Abstract: A power tool is provided with a perforated material remover to remove perforated material from power tool cutting implements. The power tool also includes a rip guide which has a long guide edge and two attachment points to the shoe/base of the saw. The rip guide is attached to the base/shoe via a pair of L-shaped openings that accept L-shaped support arms of the rip guide. The rip guide can also be folded for compact storage. The power tool also includes dual bevel scales for quickly and easily setting the bevel angle on the power tool.

Abstract: A connector apparatus with indication function includes a first power line, a current-detecting resistor, a second power line, a ground line, a current-detecting unit, a first voltage comparator, a second voltage comparator, a first light-emitting unit, a second light-emitting unit, and a voltage division unit. The first light-emitting unit is lighting but the second light-emitting unit is not lighting when one side of the connector apparatus is connected to a computer and the other side of the connector apparatus is not connected to a smart 3C electronic product. The first light-emitting unit is not lighting but the second light-emitting unit is lighting when one side of the connector apparatus is connected to a computer and the other side of the connector apparatus is connected to a smart 3C electronic product.

Abstract: Provided is a method of fabricating an image sensor device. The method includes providing a device substrate having a front side and a back side. The method includes forming first and second radiation-sensing regions in the device substrate, the first and second radiation-sensing regions being separated by an isolation structure. The method also includes forming a transparent layer over the back side of the device substrate. The method further includes forming an opening in the transparent layer, the opening being aligned with the isolation structure. The method also includes filling the opening with an opaque material.

Abstract: Provided is an image sensor device. The image sensor device includes a substrate having a front side and a back side. The image sensor also includes a radiation-detection device that is formed in the substrate. The radiation-detection device is operable to detect a radiation wave that enters the substrate through the back side. The image sensor further includes a recrystallized silicon layer. The recrystallized silicon layer is formed on the back side of the substrate. The recrystallized silicon layer has different photoluminescence intensity than the substrate.

Abstract: A system and method for fabricating a 3D image sensor structure is disclosed. The method comprises providing an image sensor with a backside illuminated photosensitive region on a substrate, applying a first dielectric layer to the first side of the substrate opposite the substrate side where image data is gathered, and applying a semiconductor layer that is optionally polysilicon, to the first dielectric layer. A least one control transistor may be created on the first dielectric layer, within the semiconductor layer and may optionally be a row select, reset or source follower transistor. An intermetal dielectric may be applied over the first dielectric layer; and may have at least one metal interconnect disposed therein. A second interlevel dielectric layer may be disposed on the control transistors. The dielectric layers and semiconductor layer may be applied by bonding a wafer to the substrate or via deposition.

Abstract: An antenna array (1000) includes a horizontal ground layer (40) having a central hole (401), a radiation layer parallel to the ground layer, and a coaxial cable (5) assembled to the ground layer. The cable includes a central conductor (51), an insulated layer (53) coated on the central conductor, and a grounding coat (52) coated on the insulated layer. The central conductor extends through the central hole from a bottom side of the ground layer and keeping insulated from the ground layer. The radiation layer includes a number of radiation units (30) which are coplanar with each other and parallel to the ground layer. Each radiation unit has a nail (301) extending downwardly towards the ground layer. The nail resonates with the central conductor when the antenna array is transmitting or receiving radio frequency signals.

Abstract: A method, apparatus, and stored instructions are provided for transforming a query representation by unnesting a predicate condition that is based on whether or not a result exists for a subquery of the predicate condition. An initial query representation is received. The initial query representation represents an initial query that includes an EXISTS-equivalent predicate or a NOT-EXISTS-equivalent predicate and at least one other predicate in a disjunction. The initial query representation is transformed into a semantically equivalent transformed query representation that represents a transformed query. The transformed query includes, instead of the EXISTS-equivalent predicate or a NOT-EXISTS-equivalent predicate, a join operator that references the data object.

Abstract: A varnish composition includes composition (A): an epoxy resin, composition (B): a hardener, composition (C): an accelerator, composition (D): phosphor-containing flame retardant, and composition (E): fillers, wherein composition (A) includes composition (A-1): phosphor-containing epoxy resin, phosphor-containing and silicon-containing epoxy resin, or a mixture thereof; composition (A-2): dicyclopentadiene epoxy resin; and composition (A-3): oxazolidone epoxy resin.

Abstract: A method for identifying hot spots by providing an electronic map and receiving terminal data from plurality of mobile terminals. The terminal data comprising position information of the corresponding mobile terminal, time information when the terminal date from the corresponding mobile terminal is received. The method further determining positions on the electronic map to be hot spots based on the number of the terminal data received from the same position in a predetermined time period according to the terminal data.

Abstract: A radio frequency(RF) printed circuit board (PCB) includes an RF circuit for generating high frequency signals. The RF PCB is connected to an EMC measuring device when measuring the EMC thereof. The measuring device includes a probe pin and a shielding barrel surrounding the probe pin. The shielding barrel includes an end surface at a distal end thereof. The RF PCB further includes a test node connected to the RF circuit and a ground node surrounding the test node. The test node contacts the probe pin and outputs the high frequency signals when measuring the EMC of the RF PCB. The ground node corresponds to the end surface and contacts the end surface while the probe pin contacts the test node.

