Abstract: A method of calibrating a compact model for a lithographic process is described. In this method, the nominal compact model can be provided. Notably, an input energy effect can be separated from chemical effects and other factors regarding the photoresist. Using a processor, the compact model can be calibrated based on the input energy, thereby generating an energy-sensitive compact model. The energy-sensitive compact model can quickly construct 3D resist profiles capturing resist profile degradation at any horizontal plane. Because this method does not change any form of compact modeling, it can be integrated as is into validation and correction processes. In other embodiments, the energy-sensitive compact model can be further calibrated based on one or more of the chemical effects and/or other factors.

Abstract: A method includes obtaining image data for a patient. The image data corresponds to acquisition data from an imaging acquisition from a set of planned image acquisitions in an examination plan for the patient. The method further includes analyzing the image data with a processor based on an imaging practice guideline and producing electronically formatted data indicative of the analysis. The processor generates a signal indicative of a recommendation of a change to the examination plan based on the data indicative of the analysis.

Abstract: A method to fabricate an image sensor includes providing a semiconductor substrate having a pixel region and a periphery region, forming a light sensing element on the pixel region, and forming at least one transistor in the pixel region and at least one transistor in the periphery region. The step of forming the at least one transistor in the pixel region and periphery region includes forming a gate electrode in the pixel region and periphery region, depositing a dielectric layer over the pixel region and periphery region, partially etching the dielectric layer to form sidewall spacers on the gate electrode and leaving a portion of the dielectric layer overlying the pixel region, and forming source/drain (S/D) regions by ion implantation.

Abstract: An imaging system containing an electron-multiplying charge-coupled device detector and line-scan spectrograph is used for identifying wholesome and unwholesome freshly slaughtered chicken carcasses on high-speed commercial chicken processing lines. Multispectral imaging algorithms allow for real-time online identification of wholesome and unwholesome chicken carcasses.

Abstract: A manufacturing method of a color filter including following steps is provided. First, a partition is formed on a substrate to form a plurality of pixel regions on the substrate. Next, a color pigment is provided along a continuous pigment-providing route, so as to form the color pigment on a sequence of pixel regions among the plurality of pixel regions and the partition. The method mentioned above can prevent the unfilled phenomenon of the pigment around the corners of the pixel region. Besides, a liquid crystal display panel having the color filter is also provided.

Abstract: A method for controlling data write operation of a mass storage device is provided. The mass storage device has a controller and a memory unit. The method includes connecting the mass storage device to a host device, and receiving a voltage provided from the host device; sensing and monitoring whether the voltage is lower than a first predefined voltage; writing data to the mass storage device with a first frequency when the sensed voltage is higher than the first predefined voltage; and writing data to the mass storage device with a second frequency when the sensed voltage is lower than the first predefined voltage, wherein the second frequency is adjusted by decreasing the first frequency.

Abstract: Provided is an image sensor device. The image sensor device includes a substrate having a front side and a back side. The image sensor also includes a radiation-detection device that is formed in the substrate. The radiation-detection device is operable to detect a radiation wave that enters the substrate through the back side. The image sensor further includes a recrystallized silicon layer. The recrystalized silicon layer is formed on the back side of the substrate. The recrystalized silicon layer has different photoluminescence intensity than the substrate.

Abstract: A method of forming a backside illuminated image sensor includes forming a guard ring structure of a predetermined depth in a front-side surface of a semiconductor substrate, the guard ring structure outlining a two-dimensional array of pixels, each pixel of the array of pixels separated from an adjacent pixel by the guard ring structure. The method further includes forming at least one image sensing element on the front-side surface of the semiconductor substrate, the at least one image sensing element being formed in a pixel of the array of pixels and surrounded by the guard ring structure. The method further includes reducing a thickness of the semiconductor substrate until the guard ring structure is co-planar with a back-side surface of the semiconductor substrate.

Abstract: A color filter substrate including a substrate, a black matrix layer and a color filter substrate layer is provided. The substrate has a plurality of grooves. The black matrix layer is disposed on the substrate between each two adjacent grooves, wherein the black matrix layer extends to the region above the groove from the edge of the groove and an undercut profile forms between the bottom of black matrix and the substrate. The color filter layer including a plurality of filter films separated is filled in the plurality of grooves and the plurality of filter films is separated from each other by the black matrix layer. In addition, a method of fabricating a color filter substrate is also provided. The above-mentioned color filter substrate and the fabricating method thereof can improve the quality and color uniformity of the color filter substrate.

Abstract: A light measurement system measures light characteristics of a plurality of light sources and includes a processing unit, a plurality of capturing modules, a plurality of signal conversion units, and a demultiplexing unit. The processing unit generates a control signal for controlling the capturing modules to capture the light characteristics of the light sources. After capturing the light characteristics, the capturing modules output captured frequency-related data corresponding to the light characteristics respectively. Then, the capture frequency-related data are converted into capture bit codes by the signal conversion units respectively. Under the control of the processing unit, the demultiplexing unit selectively sends the capture bit code of each of the signal conversion units to the processing unit. Accordingly, the light measurement system measures the light sources synchronously and allows the demultiplexing unit to send the capture bit code of any one of the light sources to the processing unit.

