Patents by Inventor Chun Chieh

Chun Chieh has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 12222488
    Abstract: An observation carrier for a microscope is provided. The observation carrier includes a bottom base, an upper cover, and a chip. The upper cover is detachably disposed on the bottom base and has a window. The chip is integrated on the upper cover and includes a main body and a plurality of electrodes. The main body has an observation region, and the observation region corresponds to the window and is adapted to carry a sample material. The electrodes are disposed on the main body and are connected to the observation region.
    Type: Grant
    Filed: October 14, 2021
    Date of Patent: February 11, 2025
    Assignee: FlowVIEW Tek
    Inventors: Po-Yang Peng, Chun-Chieh Liang, Liang-Hsun Lai, Cheng-Yu Lee, Hsin-Hung Lee
  • Patent number: 12224351
    Abstract: A semiconductor device includes a substrate, a first poly-material pattern, a first conductive element, a first semiconductor layer, and a first gate structure. The first poly-material pattern is over and protrudes outward from the substrate, wherein the first poly-material pattern includes a first active portion and a first poly-material portion joined to the first active portion. The first conductive element is over the substrate, wherein the first conductive element includes the first poly-material portion and a first metallic conductive portion covering at least one of a top surface and a sidewall of the first poly-material portion. The first semiconductor layer is over the substrate and covers the first active portion of the first poly-material pattern and the first conductive element. The first gate structure is over the first semiconductor layer located within the first active portion.
    Type: Grant
    Filed: July 13, 2023
    Date of Patent: February 11, 2025
    Assignee: Taiwan Semiconductor Manufacturing Company, Ltd.
    Inventors: Chao-Ching Cheng, Chun-Chieh Lu, Hung-Li Chiang, Tzu-Chiang Chen
  • Patent number: 12224001
    Abstract: The invention provides a layout pattern of static random access memory (SRAM), which at least comprises a plurality of gate structures located on a substrate and spanning the plurality of fin structures to form a plurality of transistors distributed on the substrate, wherein the plurality of transistors comprise two pull-up transistors (PU), two pull-down transistors (PD) to form a latch circuit, and two access transistors (PG) connected to the latch circuit. In each SRAM memory cell, the fin structure included in the pull-up transistor (PU) is defined as a PU fin structure, the fin structure included in the pull-down transistor (PD) is defined as a PD fin structure, and the fin structure included in the access transistor (PG) is defined as a PG fin structure, wherein a width of the PD fin structure is wider than a width of the PG fin structure.
    Type: Grant
    Filed: November 30, 2022
    Date of Patent: February 11, 2025
    Assignee: UNITED MICROELECTRONICS CORP.
    Inventors: Chun-Hsien Huang, Yu-Tse Kuo, Shu-Ru Wang, Li-Ping Huang, Yu-Fang Chen, Chun-Yen Tseng, Tzu-Feng Chang, Chun-Chieh Chang
  • Patent number: 12220726
    Abstract: The invention provides a silicide capacitive micro electromechanical structure and fabrication method thereof, comprising a substrate, a passivation layer, a silicon layer, a first metal layer, and a dielectric layer. The passivation layer is formed on the substrate; the silicon layer and the first metal layer are formed on the passivation layer. The first metal layer includes a contact part and a conductive part. The contact parts contact at least a part of the silicon layer, and the conductive portion extends away from the silicon layer to electrically connect an external circuit. The dielectric layer is formed on the passivation layer, and at least the silicon layer and the first metal layer are covered by the dielectric layer. After an annealing process is performed, the conductive portion remains in contact with the silicon layer after the silicidation reaction to maintain an electrical connection with the external circuit.
    Type: Grant
    Filed: October 13, 2022
    Date of Patent: February 11, 2025
    Assignee: TAIWAN-ASIA SEMICONDUCTOR CORPORATION
    Inventors: Di-Bao Wang, Chun-Chieh Lin
  • Publication number: 20250044270
    Abstract: A system for notifying environmental pollution status includes wireless environment sensing devices and a portable wireless environmental pollution status notification device. The wireless environment sensing devices, respectively arranged in the different sensing locations of a physical environment, respectively store the sensing locations and respectively sense pollution related information corresponding to the different sensing locations to output the pollution related information and the sensing locations corresponding thereto. The portable wireless environmental pollution status notification device, wirelessly connected to the plurality of wireless environment sensing devices and located in the physical environment, receives the pollution related information and the sensing locations corresponding thereto and generates notification signals based on the pollution related information and the sensing locations corresponding thereto.
