separated from each other by an intermediate region disposed between the first and second line portions, a first variable resistance material film that is connected to the first line portion and stores data, and a second variable resistance material film that controls an electrical connection between the first line portion and the second line portion.

Abstract: A multi-layer multi band antenna is provided. Because the antenna carrier has a structure stacked in a plurality of layers having different dielectric constants, the antenna maintains a small size yet has an improved radiation performance in a desired bandwidth.

Abstract: A method of changing a parameter in a semiconductor device is provided. The method includes receiving and storing data in a storage region; and changing at least one between a DC characteristic and an AC timing characteristic of a parameter, used to access a non-volatile memory cell included in a memory core of the semiconductor device, according to the data stored in the storage.

Abstract: A refresh method for a volatile memory device includes refreshing memory cells of a first set of rows of an array at a first refresh rate having a first refresh period, the first refresh rate being a lower rate having a longer refresh period than a second refresh rate having a second refresh period, wherein each memory cell in the first set of rows of the array has a retention time longer than the first refresh period; and refreshing memory cells of a second set of rows of the array at a third refresh rate having a third refresh period, the third refresh rate being a higher rate having a shorter refresh period than the second refresh rate having the second refresh period, wherein at least one memory cell of each row of the second set of rows has a retention time longer than the third refresh period and shorter than the first refresh period. The second refresh period corresponds to a refresh period defined in a standard for the volatile memory device.

Abstract: A semiconductor memory device includes at least one memory cell block and at least one connection unit. The at least one memory cell block has a first region including at least one first memory cell connected to a first bit line, and a second region including at least one second memory cell connected to a second bit line. The at least one connection unit is configured to selectively connect the first bit line to a corresponding bit line sense amplifier based on a first control signal, and configured to selectively connect the second bit line to the corresponding bit line sense amplifier via a corresponding global bit line based on a second control signal.

Abstract: A method of performing write operations in a memory device including a plurality of bank is performed. Each bank includes two or more sub-banks including at least a first sub-bank and a second sub-bank. The method comprises: performing a first row cycle for writing to a first word line of the first sub-bank, the first row cycle including a plurality of first sub-periods, each sub-period for performing a particular action; and performing a second row cycle for writing to a first word line of the second sub-bank, the second row cycle including a plurality of second sub-periods of the same type as the plurality of first sub-periods. The first row cycle overlaps with the second row cycle, and a first type sub-period of the first sub-periods overlaps with a second type sub-period of the second sub-periods, the first type and second type being different types.

Abstract: A stacked semiconductor memory device includes an error correction code (ECC) controller that controls the number of bits in an ECC word and corrects errors in memory cell array layers using the ECC word.

Abstract: A memory system includes a memory device and a memory controller. The memory device includes a plurality of memory cells. The memory controller is configured to continuously perform a plurality of write commands on the memory device between an active command and a precharge command. In the memory system, when after a first write operation having a last write command of the plurality of write commands is performed and then the precharge command is issued, the last write command is issued for a second write operation after the precharge command. The first write operation and the second write operation write a same data to memory cells of plurality of memory cells having a same address.

Abstract: A stacked semiconductor memory device comprises a semiconductor substrate having a functional circuit, a plurality of memory cell array layers, and at least one connection layer. The memory cell array layers are stacked above the semiconductor substrate. The connection layers are stacked above the semiconductor substrate independent of the memory cell array layers. The connection layers electrically connect memory cell selecting lines arranged on the memory cell array layers to the functional circuit.

Abstract: A nonvolatile memory device comprises a nonvolatile cell array comprising a memory cell and a reference cell, a clamping circuit electrically connected to the memory cell and configured to clamp a voltage applied to a data sensing line during a read operation, and a clamping voltage generation unit configured to generate a clamping voltage responsive to a first voltage having a level based on the reference cell, and to feed back the clamping voltage to the clamping circuit.