Patents by Inventor Chun-An Hsieh

Chun-An Hsieh has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 8424263
    Abstract: A lightweight floor slab comprises a meshy shuttering (1), a metal mesh (3) and cement mortars (2), wherein the meshy shuttering (1) and the metal mesh (3) are formed to a whole by filing the cement mortars (2).
    Type: Grant
    Filed: September 28, 2009
    Date of Patent: April 23, 2013
    Inventor: Ying Chun Hsieh
  • Patent number: 8395869
    Abstract: ESD protection circuit with EOS immunity is provided, which includes a first connection circuit, a first EOS control circuit formed by at least a diode, and an ESD clamp respectively coupled between a pad, a first clamp node, an I/O clamp node and a second source node. When the ESD clamp detects ESD through the I/O clamp node, it is triggered to conduct from the I/O clamp node to the second source node. When the pad receives EOS, the first EOS control circuit provides a cross voltage between the first clamp node and the I/O clamp node, such that a voltage of the I/O clamp node becomes less than a characteristic voltage of the ESD clamp to prevent the ESD clamp from reverse conducting.
    Type: Grant
    Filed: December 21, 2010
    Date of Patent: March 12, 2013
    Assignee: Faraday Technology Corp.
    Inventors: Fu-Yi Tsai, Po-Chun Hsieh, Wen-Ching Hsiung
  • Patent number: 8387233
    Abstract: A circuit board assembling system includes a circuit board whereon a slot is formed. The circuit board includes a first region and a second region. The circuit board assembling system further includes a component placement machine, a positioning rod, wherein a first width of the unadjusted positioning rod is larger than a width of the slot so that the unadjusted positioning rod can not pass through the slot, a conveying device for driving the circuit board to a positioning point in a first direction and driving the circuit board to an assembling position in a second direction, and a control unit for controlling the conveying device to drive the circuit board to the assembling position in the second direction and controlling the component placement machine to assemble a first component set and a second component set on the first region and the second region respectively.
    Type: Grant
    Filed: January 27, 2010
    Date of Patent: March 5, 2013
    Assignee: Wistron Corporation
    Inventors: Jun-Min Yang, Hao-Chun Hsieh, Hsin-Lun Tsai, Chia-Hsien Lee
  • Patent number: 8358274
    Abstract: The present invention discloses a control method for generating varying colored lights in a keyboard and a self-luminous keyboard for realizing the same method. The control method comprises steps: establishing a driving signal table storing a plurality of backlight driving signals; setting the conditions for outputting the backlight driving signals respectively; detecting a keying signal generated by pressing a key; outputting the backlight driving signal corresponding to the keying signal to drive a backlight unit, or sequentially outputting the backlight driving signals according to the keying signal to drive a backlight unit. The self-luminous keyboard for realizing the same method comprises a memory unit storing the driving signal table and a microcontroller unit detecting the keying signals. The microcontroller unit sequentially outputs the backlight driving signals to drive the backlight unit, or outputs the backlight driving signal corresponding to the keying signal to drive the backlight unit.
    Type: Grant
    Filed: March 23, 2009
    Date of Patent: January 22, 2013
    Assignee: Zippy Technology Corp.
    Inventor: Yu-Chun Hsieh
  • Publication number: 20130009317
    Abstract: A method of forming an interposer includes providing a semiconductor substrate, the semiconductor substrate having a front surface and a back surface opposite the front surface; forming one or more through-silicon vias (TSVs) extending from the front surface into the semiconductor substrate; forming an inter-layer dielectric (ILD) layer overlying the front surface of the semiconductor substrate and the one or more TSVs; and forming an interconnect structure in the ILI) layer, the interconnect structure electrically connecting the one or more TSVs to the semiconductor substrate.
    Type: Application
    Filed: July 7, 2011
    Publication date: January 10, 2013
    Applicant: TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.
    Inventors: Chi-Chun HSIEH, Wei-Cheng WU, Hsiao-Tsung YEN, Hsien-Pin HU, Shang-Yun HOU, Shin-Puu JENG
  • Publication number: 20120313856
    Abstract: A keyboard providing self-detection of linkage includes a key set module, a circuit unit, a wired transmission interface electrically connected to the circuit unit, a wireless transmission interface electrically connected to the circuit unit, and a micro-control unit electrically connected to the circuit unit. The key set module includes a plurality of keys depressible by users to trigger the circuit unit to generate a message signal. The micro-control unit detects an electrical connection signal generated by electrical connection between a transmission cable and the wired transmission interface, and transmits the message signal to the wired transmission interface upon detecting presence of the electrical connection signal, or sends the message signal to the wireless transmission interface when no electrical connection signal is detected. Thus the keyboard is equipped with both the wired transmission interface and wireless transmission interface at the same time.
