Patents by Inventor Chun Hsu

Chun Hsu has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20240097090
    Abstract: A display device including at least two light source modules and a display control substrate is provided. Each of the at least two light source substrates has a first surface and a second surface opposite to each other and includes a plurality of light emitting elements and a plurality of connection pads. The light emitting elements are located on the second surface, and the connection pads are located on the first surface and are electrically connected to the light emitting elements. The display control substrate includes a back plate and a plurality of control elements. The control elements are located on the back plate, part of the control elements are electrically connected to the connection pads to drive and control the light emitting elements, and the second surface of each of the at least two light source substrates forms a part of a display surface of the display device.
    Type: Application
    Filed: September 13, 2023
    Publication date: March 21, 2024
    Applicant: Coretronic Corporation
    Inventors: Ming-Chuan Chih, Wen-Chun Wang, Chun-Chi Hsu, Bo-Chih Pan, Yu-Wei Liang
  • Publication number: 20240099154
    Abstract: A magnetoresistive random access memory (MRAM) device includes a first array region and a second array region on a substrate, a first magnetic tunneling junction (MTJ) on the first array region, a first top electrode on the first MTJ, a second MTJ on the second array region, and a second top electrode on the second MTJ. Preferably, the first top electrode and the second top electrode include different nitrogen to titanium (N/Ti) ratios.
    Type: Application
    Filed: November 21, 2023
    Publication date: March 21, 2024
    Applicant: UNITED MICROELECTRONICS CORP
    Inventors: Hui-Lin Wang, Si-Han Tsai, Dong-Ming Wu, Chen-Yi Weng, Ching-Hua Hsu, Ju-Chun Fan, Yi-Yu Lin, Che-Wei Chang, Po-Kai Hsu, Jing-Yin Jhang
  • Patent number: 11937415
    Abstract: A method of forming a semiconductor device includes providing a substrate including a circuit region and a well strap region, forming a mandrel extending from the circuit region to the well strap region, depositing mandrel spacers on sidewalls of the mandrel, removing the mandrel in the circuit region, while the mandrel in the well strap region remains intact, patterning the substrate with the mandrel spacers in the circuit region and the mandrel in the well strap region as an etch mask, thereby forming at least a first fin in the circuit region and a second fin in the well strap region, and epitaxially growing a first epitaxial feature over the first fin in the circuit region and a second epitaxial feature over the second fin in the well strap region. A width of the second fin is larger than a width of the first fin.
    Type: Grant
    Filed: July 27, 2022
    Date of Patent: March 19, 2024
    Assignee: TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.
    Inventors: Chih-Chuan Yang, Kuo-Hsiu Hsu, Feng-Ming Chang, Wen-Chun Keng, Lien Jung Hung
  • Patent number: 11931187
    Abstract: A method for predicting clinical severity of a neurological disorder includes steps of: a) identifying, according to a magnetic resonance imaging (MRI) image of a brain, brain image regions each of which contains a respective portion of diffusion index values of a diffusion index, which results from image processing performed on the MRI image; b) for one of the brain image regions, calculating a characteristic parameter based on the respective portion of the diffusion index values; and c) calculating a severity score that represents the clinical severity of the neurological disorder of the brain based on the characteristic parameter of the one of the brain image regions via a prediction model associated with the neurological disorder.
    Type: Grant
    Filed: March 16, 2018
    Date of Patent: March 19, 2024
    Assignees: Chang Gung Medical Foundation Chang Gung Memorial Hospital at Keelung, Chang Gung Memorial Hospital, Linkou, Chang Gung University
    Inventors: Jiun-Jie Wang, Yi-Hsin Weng, Shu-Hang Ng, Jur-Shan Cheng, Yi-Ming Wu, Yao-Liang Chen, Wey-Yil Lin, Chin-Song Lu, Wen-Chuin Hsu, Chia-Ling Chen, Yi-Chun Chen, Sung-Han Lin, Chih-Chien Tsai
  • Publication number: 20240085614
    Abstract: An anti-peep light source module includes a light source module and a viewing angle switching module. The light source module has a light source and a light guide plate (LGP) and has light emitting elements arranged along a first direction. The viewing angle switching module is located on a transmission path of an illumination beam of the light source module and includes a viewing angle limiting element and a viewing angle adjusting element configured to change a viewing angle of the illumination beam. The viewing angle limiting element has a grating structure and is located between the viewing angle adjusting element and the light source module. an included angle between an extension direction of the grating structure and the first direction is within a range from 88 degrees to 92 degrees. The anti-peep light source module and A display device achieve favorable optical performance, user experience, and production yield.