    Type: Application
    Filed: July 15, 2024
    Publication date: February 6, 2025
    Inventors: CHIA-JUI YANG, HERMAN CHUNGHWA RAO, CHUN-CHIEH KUO, HUA-PEI CHIANG, SHUI-SHU HSIAO, ZHENG-XIANG CHANG, CHYI-DAR JANG, TSUNG-JEN WANG, CHE-YU LIAO, CHIH-MIN CHAN, TENG-CHIEH YANG, CHANG-HUNG HSU
  • Publication number: 20250048620
    Abstract: A memory device and a manufacturing method are provided. The memory device includes active regions defined in a semiconductor substrate by an isolation structure, wherein the active regions are arranged as an array along first and second directions, and extend along a third direction; and word lines, extending through the active regions along the second direction in the semiconductor substrate. The active regions are arranged in pairs along the second direction. The active regions in the same pair are closely adjacent to each other by a first spacing. Adjacent pairs of the active regions are separated by a greater second spacing. A featured portion of each active region below an intersecting word line has a first side closely adjacent to the other active region in the same pair by the first spacing and a second side separated from another pair of the active regions by the second spacing, and has an inclined top surface ascending from the second side to the first side.
    Type: Application
    Filed: September 4, 2023
    Publication date: February 6, 2025
    Applicant: Winbond Electronics Corp.
    Inventors: Ying-Hung Chen, Chun-Chieh Wang, Tzu-Ming Ou Yang
  • Patent number: 12219752
    Abstract: The present disclosure provides a method of manufacturing a semiconductor structure and a semiconductor structure. The method includes: providing a base and forming, on the base, a bit line contact region provided with a first groove; forming a first bit line contact layer in the first groove, wherein the first bit line contact layer in the first groove defines a second groove; forming a diffusion layer in the second groove, wherein the diffusion layer in the second groove defines a third groove; forming, in the third groove, a second bit line contact layer provided with a gap; and processing the diffusion layer.
    Type: Grant
    Filed: January 24, 2022
    Date of Patent: February 4, 2025
    Assignee: CHANGXIN MEMORY TECHNOLOGIES, INC.
    Inventors: Cheng Chen, Hai-Han Hung, Chun-Chieh Huang, Xiaoling Wang
  • Publication number: 20250039646
    Abstract: An internal radio wave transmission system of building includes a base layer and a transmission layer, with a radio wave transmission channel between the two layers. The radio wave transmission system in a building includes a signal transceiver device, a first reflective plate and a second reflective plate. The signal transceiver device is connected with a telecommunication room, and the signal transceiver device emits and receives radio wave signals. The first reflective plate is disposed in the channel and corresponds to positions of the base layer and the signal transceiver device to receive and guide the radio wave signals. The second reflective plate is disposed in the channel and corresponds to a position of the transmission layer to receive and guide the radio wave signals to terminal equipment located in the transmission layer. The invention ensures the effective transmission of the radio wave signals inside the building.
    Type: Application
    Filed: June 20, 2024
    Publication date: January 30, 2025
    Inventors: TZUU-YAW LU, HERMAN CHUNGHWA RAO, Chun-Chieh KUO, Hua-Pei CHIANG, CHYI-DAR JANG, TSUNG-JEN WANG, CHI-HUNG LIN, WEI-DI HWANG, FANG-CHI YEN, CHIEN-LI HOU
  • Publication number: 20250035603
    Abstract: A positioning pollutant-measuring system includes a cloud server, a wireless base station, an automatic moving vehicle, and a positioning pollutant-measuring device. The automatic moving vehicle carries the positioning pollutant-measuring device and passes through different locations. The positioning pollutant-measuring device receives location related parameters from the wireless base station and measures the air flow rates or the air humidity of the different locations to adjust a resolution for measuring pollutants corresponding to the different locations.
    Type: Application
    Filed: June 24, 2024
    Publication date: January 30, 2025
    Inventors: Chia-Jui YANG, HERMAN CHUNGHWA RAO, Chun-Chieh KUO, Hua-Pei CHIANG, Shui-Shu HSIAO, Zheng-Xiang CHANG, Chyi-Dar JANG, Tsung-Jen WANG, Che-Yu LIAO, Chih-Min CHAN, Teng-Chieh YANG, CHANG-HUNG HSU
  • Publication number: 20250039547
    Abstract: An image capture device includes a casing, a camera module, a rotatable member, and a pan-tilt module. The casing includes front and rear casings. The camera module is disposed in the casing. A portion of the camera module is through an opening region of the front casing. The camera module includes a lens module bracket and a lens module disposed therein. The rotatable member is fixed on the lens module bracket. The rotatable member is configured to rotate the camera module when the rotatable member is rotated relative to the casing, so that the lens module is switched between horizontal and vertical shooting modes. The pan-tilt module includes a motor bracket, first and second motors. The first motor is connected between one end of the motor bracket and a sidewall of the casing. The second motor is connected to another end of the motor bracket.