    Type: Application
    Filed: June 9, 2011
    Publication date: December 13, 2012
    Inventor: Yu-Chun Hsieh
  • Publication number: 20120317329
    Abstract: A keyboard equipped with switching interfaces includes a key set module, a circuit unit, a wired transmission interface, a wireless transmission interface and a switch unit. The key set module includes a plurality of keys depressible by users to trigger the circuit unit to generate a message signal. The circuit unit is electrically connected to the wired transmission interface and wireless transmission interface. The wired transmission interface is electrically connected to a transmission cable to output therethrough. The switch unit is electrically connected to the circuit unit and triggers the circuit unit to output the message signal to the wired transmission interface or wireless transmission interface according to user's actions.
    Type: Application
    Filed: June 9, 2011
    Publication date: December 13, 2012
    Inventor: Yu-Chun HSIEH
  • Publication number: 20120305910
    Abstract: A hybrid thin film transistor includes a first thin film transistor and a second thin film transistor. The first thin film transistor includes a first gate, a first source, a first drain and a first semiconductor layer disposed between the first gate, the first source and the first drain, and the first semiconductor layer includes a crystallized silicon layer. The second thin film transistor includes a second gate, a second source, a second drain and a second semiconductor layer disposed between the second gate, the second source and the second drain, and the second semiconductor layer includes a metal oxide semiconductor layer.
    Type: Application
    Filed: September 15, 2011
    Publication date: December 6, 2012
    Applicant: AU OPTRONICS CORPORATION
    Inventors: Hsiu-Chun Hsieh, Yi-Wei Chen, Ta-Wei Chiu, Chung-Tao Chen
  • Patent number: 8294264
    Abstract: An under-bump metallization (UBM) structure for a semiconductor device is provided. The UBM structure has a center portion and extensions extending out from the center portion. The extensions may have any suitable shape, including a quadrangle, a triangle, a circle, a fan, a fan with extensions, or a modified quadrangle having a curved surface. Adjacent UBM structures may have the respective extensions aligned or rotated relative to each other. Flux may be applied to a portion of the extensions to allow an overlying conductive bump to adhere to a part of the extensions.
    Type: Grant
    Filed: March 30, 2010
    Date of Patent: October 23, 2012
    Assignee: Taiwan Semiconductor Manufacturing Company, Ltd.
    Inventors: Tzu-Yu Wang, Chi-Chun Hsieh, An-Jhih Su, Hsien-Wei Chen, Shin-Puu Jeng, Liwei Lin
  • Publication number: 20120261870
    Abstract: A printed circuit board, a supporting jig, and a positioning method are disclosed, wherein the supporting jig is used for positioning a printed circuit board to facilitate surface mount technology (SMT) procedures. The printed circuit board includes a circuit board locating hole, and a first magnet, wherein the first magnet is accommodated in the circuit board locating hole. The supporting jig has a jig locating hole and a second magnet. The jig locating hole is beneath the circuit board locating hole. The second magnet is accommodated in the jig locating hole so that the printed circuit board can be fixed on the supporting jig by the magnetic attraction between the first magnet and the second magnet.
    Type: Application
    Filed: April 11, 2012
    Publication date: October 18, 2012
    Applicant: Wistron Corporation
    Inventors: Hao-Chun HSIEH, Sheng-Wen Cheng, Hsin-Lun Tsai, Chia-Hsien Lee
  • Publication number: 20120235957
    Abstract: A portable electronic device, including a housing defining an earphone connector, a touch screen, and a stylus having a stylus body, a tip and a pin connecting the stylus body with tip, and the pin and the tip are detachably secured in the earphone connector.
    Type: Application
    Filed: October 28, 2011
    Publication date: September 20, 2012
    Applicant: CHI MEI COMMUNICATION SYSTEMS, INC.
    Inventors: YOU-ZHANG LIN, ZHANG-MING HUANG, MING-CHUN HSIEH, YUNG-SHENG HSU, CHUN-WEI WU
  • Publication number: 20120192520
    Abstract: A light steel roof truss with a structure of a double continuous beam includes structural beams (1) and structural columns (2). The structural beam (1) consists of a pair of continuous beams, and the structural column (2) is located between the two continuous beams through locating holes (4). Thereby the stability of a support structure of the roof truss is increased, and the supporting members of the roof truss can be connected conveniently.
    Type: Application
    Filed: February 8, 2010
    Publication date: August 2, 2012
    Inventor: Ying Chun Hsieh
  • Publication number: 20120193400
    Abstract: A method of soldering a DIP component on a circuit board includes piercing the DIP component through the circuit board, laying fluxer on the circuit board, passing a first surface of the circuit board through a boiler so that molten tin from the boiler flows between the DIP component and the circuit board through the first surface of the circuit board, and heating a second surface of the circuit board different from the first surface so as to increase temperature of the second surface by a thermal radiation heating device to when the first surface of the circuit board passes through the boiler.
    Type: Application
    Filed: December 13, 2011
    Publication date: August 2, 2012
    Inventors: Hao-Chun Hsieh, Chia-Hsien Lee
  • Publication number: 20120154960
    Abstract: ESD protection circuit with EOS immunity is provided, which includes a first connection circuit, a first EOS control circuit formed by at least a diode, and an ESD clamp respectively coupled between a pad, a first clamp node, an I/O clamp node and a second source node. When the ESD clamp detects ESD through the I/O clamp node, it is triggered to conduct from the I/O clamp node to the second source node. When the pad receives EOS, the first EOS control circuit provides a cross voltage between the first clamp node and the I/O clamp node, such that a voltage of the I/O clamp node becomes less than a characteristic voltage of the ESD clamp to prevent the ESD clamp from reverse conducting.
