Abstract: A chip package structure including a substrate, a circuit layer, a solder mask, a chip, and an encapsulant is provided. The circuit layer is disposed on the substrate and includes two traces and a dummy trace. The dummy trace is disposed between the traces. The solder mask covers the circuit layer and the substrate. The chip is disposed on the solder mask and electrically connected to the traces. The encapsulant covers the solder mask and wraps the chip. The traces and the dummy trace extend from the inside of the area covered by the encapsulant to the outside of the area covered by the encapsulant. Because the dummy trace is used in the chip package structure, it can be avoided that the traces is pulled apart when the redundant encapsulant is removed after the encapsulant is formed.

Abstract: A method for improving within-wafer uniformity is provided. The method includes forming an electrical component by a first process step and a second process step, wherein the electrical component has a target electrical parameter. The method includes providing a first plurality of production tools for performing the first process step; providing a second plurality of production tools for performing the second process step; providing a wafer; performing the first process step on the wafer using one of the first plurality of production tools; and selecting a first route including a first production tool from the second plurality of production tools. A within-wafer uniformity of the target electrical parameter on the wafer manufactured by the first route is greater than a second route including a second production tool in the second plurality of production tools.

Abstract: Systems and methods for stream format conversion. A stream format conversion system converts data from a TS format to a PS format by selecting TS packets according to PID, filtering out TS headers and PES headers to obtain ES format data, and inserting PES and PS headers into the ES format data to generate PS packets.

Abstract: A light color adjustment structure for illuminated keyboards to resolve the shortcomings of conventional illuminated keyboards that generate mono light and unalterable includes a light source module located in an illuminated keyboard and a brightness control module located in the illuminated keyboard and electrically connected to the light source module. The light source module has at least a first light source and a second light source of different light colors that are mixed to generate a light color for the illuminated keyboard. The brightness control module generates a brightness control signal sent to the light source module to control the brightness of the light source module. Thus through brightness alterations and mixing of the first and second light sources varying light colors can be generated.

Abstract: The present disclosure relates generally to the manufacturing of semiconductor devices, and more particularly to an improved connection structure for semiconductor devices. A connection structure for a semiconductor device includes: a peanut-shaped opening comprising a narrow area and one or more wide areas, wherein the narrow area is between two of the one or more wide areas; and a conductive plug for filling at least partially the peanut-shaped opening.

Abstract: The present invention relates to a detection method to differentiate between egg-derived ingredients and chicken-derived ingredients (chicken parts/tissues, excluding eggs) in foods or other products and primer pairs and probes used for specifically detecting chicken in foods or products.

Abstract: A method is disclosed for controlling the sheet resistance of copper trenches formed on semiconductor wafers. The method includes forming a plurality of copper-filled trenches on a wafer, measuring the sheet resistance of each of the plurality of copper-filled trenches, and comparing the measured sheet resistance values to a predetermined sheet resistance value. Photolithography steps performed on subsequent wafers are adjusted according to a difference between the measured sheet resistance values and the predetermined value. In one embodiment, this adjustment takes the form of adjusting a photolithographic extension exposure energy to thereby adjust the cross-section of the resulting trenches.

Abstract: A method for improving within-wafer uniformity is provided. The method includes forming an electrical component by a first process step and a second process step, wherein the electrical component has a target electrical parameter. The method includes providing a first plurality of production tools for performing the first process step; providing a second plurality of production tools for performing the second process step; providing a wafer; performing the first process step on the wafer using one of the first plurality of production tools; and selecting a first route including a first production tool from the second plurality of production tools. A within-wafer uniformity of the target electrical parameter on the wafer manufactured by the first route is greater than a second route including a second production tool in the second plurality of production tools.

Abstract: The present invention relates to a detection method to differentiate between egg-derived ingredients and chicken-derived ingredients (chicken parts/tissues, excluding eggs) in foods or other products and primer pairs and probes used for specifically detecting chicken in foods or products.

Abstract: A light-emitting device and the fabrication method thereof. A substrate is provided. A plurality of active elements are formed on the substrate, defining a plurality of pixel areas. A color filter is formed on the pixel areas. The surface of the color filter is planarized to reduce roughness. An electrode is formed on the color filter. An light-emitting layer is formed on the electrode. A second electrode is formed on the light-emitting layer.