    Type: Application
    Filed: August 24, 2023
    Publication date: January 30, 2025
    Inventors: YUNG-TAI PAN, CHUN-CHIEH YEH
  • Publication number: 20250037672
    Abstract: A display may include an array of pixels. Each pixel in the array includes an organic light-emitting diode coupled to a drive transistor, a data loading transistor, a first capacitor for storing data charge, and a second capacitor. During a data programming phase, the data loading transistor may be activated to load in a data value onto the first capacitor. After the data programming phase, the second capacitor may be configured to receive a lower voltage, which extends a threshold voltage sampling time for the pixel. Configured and operated in this way, the temperature luminance sensitivity of the display can be reduced.
    Type: Application
    Filed: October 18, 2024
    Publication date: January 30, 2025
    Inventors: Shinya Ono, Chin-Wei Lin, Zino Lee, Chun-Chieh Lin, Chen-Ming Chen
  • Publication number: 20250018030
    Abstract: A pharmaceutical composition for promoting a cancer immunotherapy and a method for promoting a cancer immunotherapy are provided. The pharmaceutical composition includes an uncoupling protein 2 inhibitor and an interleukin-17 blockade. The method includes administering an effective concentration of a pharmaceutical composition to a subject in need thereof, in which the pharmaceutical composition includes an uncoupling protein 2 inhibitor and an interleukin-17 blockade.
    Type: Application
    Filed: April 30, 2024
    Publication date: January 16, 2025
    Applicant: China Medical University
    Inventors: Hung-Rong Yen, Chuan-Teng Liu, Ying-Chyi Song, Heng-Hsiung Wu, Chun-Chieh Yeh
  • Patent number: 12198876
    Abstract: A key structure including a first electrode, a key cap, and a restoration member is provided. The key cap is disposed on the first electrode. The restoration member is disposed between the key cap and the first electrode. The key cap or the restoration member has a second electrode. A sensing signal is generated by the second electrode with the key cap or the restoration member moving relative to the first electrode.
    Type: Grant
    Filed: December 15, 2021
    Date of Patent: January 14, 2025
    Assignee: Lite-On Technology Corporation
    Inventors: Chun-Chieh Huang, Ming-Fu Yen, Che Hung Wu, Juo-Tau Lee, Ta-Ching Lu, Chieh-Liang Hsiao, Wei-Pin Chuang
  • Publication number: 20250014945
    Abstract: A device structure can be formed by forming a layer stack comprising a continuous bottom electrode material layer, a continuous dielectric layer, and a continuous dielectric metal oxide layer; increasing an oxygen-to-metal ratio in a top surface portion of the continuous dielectric metal oxide layer by incorporating oxygen atoms into the top surface portion of the continuous dielectric metal oxide layer; depositing a continuous semiconductor layer over the continuous dielectric metal oxide layer; and patterning the continuous semiconductor layer and the layer stack to form a patterned layer stack including a bottom electrode, a dielectric layer, a dielectric metal oxide layer, and a semiconductor layer.
    Type: Application
    Filed: July 5, 2023
    Publication date: January 9, 2025
    Inventors: Yen-Chieh Huang, Huai-Ying Huang, Wei-Gang Chiu, Yu-Chuan Shih, Chun-Chieh Lu, Yu-Ming Lin
  • Patent number: 12193241
    Abstract: The present disclosure, in some embodiments, relates to a ferroelectric memory device. The ferroelectric memory device includes a multi-layer stack disposed on a substrate. The multi-layer stack has a plurality of conductive layers and a plurality of dielectric layers stacked alternately. A channel layer penetrates through the plurality of conductive layers and the plurality of dielectric layers. A ferroelectric layer is disposed between the channel layer and both of the plurality of conductive layers and the plurality of dielectric layers. A plurality of oxygen scavenging layers are disposed along sidewalls of the plurality of conductive layer. The plurality of oxygen scavenging layers laterally separate the ferroelectric layer from the plurality of conductive layers.
    Type: Grant
    Filed: June 16, 2023
    Date of Patent: January 7, 2025
    Assignee: Taiwan Semiconductor Manufacturing Company, Ltd.
    Inventors: Chun-Chieh Lu, Sai-Hooi Yeong, Bo-Feng Young, Yu-Ming Lin, Chih-Yu Chang
  • Publication number: 20250006762
    Abstract: An optical device and a method of fabricating the same are disclosed. The optical device includes a first die layer and a second die layer. The first die layer includes a first substrate having a first surface and a second surface opposite to the first surface, first and second pixel structures, an inter-pixel isolation structure disposed in the first substrate and surrounding the first and second pixel structures, and a floating diffusion region disposed in the first substrate and between the first and second pixel structures. The second die layer includes a second substrate having a third surface and a fourth surface opposite to the third surface and a pixel transistor group disposed on the third surface of the second substrate and electrically connected to the first and second pixel structures.
