Patents by Inventor Chun-An Hsieh

Chun-An Hsieh has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20150009239
    Abstract: A display device includes a backlight module, a backlight control module and a flicker removing module. The backlight module electrically connected between an input pin and an output pin which belong to the backlight control module, provides a backlight source to a display panel. The input pin receives a first voltage to control a continuity of an input current which is supplied to the backlight module and has no frequency variation. The flicker removing module electrically connected to the output pin receives a pulse width modulation signal and according to a duty cycle of the pulse width modulation signal, controls an output current outputted by the output pin, so as to control the backlight control module to control the input current according to the output current. The input current is associated with a backlight brightness of the backlight module.
    Type: Application
    Filed: July 31, 2013
    Publication date: January 8, 2015
    Applicant: Micro-Star Int'l Co., Ltd.
    Inventors: Chien-Chi HSU, Ping-Chun HSIEH
  • Patent number: 8897589
    Abstract: A method of detecting the subject of an image and imaging device thereof are disclosed. The method comprises the following steps of providing an image capturing module to capture the temporal image, providing the image processing module to receive the temporal image and to determine a plurality of objects from the temporal image, using the image processing module to define a plurality of regions on the temporal image based on the center of temporal image, using the image processing module to assign an initial setup value to each of the objects according to the region corresponding to each of the objects, using the imaging processing module to execute an operation to increase or decrease each of the initial setup values, using the image processing module to execute a sorting, and selecting at least one of the objects as a subject of the temporal image.
    Type: Grant
    Filed: March 5, 2013
    Date of Patent: November 25, 2014
    Assignee: Altek Semiconductors Corporation
    Inventors: Chia-Chun Hsieh, Wen-Yan Chang, Hong-Long Chou
  • Publication number: 20140332074
    Abstract: A solar cell module is provided, wherein the solar cell module includes a solar cell device, a first protective film, a second protective film, a cover plate, a backsheet and a plurality of thermal radiation particles. The solar cell device includes a first surface and a second surface opposite to the first surface. The first protective film is located on the first surface, and the second protective film is located on the second surface. The cover plate is located on the first protective film, and the first protective film is located between the solar cell device and the cover plate. The backsheet is located on the second protective film, and the second protective film is located between the solar cell device and the backsheet, and the thermal radiation particles are distributed in the backsheet.
    Type: Application
    Filed: March 18, 2014
    Publication date: November 13, 2014
    Applicant: Win Win Precision Technology Co., Ltd.
    Inventors: Cheng-Lien Wang, Chien-Chun Hsieh
  • Patent number: 8872345
    Abstract: A method of forming an interposer includes providing a semiconductor substrate, the semiconductor substrate having a front surface and a back surface opposite the front surface; forming one or more through-silicon vias (TSVs) extending from the front surface into the semiconductor substrate; forming an inter-layer dielectric (ILD) layer overlying the front surface of the semiconductor substrate and the one or more TSVs; and forming an interconnect structure in the ILD layer, the interconnect structure electrically connecting the one or more TSVs to the semiconductor substrate.
    Type: Grant
    Filed: July 7, 2011
    Date of Patent: October 28, 2014
    Assignee: Taiwan Semiconductor Manufacturing Company, Ltd.
    Inventors: Chi-Chun Hsieh, Wei-Cheng Wu, Hsiao-Tsung Yen, Hsien-Pin Hu, Shang-Yun Hou, Shin-Puu Jeng
  • Patent number: 8829511
    Abstract: A hybrid thin film transistor includes a first thin film transistor and a second thin film transistor. The first thin film transistor includes a first gate, a first source, a first drain and a first semiconductor layer disposed between the first gate, the first source and the first drain, and the first semiconductor layer includes a crystallized silicon layer. The second thin film transistor includes a second gate, a second source, a second drain and a second semiconductor layer disposed between the second gate, the second source and the second drain, and the second semiconductor layer includes a metal oxide semiconductor layer.