    Type: Application
    Filed: September 8, 2023
    Publication date: March 14, 2024
    Applicant: Coretronic Corporation
    Inventors: Yi-Cheng Lin, Chih-Hsuan Kuo, Sung-Chun Hsu, Ming-Hsiung Fan, Tzeng-Ke Shiau
  • Publication number: 20240084069
    Abstract: A resin matrix composition is provided in the present invention. The resin matrix composition includes an epoxy resin, a polysulfone engineering plastic, a modified polyetherimide and an amine curing agent. The modified polyetherimide is formed from a nucleophilic compound and polyetherimide. The nucleophilic compound has a nucleophile such as hydroxyl group, sulfhydryl group, carboxyl group and/or amine group. Therefore, a resin matrix with two phase separation of island phase and co-continuous phase is formed. The resin matrix can have both great flexural strength and toughness. Moreover, the resin matrix has suitable viscosity, such that it is appropriate for impregnating carbon fiber to produce prepreg and carbon fiber composites.
    Type: Application
    Filed: August 21, 2023
    Publication date: March 14, 2024
    Inventors: Yu-Cheng HSU, Tang-Chun KAO, Hsuan-Yin CHEN, Long-Tyan HWANG
  • Publication number: 20240084447
    Abstract: A sealing article includes a body and a coating layer disposed on at least one surface of the body. The body comprises a polymeric elastomer such as perfluoroelastomer or fluoroelastomer. The coating layer comprises at least one metal. The sealing article may be a seal, a gasket, an O-ring, a T-ring or any other suitable product. The sealing article is resistant to ultra-violet (UV) light and plasma, and may be used for sealing a semiconductor processing chamber.
    Type: Application
    Filed: November 17, 2023
    Publication date: March 14, 2024
    Inventors: Peng-Cheng Hong, Jun-Liang Pu, W.L. Hsu, Chung-Hao Kao, Chia-Chun Hung, Cheng-Yi Wu, Chin-Szu Lee
  • Publication number: 20240086612
    Abstract: An IC device includes first through third rows of fin field-effect transistors (FinFETs), wherein the second row is between and adjacent to each of the first and third rows, the FinFETs of the first row are one of an n-type or p-type, the FinFETs of the second and third rows are the other of the n-type or p-type, the FinFETs of the first and third rows include a first total number of fins, and the FinFETs of the second row include a second total number of fins one greater or fewer than the first total number of fins.
    Type: Application
    Filed: November 22, 2023
    Publication date: March 14, 2024
    Inventors: Po-Hsiang HUANG, Fong-Yuan CHANG, Clement Hsingjen WANN, Chih-Hsin KO, Sheng-Hsiung CHEN, Li-Chun TIEN, Chia-Ming HSU
  • Publication number: 20240085678
    Abstract: Various embodiments of the present disclosure are directed towards a camera module comprising flat lenses. Flat lenses have reduced thicknesses compared to other types of lenses, whereby the camera module may have a small size and camera bumps may be omitted or reduced in size on cell phones and the like incorporating the camera module. The flat lenses are configured to focus visible light into a beam of white light, split the beam into sub-beams of red, green, and blue light, and guide the sub-beams respectively to separate image sensors for red, green, and blue light. The image sensors generate images for corresponding colors and the images are combined into a full-color image. Optically splitting the beam into the sub-beams and using separate image sensors for the sub-beams allows color filters to be omitted and smaller pixel sensors. This, in turn, allows higher quality imaging.