    Type: Application
    Filed: January 12, 2024
    Publication date: January 2, 2025
    Applicant: Taiwan Semiconductor Manufacturing Company, Ltd.
    Inventors: Chun-Chieh CHUANG, Hsin-Hung CHEN, Wen-I HSU, Peng-Chieh CHIN, Feng-Chi HUNG, Ming-En CHEN, Jen-Cheng LIU, Dun-Nian YAUNG
  • Patent number: 12178817
    Abstract: The present invention relates to a novel type of PPAR? modulator having a pyrimido[5,4-d]pyrimidine main structure. The PPAR? modulator can enhance the expression and nuclear translocation of PPAR? in cells. The present invention also relates to a pharmaceutical composition comprising the PPAR? modulator of the invention encapsulated in a pharmaceutically acceptable cell-penetrating drug delivery system so that it can be directly delivered into cells. The present invention thus provides a method of preventing or treating PPAR?-related disorders or conditions comprising administering to a subject in need thereof a therapeutically effective amount of the PPAR? modulator of the invention or the pharmaceutical composition of the invention.
    Type: Grant
    Filed: January 27, 2016
    Date of Patent: December 31, 2024
    Assignee: REALINN LIFE SCIENCE LIMITED
    Inventors: Jen Cheng Lin, Chun-Chieh Lin, Hsu-Tung Lee, Yu-Ming Fan, Jui-Chi Tsai, Ying-Chi Du
  • Patent number: 12172263
    Abstract: A chemical mechanical planarization (CMP) tool includes a platen and a polishing pad attached to the platen, where a first surface of the polishing pad facing away from the platen includes a first polishing zone and a second polishing zone, where the first polishing zone is a circular region at a center of the first surface of the polishing pad, and the second polishing zone is an annular region around the first polishing zone, where the first polishing zone and the second polishing zone have different surface properties.
    Type: Grant
    Filed: May 5, 2023
    Date of Patent: December 24, 2024
    Assignee: TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.
    Inventors: Michael Yen, Kao-Feng Liao, Hsin-Ying Ho, Chun-Wen Hsiao, Sheng-Chao Chuang, Ting-Hsun Chang, Fu-Ming Huang, Chun-Chieh Lin, Peng-Chung Jangjian, Ji James Cui, Liang-Guang Chen, Chih Hung Chen, Kei-Wei Chen
  • Publication number: 20240420661
    Abstract: A protocol conversion circuit and a protocol conversion method are provided. The protocol conversion circuit includes a DisplayPort™ (DP) receiver, a control analysis circuit, a downstream transmitter and a frame buffer. The DP receiver analyzes a DP signal to obtain video data and packet information. The control analysis circuit determines whether the packet information indicates that a live function or a panel replay (PR) function is activated, and controls, in response to determining that the live function is activated, the frame buffer to store received current video data and transmits it to the downstream transmitter; and controls the frame buffer to discard the received current video data, or update previous video data stored in the frame buffer with a specified range in the current video data, and sends latest video data to the downstream transmitter, so as to output a target signal to the second electronic device.
    Type: Application
    Filed: April 17, 2024
    Publication date: December 19, 2024
    Inventors: CHUN-CHIEH CHAN, HUNG-SHAO CHEN, TAI-JUNG WU, Wen-Hsia Kung
  • Patent number: 12170202
    Abstract: The present disclosure relates to a semiconductor device and a manufacturing method of fabricating a semiconductor structure. The method includes forming an opening in a substrate and depositing a conformal metal layer in the opening. The depositing includes performing one or more deposition cycles. The deposition includes flowing a first precursor into a deposition chamber and purging the deposition chamber to remove at least a portion of the first precursor. The method also includes flowing a second precursor into the deposition chamber to form a sublayer of the conformal metal layer and purging the deposition chamber to remove at least a portion of the second precursor. The method further includes performing a metallic halide etching (MHE) process that includes flowing a third precursor into the deposition chamber.
    Type: Grant
    Filed: January 2, 2023
    Date of Patent: December 17, 2024
    Assignee: Taiwan Semiconductor Manufacturing Co., Ltd.
    Inventors: Po-Yu Lin, Chi-Yu Chou, Hsien-Ming Lee, Huai-Tei Yang, Chun-Chieh Wang, Yueh-Ching Pai, Chi-Jen Yang, Tsung-Ta Tang, Yi-Ting Wang