Abstract: An inner-layer heat-dissipating board and a multi-chip stack package structure having the inner-layer heat-dissipating board are disclosed. The inner-layer heat-dissipating board includes a metal board body formed with a plurality of penetrating conductive through holes each comprising a plurality of nano wires and an oxidative block having nano apertures filled with the nano wires. The multi-chip stack package structure includes a first chip and an electronic component respectively disposed on the inner-layer heat-dissipating board to thereby facilitate heat dissipation in the multi-chip stack structure as well as increase the overall package rigidity.

Abstract: A light measurement system measures light characteristics of a plurality of light sources and includes a processing unit, a plurality of capturing modules, a plurality of signal conversion units, and a demultiplexing unit. The processing unit generates a control signal for controlling the capturing modules to capture the light characteristics of the light sources. After capturing the light characteristics, the capturing modules output captured frequency-related data corresponding to the light characteristics respectively. Then, the capture frequency-related data are converted into capture bit codes by the signal conversion units respectively. Under the control of the processing unit, the demultiplexing unit selectively sends the capture bit code of each of the signal conversion units to the processing unit. Accordingly, the light measurement system measures the light sources synchronously and allows the demultiplexing unit to send the capture bit code of any one of the light sources to the processing unit.

Abstract: Provided is an image sensor device. The image sensor device includes a device substrate having a front side and a back side. The device substrate has a radiation-sensing region that can sense radiation that has a corresponding wavelength. The image sensor also includes a first layer formed over the front side of the device substrate. The first layer has a first refractive index and a first thickness that is a function of the first refractive index. The image sensor also has a second layer formed over the first layer. The second layer is different from the first layer and has a second refractive index and a second thickness that is a function of the second refractive index.

Abstract: A MEMS microphone chip with an expanded back chamber includes a first chip unit and a second chip unit. The first chip unit has a first substrate, a vibration membrane layer is formed. above an end of the first substrate, and a space is formed below the vibration membrane layer of the first substrate, so that the vibration membrane layer is suspended above the first substrate to vibrate. The second chip unit has a second substrate to couple with another end of the first substrate, and a groove is formed in the second substrate with. a width larger than that of the space; when the first substrate and the second substrate are coupled together, the groove and the space are connected together to act as the back chamber of the vibration membrane layer.

Abstract: A network flow abnormality detection system and method for detecting at least one network packet to determine whether a flow condition of the network packet is abnormal. The network packet includes L bit data element values. The method is fetching M data element values in above-mentioned L bit data element values by data element value fetch unit, wherein M is an odd number and larger than 1; N parallel processing units receive and process above-mentioned M data element values; comparison module compares above-mentioned M data element values and a standard threshold to generate M comparison result values; sum unit sums above-mentioned M comparison result values to obtain a comparison sum value; determination unit compares the comparison sum value and an abnormality threshold, wherein when the comparison sum value is larger than the abnormality threshold, the determination unit determines the flow condition is abnormal.

Abstract: A device includes a diode, which includes a first, a second, and a third doped region in a semiconductor substrate. The first doped region is of a first conductivity type, and has a first impurity concentration. The second doped region is of the first conductivity type, and has a second impurity concentration lower than the first impurity concentration. The second doped region encircles the first doped region. The third doped region is of a second conductivity type opposite the first conductivity type, wherein the third doped region overlaps a portion of the first doped region and a portion of the second doped region.

Abstract: A method includes identifying medical concepts in identified patient cases that are missing from medical concepts in first electronically formatted medical information as missing medical concepts, and selecting an imaging protocol for an imaging procedure based on a combination of the medical concepts from the first electronically formatted medical information and the missing medical concepts, and generating a signal indicative of the selected imaging protocol. A method includes identifying at least one of one or more medical concepts as a relevant additional concept, and selecting an imaging protocol for the imaging procedure based on a combination of one or more clinical indications and the relevant additional concept, and generating a signal indicative of the selected imaging protocol.

Abstract: A method includes obtaining electronically formatted information about previously performed imaging procedures, classifying the information into groups of protocols based on initially selected protocols for the previously performed imaging procedures and generating data indicative thereof, identifying deviations between the classified information and the corresponding initially selected protocols for the previously performed imaging procedures, and generating a signal indicative of the deviations. A method includes recommending at least one of a plurality of protocols for an imaging procedure based on at least one of a score, a probability, or a pre-determined rule, which is based on extracted medical concepts from patient information and extracted medical concepts from previously imaged patient information, and generating a signal indicative of the recommendation.

Abstract: A carrier with the optical registration function is disclosed. The carrier allows the registration of inspected results of the sampling images of the sample to the corresponding address codes of the address coding site of the carrier.

Abstract: BSI image sensors and methods. In an embodiment, a substrate is provided having a sensor array and a periphery region and having a front side and a back side surface; a bottom anti-reflective coating (BARC) is formed over the back side to a first thickness, over the sensor array region and the periphery region; forming a first dielectric layer over the BARC; a metal shield is formed; selectively removing the metal shield from over the sensor array region; selectively removing the first dielectric layer from over the sensor array region, wherein a portion of the first thickness of the BARC is also removed and a remainder of the first thickness of the BARC remains during the process of selectively removing the first dielectric layer; forming a second dielectric layer over the remainder of the BARC and over the metal shield; and forming a passivation layer over the second dielectric layer.