Abstract: A transmission line with rotatable connector includes an insulated body, a connector a transmission line and a rotatable assembly kit. The insulated body includes a storage space. One end of the insulated body includes an opening slot and the other end of the insulating body includes a sliding slot. The connector is inside of the storage space. One end of the connector protrudes from the opening slot. One end of the transmission line is embedded in the storage space and electronically connected with the connector. The other end of the transmission line protrudes from the insulated body. The rotatable assembly kit includes a rotatable cylinder and a wire cover extending from one side of the rotatable cylinder. The rotatable cylinder is rotatably and pivotally connected to the rear of the connector.

Abstract: The present invention discloses a graphene manufacturing system and the method thereof. In the prior arts, in order to grow graphene layers, a metal foil or thin film has to be prepared and disposed either on the surface or in the vicinity of the of the work piece so as to catalyze the decomposition of carbon feedstock nearby. In contrast, the present invention uses a fluid which contains catalyst metal ions as the source of catalysts and imports the catalytic particles from outside of the working chamber. The metal particles catalyze the decomposition of carbon feedstock at high temperature and cause the direct growth of graphene layers on insulator substrates. Therefore, the present invention is able to use cost-effective materials as the source of catalysts to grow graphene for practical applications.

Abstract: A system and method for fabricating a 3D image sensor structure is disclosed. The method comprises providing an image sensor with a backside illuminated photosensitive region on a substrate, applying a first dielectric layer to the first side of the substrate opposite the substrate side where image data is gathered, and applying a semiconductor layer that is optionally polysilicon, to the first dielectric layer. A least one control transistor may be created on the first dielectric layer, within the semiconductor layer and may optionally be a row select, reset or source follower transistor. An intermetal dielectric may be applied over the first dielectric layer; and may have at least one metal interconnect disposed therein. A second interlevel dielectric layer may be disposed on the control transistors. The dielectric layers and semiconductor layer may be applied by bonding a wafer to the substrate or via deposition.

Abstract: Provided is a method of fabricating an image sensor device. The method includes providing a first substrate having a radiation-sensing region disposed therein. The method includes providing a second substrate having a hydrogen implant layer, the hydrogen implant layer dividing the second substrate into a first portion and a second portion. The method includes bonding the first portion of the second substrate to the first substrate. The method includes after the bonding, removing the second portion of the second substrate. The method includes after the removing, forming one or more microelectronic devices in the first portion of the second substrate. The method includes forming an interconnect structure over the first portion of the second substrate, the interconnect structure containing interconnect features that are electrically coupled to the microelectronic devices.

Abstract: Disclosed is a high-efficiency LED driver chip and a driver circuit of the chip, and the driver chip includes a detection unit, a comparison unit and a correction unit. The LED detection unit detects the operating current of the LED driver circuit by an external sensing resistor and an internal current mirror to output a setup signal, and the comparison unit detects the driving current of at least one LED by an external comparing resistor to output an initialization signal, so that the correction unit can output a correction signal according to the setup signal and the initialization signal to reduce the power loss of the circuit while maintaining the driving current constant, so as to improve the illumination quality and the service life of the LED.

Abstract: The invention provides a flash memory apparatus. In one embodiment, the flash memory apparatus comprises a flash memory and a flash memory controller. The flash memory comprises a write circuit and a memory cell array comprising a plurality of memory cells, wherein the write circuit is coupled to the memory cell array to write data in the memory cells. The flash memory controller is coupled to the write circuit, obtains a total capacity and a used data amount of the flash memory, and directs the write circuit to perform data writing in a one-bit mode when a ratio of the user data amount to the total capacity is less than a first predetermined value.

Abstract: An approach is provided for forming a backside illuminated image sensor that includes a semiconductor substrate having a front side and backside, a sensor element formed overlying the frontside of the semiconductor substrate, and a capacitor formed overlying the sensor element.

Abstract: A method of efficacy anticipation and failure examination for an apparatus is disclosed. The method first establishes an anticipation model, and then trains the anticipation model by calibrating the same using errors obtained between a realistic data and an anticipated data, so as to use the calibrated anticipation model to estimate the performance efficacy of an apparatus or any component in the apparatus, and also to acknowledge if there is any abnormality occurred during the operation of the apparatus or the component.

Abstract: An electronic device with a plurality of touch sensing modules and a heat dissipating control method thereof are provided. The heat dissipating control method includes following steps: detecting whether an object approaches the electronic device or the electronic device is touched to generate a sensing result; recognizing an executable scenario solution according to the sensing result, and cooling the electronic device according to the executable scenario solution.

Abstract: A light tunnel for use in an optical projection system, comprising: a plurality of reflecting plates, each said reflecting plate being disposed between and connected to the other two said reflecting plates, so that a light passage with a hollow structure is defined by said plurality of reflecting plates. At least one of said reflecting plates has a first surface in an inclined structure, said reflecting plate having said first surface is disposed between and obliquely connected to the other two said reflecting plates for forming said light passage having a non-rectangular cross section, and said first surface of said reflecting plate is abutted against an adjoined reflecting plate to form a junction with no gap between said first surface of said reflecting plate and said adjoined reflecting plate.