    Type: Grant
    Filed: September 15, 2011
    Date of Patent: September 9, 2014
    Assignee: Au Optronics Corporation
    Inventors: Hsiu-Chun Hsieh, Yi-Wei Chen, Ta-Wei Chiu, Chung-Tao Chen
  • Patent number: 8820012
    Abstract: The present invention relates to an integrated localization steel frame used in lightweight steel building. The localization steel frame comprises steel columns (2), bracing members (1), and localization members (3) connecting the steel columns (2) and bracing members (1) through fixing connectors (7). The localization members (3) are casted in concrete ring beams (4). The steel columns (2), bracing members (1) and the fixing connectors (7) are connected together in pre-determined positions. The localization steel frame has proper structure, and is stressed uniformly and cost effective in construction. It can be assembled simply on site and can improve the construction efficiency. Hence it is more suitable for practical application.
    Type: Grant
    Filed: June 1, 2010
    Date of Patent: September 2, 2014
    Inventor: Ying Chun Hsieh
  • Publication number: 20140191395
    Abstract: A method of forming a device includes printing conductive patterns on a dielectric sheet to form a pre-ink-printed sheet, and bonding the pre-ink-printed sheet onto a side of a substrate. The conductive feature includes a through-substrate via extending from a first major side of the substrate to a second major side of the substrate opposite the first major side. A conductive paste is then applied to electrically couple conductive patterns to a conductive feature in the substrate.
    Type: Application
    Filed: March 11, 2014
    Publication date: July 10, 2014
    Applicant: TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.
    Inventors: Jung Cheng Ko, Chi-Chun Hsieh, Shang-Yun Hou, Wen-Chih Chiou, Shin-Puu Jeng, Chen-Hua Yu
  • Publication number: 20140192215
    Abstract: A method of detecting the subject of an image and imaging device thereof are disclosed. The method comprises the following steps of providing an image capturing module to capture the temporal image, providing the image processing module to receive the temporal image and to determine a plurality of objects from the temporal image, using the image processing module to define a plurality of regions on the temporal image based on the center of temporal image, using the image processing module to assign an initial setup value to each of the objects according to the region corresponding to each of the objects, using the imaging processing module to execute an operation to increase or decrease each of the initial setup values, using the image processing module to execute a sorting, and selecting at least one of the objects as a subject of the temporal image.
    Type: Application
    Filed: March 5, 2013
    Publication date: July 10, 2014
    Applicant: ALTEK SEMICONDUCTOR CORPORATION
    Inventors: CHIA-CHUN HSIEH, WEN-YAN CHANG, Hong-Long CHOU
  • Patent number: 8766270
    Abstract: A pixel structure is provided. A first insulating pattern is on the first polysilicon pattern. A second insulating pattern is on the second polysilicon pattern and separated from the first insulating pattern. An insulating layer covers the first and the second insulating patterns. A first gate and a second gate are on the insulating layer. A first covering layer covers the first and the second gates. A first source metal layer and a first drain metal layer are on the first covering layer and electrically connected to a first source region and a first drain region. A second source metal layer and a second drain metal layer are on the first covering layer and electrically connected to a second source region and a second drain region. A pixel electrode is electrically connected to the first drain metal layer.
    Type: Grant
    Filed: January 11, 2011
    Date of Patent: July 1, 2014
    Assignee: Au Optronics Corporation
    Inventors: Hsiu-Chun Hsieh, Yi-Wei Chen, Ta-Wei Chiu, Chung-Tao Chen
  • Publication number: 20140176428
    Abstract: In a method for controlling a data page displayed on a flexible display of a flexible electronic device, a plurality of gravity sensors located at each side of the flexible electronic device detects current position data of corresponding sides of the flexible electronic device. A curved angle and a curved direction of each side of the flexible electronic device is calculated based on the current position and a preset position of each side. An operation on the flexible electronic device is determined according to the curved angle and the curved direction of each side of the flexible electronic device. An instruction associated with each operation is executed to control movement of the data page displayed on the flexible display.