Abstract: A light-emitting device and the fabrication method thereof. A substrate is provided. A plurality of active elements are formed on the substrate, defining a plurality of pixel areas. A color filter is formed on the pixel areas. The surface of the color filter is planarized to reduce roughness. An electrode is formed on the color filter. An light-emitting layer is formed on the electrode. A second electrode is formed on the light-emitting layer.

Abstract: A chip package structure including a substrate, a circuit layer, a solder mask, a chip, and an encapsulant is provided. The circuit layer is disposed on the substrate and includes two traces and a dummy trace. The dummy trace is disposed between the traces. The solder mask covers the circuit layer and the substrate. The chip is disposed on the solder mask and electrically connected to the traces. The encapsulant covers the solder mask and wraps the chip. The traces and the dummy trace extend from the inside of the area covered by the encapsulant to the outside of the area covered by the encapsulant. Because the dummy trace is used in the chip package structure, it can be avoided that the traces is pulled apart when the redundant encapsulant is removed after the encapsulant is formed.

Abstract: A primary supramolecular structure is described. The primary supramolecular structure has a shape of ring-like disk. The shape of ring-like disk has a diameter of about 10 nanometers to about 60 nanometers. The mentioned primary supramolecular structure is formed by self-assembly of amphiphilic conjugate molecules. Moreover, a secondary supramolecular structure is described. The secondary supramolecular structure has a shape of ring-like disk. The shape of ring-like disk has a diameter of about 100 nanometers to about 300 nanometers. The mentioned secondary supramolecular structure is formed by self-assembly of amphiphilic conjugate molecules hybrid with metal alkoxides or non-metal alkoxides.

Abstract: A low-power delay buffer circuit is provided, which utilizes a ring counter as address decoder and a latch array for memory. To reduce power consumption, a gated-clock driver tree is applied to the ring-counter addressing architecture. Moreover, a similar gated-driver tree is applied to the input and output ports of the latch array. The delay buffer circuit not only could achieve a power consumption lower than SRAM-based delay buffers, but also could operation under high frequencies and take up less layout area than SRAM-based delay buffers.

Abstract: The present invention provides a method and an apparatus for mixing music. The method includes: utilizing a portable device to play an audio file, detecting a motion path of the portable device to generate a control signal, and mixing the audio file according to the control signal in order to mix a specific sound effect with a sound effect corresponding to the audio file, wherein the specific sound effect is selected from a plurality of sound effects.

Abstract: A micro-reflecting layer of the present invention used for polarized plates and display device comprises a transparent resin layer and a plurality of micro-reflecting particles. The micro-reflecting particles are uniformly implanted into the transparent resin, and light from an external source partially passes through the micro-reflecting particles and partially is reflected by the micro-reflecting particles to display an image. Furthermore, a plurality of optical diffusing particles is also added into the micro-reflecting layer so as to uniformly diffuse the light in the micro-reflecting layer.

Abstract: Systems and methods for stream format conversion. A stream format conversion system converts data from a TS format to a PS format by selecting TS packets according to PID, filtering out TS headers and PES headers to obtain ES format data, and inserting PES and PS headers into the ES format data to generate PS packets.

Abstract: Array substrates for electroluminescent (EL) devices and methods of forming the same are disclosed. The array substrates for electroluminescent (EL) devices include a substrate with at least one thin film transistor formed thereon, covered by a planarization layer. A first dielectric passivation layer with a contact hole therein covers parts of the planarization layer and exposes a source/drain electrode of the thin film transistor. A transparent electrode covers a portion of the first electric passivation layer and fills the contact hole, and is partly exposed by a patterned second dielectric passivation formed thereon. A plurality of spacers covers a portion of the second dielectric passivation layer to define an organic electroluminescent area with an exposed transparent electrode. An organic electroluminescent layer covers the exposed transparent electrode, and an electrode covers the organic electroluminescent layer.

Abstract: A low-power delay buffer circuit is provided, which utilizes a ring counter as address decoder and a latch array for memory. To reduce power consumption, a gated-clock driver tree is applied to the ring-counter addressing architecture. Moreover, a similar gated-driver tree is applied to the input and output ports of the latch array. The delay buffer circuit not only could achieve a power consumption lower than SRAM-based delay buffers, but also could operation under high frequencies and take up less layout area than SRAM-based delay buffers.

Abstract: An apparatus for image adjustment and an associated method are disclosed. The apparatus can determine an adjusted value of a pixel in an image frame by comparing the pixel and a correspondingly located pixel in a previous image frame. When there is much image variation, an adjustment is made for each pixel in an original image frame for display, thereby providing better visual effects.