    Type: Application
    Filed: December 21, 2010
    Publication date: June 21, 2012
    Applicant: FARADAY TECHNOLOGY CORPORATION
    Inventors: Fu-Yi Tsai, Po-Chun Hsieh, Wen-Ching Hsiung
  • Publication number: 20120155085
    Abstract: An LED module assembling structure includes an LED module, at least one connection seat and a conductive connection member. The LED module includes a circuit board and at least one light-emitting diode. The connection seat is soldered on the circuit board. The connection seat has two sidewalls defining a holding trough having an opening. The sidewalls are respectively formed with two corresponding recesses and two corresponding latch protrusion sections protruding from the sidewalls into the holding trough. The latch protrusion sections are positioned above the recesses near the opening. The conductive connection member is a bar-shaped conductor. At least one end of the conductive connection member is inserted in the holding trough of the connection seat and fixedly held between the recesses in the holding trough. Accordingly, multiple LED modules can be assembled and electrically connected with each other via the conductive connection member and the connection seats.
    Type: Application
    Filed: December 20, 2010
    Publication date: June 21, 2012
    Inventors: Chih-Yang CHANG, Yu-Chun HSIEH
  • Publication number: 20120096789
    Abstract: The present invention relates to an integrated localization steel frame used in lightweight steel building. The localization steel frame comprises steel columns (2), bracing members (1), and localization members (3) connecting the steel columns (2) and bracing members (1) through fixing connectors (7). The localization members (3) are casted in concrete ring beams (4). The steel columns (2), bracing members (1) and the fixing connectors (7) are connected together in pre-determined positions. The localization steel frame has proper structure, and is stressed uniformly and cost effective in construction. It can be assembled simply on site and can improve the construction efficiency. Hence it is more suitable for practical application.
    Type: Application
    Filed: June 1, 2010
    Publication date: April 26, 2012
    Inventor: Ying Chun Hsieh
  • Publication number: 20120090652
    Abstract: The cleaning apparatus for solder paste in apertures according to the present invention comprises a stencil, a guiding plate, and a blower. The stencil has a plurality of apertures with residual solder paste on the sidewalls thereof. The guiding plate is disposed above the stencil and has a plurality of wind-guiding pillars and a plurality of wind-guiding holes. The locations of the wind-guiding pillars are opposite to the locations of the apertures; the wind-guiding holes are located around the wind-guiding pillars. The blower is disposed above the guiding plate and provides a gas to the guiding plate. The gas is guided into the apertures by means of the wind-guiding pillars and the wind-guiding holes and pushes completely the solder paste therein out. Thereby, accumulation of solder paste in the sidewalls of the apertures can be avoided. Consequently, deterioration of adhesion of electronic components caused by fewer amount of solder paste printed on the carrier can be prevented.
    Type: Application
    Filed: May 23, 2011
    Publication date: April 19, 2012
    Applicant: Wistron Corporation
    Inventors: Hao-Chun HSIEH, Hsin-Lun Tasi, Chia-Hsien Lee
  • Publication number: 20120078606
    Abstract: A developing system and method for optimizing the energy consumption of an application program for a DSP are provided.
    Type: Application
    Filed: September 28, 2010
    Publication date: March 29, 2012
    Inventors: Zhi-Yang Guo, Yu-Chung Tsao, Yu-Kai Wang, Mao-Sung Wu, Chun Hsieh, Tsai-Lin Lee
  • Publication number: 20120050009
    Abstract: An electronic device with unlocking function includes an accelerometer, an unlocking module, a touch screen and a storage. The accelerometer detects a direction of movement of the electronic device. The touch screen provides output and input for the electronic device. The touch screen detects a contact path of a user when the user contacts the touch screen. When the contact path matches an unlocking path stored in the storage, the electronic device is unlocked.
    Type: Application
    Filed: November 22, 2010
    Publication date: March 1, 2012
    Applicant: Foxconn Communication Technology Corp.
    Inventor: HSING-CHUN HSIEH
  • Publication number: 20120049197
    Abstract: A pixel structure is provided. A first insulating pattern is on the first polysilicon pattern. A second insulating pattern is on the second polysilicon pattern and separated from the first insulating pattern. An insulating layer covers the first and the second insulating patterns. A first gate and a second gate are on the insulating layer. A first covering layer covers the first and the second gates. A first source metal layer and a first drain metal layer are on the first covering layer and electrically connected to a first source region and a first drain region. A second source metal layer and a second drain metal layer are on the first covering layer and electrically connected to a second source region and a second drain region. A pixel electrode is electrically connected to the first drain metal layer.
    Type: Application
    Filed: January 11, 2011
    Publication date: March 1, 2012
    Applicant: AU OPTRONICS CORPORATION
    Inventors: Hsiu-Chun Hsieh, Yi-Wei Chen, Ta-Wei Chiu, Chung-Tao Chen