    Type: Application
    Filed: May 8, 2023
    Publication date: March 14, 2024
    Inventors: Jung-Huei Peng, Chun-Wen Cheng, Yi-Chien Wu, Tsun-Hsu Chen
  • Patent number: 11925226
    Abstract: A textile includes: (1) a matrix; and (2) particulate fillers dispersed within the matrix. The textile has a transmittance of infrared radiation at a wavelength of 9.5 ?m of at least about 40%, and the textile has a weighted average reflectivity of radiation over a wavelength range of 0.3 ?m to 2 ?m of at least about 40%.
    Type: Grant
    Filed: February 4, 2019
    Date of Patent: March 12, 2024
    Assignee: The Board of Trustees of The Leland Stanford Junior University
    Inventors: Yi Cui, Shanhui Fan, Lili Cai, Alex Y. Song, Wei Li, Po-Chun Hsu
  • Patent number: 11927392
    Abstract: The present disclosure is directed to a wafer drying system and method that detects airborne molecular contaminants in a drying gas as a feedback parameter for a single wafer or multi-wafer drying process. For example, the system comprises a wafer drying station configured to dispense a drying gas over one or more wafers to dry the one or more wafers, a valve configured to divert the drying gas to a first portion and a second portion, and an exhaust line configured to exhaust the first portion of the drying gas. The system further comprises a detector configured to receive the second portion of the drying gas and to determine a real time property of the second portion of the drying gas, and a control unit configured to control a feedback operation of the wafer drying station based on the real time property of the second portion of the drying gas.
    Type: Grant
    Filed: March 29, 2021
    Date of Patent: March 12, 2024
    Assignee: Taiwan Semiconductor Manufacturing Co., Ltd.
    Inventors: Wei-Chun Hsu, Sheng-Wei Wu, Shu-Yen Wang
  • Patent number: 11929333
    Abstract: An integrated fan-out (InFO) package includes a die, an encapsulant, a redistribution structure, a slot antenna, an insulating layer, a plurality of conductive structures, and an antenna confinement structure. The encapsulant laterally encapsulates the die. The redistribution structure is disposed on the die and the encapsulant. The slot antenna is disposed above the redistribution structure. The insulating layer is sandwiched between the redistribution structure and the slot antenna. The conductive structures and the antenna confinement structure extend from the slot antenna to the redistribution structure.
    Type: Grant
    Filed: May 10, 2022
    Date of Patent: March 12, 2024
    Assignee: Taiwan Semiconductor Manufacturing Company, Ltd.
    Inventors: Chuei-Tang Wang, Tzu-Chun Tang, Chieh-Yen Chen, Che-Wei Hsu
  • Publication number: 20240079758
    Abstract: An electronic device includes a metal back cover, a metal frame, and a first, second, third, and fourth radiators. The metal frame includes a discrete part and two connection parts. The connection parts are located by two sides of the discrete part, separated from the discrete part, and connected to the metal back cover. A U-shaped slot is formed between the discrete part and the metal back cover and between the discrete part and the connection parts. The first radiator is separated from the discrete part and includes a feed end. The second, third, and fourth radiators are connected to the discrete part and the metal back cover. The third radiator is located between the first and second radiators. The first radiator is located between the third and fourth radiators. The discrete part and the first, second, third, and fourth radiators form an antenna module together.
    Type: Application
    Filed: August 2, 2023
    Publication date: March 7, 2024
    Applicant: PEGATRON CORPORATION
    Inventors: Chien-Yi Wu, Chao-Hsu Wu, Chih-Wei Liao, Hau Yuen Tan, Shih-Keng Huang, Wen-Hgin Chuang, Lin-Hsu Chiang, Chang-Hua Wu, Han-Wei Wang, Chun-Jung Hu
  • Publication number: 20240079434
    Abstract: Various embodiments of the present disclosure are directed towards an image sensor including first chip and a second chip. The first chip includes a first substrate, a plurality of photodetectors disposed in the first substrate, a first interconnect structure disposed on a front side of the first substrate, and a first bond structure disposed on the first interconnect structure. The second chip underlies the first chip. The second chip includes a second substrate, a plurality of semiconductor devices disposed on the second substrate, a second interconnect structure disposed on a front side of the second substrate, and a second bond structure disposed on the second interconnect structure. A first bonding interface is disposed between the second bond structure and the first bond structure. The second interconnect structure is electrically coupled to the first interconnect structure by way of the first and second bond structures.