    Type: Application
    Filed: December 20, 2013
    Publication date: June 26, 2014
    Applicant: FIH (HONG KONG) LIMITED
    Inventor: HSING-CHUN HSIEH
  • Publication number: 20140175347
    Abstract: The present invention relates to a photosensitive resin composition for black matrix, as well as a color filter and a liquid crystal display (LCD) device formed by the composition. The aforementioned photosensitive resin composition comprises an alkali-soluble resin (A), a compound containing vinyl unsaturated group(s) (B), a photo initiator (C), quinonediazide sulfonic acid ester (D), a solvent (E) and black pigment (F). The alkali-soluble resin (A) includes epoxy resin having unsaturated group(s) (A-1), which is obtained by reacting an epoxy resin (i) having at least two epoxy groups with a compound (ii) having at least one vinyl unsaturated group and carboxyl group. The aforementioned photo initiator (C) includes an O-acyloxime compound (C-1).
    Type: Application
    Filed: December 16, 2013
    Publication date: June 26, 2014
    Applicant: CHI MEI CORPORATION
    Inventors: Hao-Wei LIAO, I-Chun HSIEH
  • Publication number: 20140176429
    Abstract: In a method for controlling a flexible electronic device to sleep or restart, current position data of two gravity sensors located at opposite sides of a flexible display of the flexible electronic device is received. A distance between the two gravity sensors is detected by a proximity sensor located at one of the opposite sides of the flexible display. A control unit of the flexible electronic device controls the flexible electronic device to sleep or restart according to the current position data and the distance.
    Type: Application
    Filed: December 20, 2013
    Publication date: June 26, 2014
    Applicant: FIH (HONG KONG) LIMITED
    Inventor: HSING-CHUN HSIEH
  • Patent number: 8760259
    Abstract: An electronic device with unlocking function includes an accelerometer, an unlocking module, a touch screen and a storage. The accelerometer detects a direction of movement of the electronic device. The touch screen provides output and input for the electronic device. The touch screen detects a contact path of a user when the user contacts the touch screen. When the contact path matches an unlocking path stored in the storage, the electronic device is unlocked.
    Type: Grant
    Filed: November 22, 2010
    Date of Patent: June 24, 2014
    Assignee: FIH (Hong Kong) Limited
    Inventor: Hsing-Chun Hsieh
  • Patent number: 8740046
    Abstract: A soldering system includes a track, a laying device, a boiler, a shelter, a transmission roller, a position sensor, a thermal radiation heating device, and a driving device. At least one hole is formed on the shelter, and a shape and a dimension of at least one hole on the shelter corresponds to a shape and a dimension of a DIP component. The transmission roller rotates the shelter according to a transmission speed of the track. The position sensor detects a position of a circuit board relative to the boiler. The thermal radiation heating device heats an area on a second surface of the circuit board different from a first surface adjacent to the DIP component through the at least one hole on the shelter continuously, so as to increase a temperature of the second surface when the first surface of the circuit board is passing through the boiler.
    Type: Grant
    Filed: January 8, 2014
    Date of Patent: June 3, 2014
    Assignee: Wistron Corporation
    Inventors: Hao-Chun Hsieh, Chia-Hsien Lee
  • Patent number: 8744353
    Abstract: A Bluetooth mouse for fast switching linking objects comprises a signal processing circuit triggered by a key unit to generate a control signal according to a displacement amount of the mouse. The signal processing circuit is electrically connected with a Bluetooth transmission device. The mouse has a pairing information memory storing pairing codes for establishing data transmission linkages between the Bluetooth transmission device and at least one information processing systems. The key unit is programmed one key or a combination of the keys to trigger the signal processing circuit to generate an object-switching signal. The object-switching signal drives the Bluetooth transmission device to access one pairing code from the pairing information memory according to the displacement amount of the mouse, and establishes a data transmission linkage with one information processing system corresponding to the pairing code.
    Type: Grant
    Filed: March 16, 2011
    Date of Patent: June 3, 2014
    Assignee: Zippy Technology Corp.
    Inventor: Yu-Chun Hsieh
  • Patent number: 8716867
    Abstract: A method of forming a device includes printing conductive patterns on a dielectric sheet to form a pre-ink-printed sheet, and bonding the pre-ink-printed sheet onto a side of a substrate. The conductive feature includes a through-substrate via extending from a first major side of the substrate to a second major side of the substrate opposite the first major side. A conductive paste is then applied to electrically couple conductive patterns to a conductive feature in the substrate.
    Type: Grant
    Filed: May 12, 2010
    Date of Patent: May 6, 2014
    Assignee: Taiwan Semiconductor Manufacturing Company, Ltd.
    Inventors: Francis Ko, Chi-Chun Hsieh, Shang-Yun Hou, Wen-Chih Chiou, Shin-Puu Jeng, Chen-Hua Yu
  • Publication number: 20140110458
    Abstract: A soldering system includes a track, a laying device, a boiler, a shelter, a transmission roller, a position sensor, a thermal radiation heating device, and a driving device. At least one hole is formed on the shelter, and a shape and a dimension of at least one hole on the shelter corresponds to a shape and a dimension of a DIP component. The transmission roller rotates the shelter according to a transmission speed of the track. The position sensor detects a position of a circuit board relative to the boiler. The thermal radiation heating device heats an area on a second surface of the circuit board different from a first surface adjacent to the DIP component through the at least one hole on the shelter continuously, so as to increase a temperature of the second surface when the first surface of the circuit board is passing through the boiler.
    Type: Application
    Filed: January 8, 2014
    Publication date: April 24, 2014
    Applicant: Wistron Corporation
    Inventors: Hao-Chun Hsieh, Chia-Hsien Lee
  • Publication number: 20140106536
    Abstract: A device includes a substrate having a front surface and a back surface opposite the front surface. A capacitor is formed in the substrate and includes a first capacitor plate; a first insulation layer encircling the first capacitor plate; and a second capacitor plate encircling the first insulation layer. Each of the first capacitor plate, the first insulation layer, and the second capacitor plate extends from the front surface to the back surface of the substrate.
    Type: Application
    Filed: December 18, 2013
    Publication date: April 17, 2014
    Applicant: Taiwan Semiconductor Manufacturing Company, Ltd.
    Inventors: An-Jhih Su, Chi-Chun Hsieh, Tzu-Yu Wang, Wei-Cheng Wu, Hsien-Pin Hu, Shang-Yun Hou, Wen-Chih Chiou, Shin-Puu Jeng
  • Patent number: 8690041
    Abstract: A method of soldering a DIP component on a circuit board includes piercing the DIP component through the circuit board, laying fluxer on the circuit board, passing a first surface of the circuit board through a boiler so that molten tin from the boiler flows between the DIP component and the circuit board through the first surface of the circuit board, and heating a second surface of the circuit board different from the first surface so as to increase temperature of the second surface by a thermal radiation heating device to when the first surface of the circuit board passes through the boiler.
    Type: Grant
    Filed: December 13, 2011
    Date of Patent: April 8, 2014
    Assignee: Wistron Corporation
    Inventors: Hao-Chun Hsieh, Chia-Hsien Lee
  • Patent number: 8693163
    Abstract: A device includes a substrate having a front surface and a back surface opposite the front surface. A capacitor is formed in the substrate and includes a first capacitor plate; a first insulation layer encircling the first capacitor plate; and a second capacitor plate encircling the first insulation layer. Each of the first capacitor plate, the first insulation layer, and the second capacitor plate extends from the front surface to the back surface of the substrate.
    Type: Grant
    Filed: September 1, 2010
    Date of Patent: April 8, 2014
    Assignee: Taiwan Semiconductor Manufacturing Company, Ltd.
    Inventors: An-Jhih Su, Chi-Chun Hsieh, Tzu-Yu Wang, Wei-Cheng Wu, Hsien-Pin Hu, Shang-Yun Hou, Wen-Chih Chiou, Shin-Puu Jeng