    Type: Application
    Filed: January 5, 2023
    Publication date: March 7, 2024
    Inventors: Hao-Lin Yang, Kuan-Chieh Huang, Wei-Cheng Hsu, Tzu-Jui Wang, Chen-Jong Wang, Dun-Nian Yaung, Yu-Chun Chen
  • Patent number: 11923210
    Abstract: In an embodiment, a method includes: immersing a wafer in a bath within a cleaning chamber; removing the wafer out of the bath through a solvent and into a gas within the cleaning chamber; determining a parameter value from the gas; and performing remediation within the cleaning chamber in response to determining that the parameter value is beyond a threshold value.
    Type: Grant
    Filed: August 21, 2019
    Date of Patent: March 5, 2024
    Assignee: Taiwan Semiconductor Manufacturing Co., Ltd.
    Inventors: Wei-Chun Hsu, Shu-Yen Wang, Chui-Ya Peng
  • Patent number: 11920238
    Abstract: A method of making a sealing article that includes a body and a coating layer disposed on at least one surface of the body. The body comprises a polymeric elastomer such as perfluoroelastomer or fluoroelastomer. The coating layer comprises at least one metal. The sealing article may be a seal, a gasket, an O-ring, a T-ring or any other suitable product. The sealing article is resistant to ultra-violet (UV) light and plasma, and may be used for sealing a semiconductor processing chamber.
    Type: Grant
    Filed: July 22, 2022
    Date of Patent: March 5, 2024
    Assignee: Taiwan Semiconductor Manufacturing Co., Ltd.
    Inventors: Peng-Cheng Hong, Jun-Liang Pu, W. L. Hsu, Chung-Hao Kao, Chia-Chun Hung, Cheng-Yi Wu, Chin-Szu Lee
  • Patent number: 11925035
    Abstract: A hybrid random access memory for a system-on-chip (SOC), including a semiconductor substrate with a MRAM region and a ReRAM region, a first dielectric layer on the semiconductor substrate, multiple ReRAM cells in the first dielectric layer on the ReRAM region, a second dielectric layer above the first dielectric layer, and multiple MRAM cells in the second dielectric layer on the MRAM region.
    Type: Grant
    Filed: October 26, 2022
    Date of Patent: March 5, 2024
    Assignee: UNITED MICROELECTRONICS CORP.
    Inventors: Po-Kai Hsu, Hui-Lin Wang, Ching-Hua Hsu, Yi-Yu Lin, Ju-Chun Fan, Hung-Yueh Chen
  • Publication number: 20240065390
    Abstract: Bands for wearable devices include multiple band retainers used to maintain engagement between an assembly (e.g., a pair) of bands. Some band retainers may be permanently affixed with the band at a certain location of the band, while other band retainers can be removable. The removable band retainers can be moved to different locations of the band, thus allowing the band retainer to retain another band at different locations. As a result, the assembly of bands can be used with different users, and in particular, users with different wrist sizes. Moreover, using multiple band retainers can provide an engagement force between the bands to withstand higher-impact events, such as swimming and diving. Additionally, bands and band retainers may include one or more liquid-resistant and corrosion-resistant materials.
    Type: Application
    Filed: August 18, 2023
    Publication date: February 29, 2024
    Inventors: Nicholas S. Brodine, Molly J. Anderson, Clement C. Tissandier, Osamu Yabe, Mengxi Zhao, Timothy S. Lui, Chia Tse Yeh, Kai-Yu Chung, Jen-Chun Hsu, Tatsuya Sano, Peng Li
  • Publication number: 20240066313
    Abstract: An electronic device includes a light emitting layer, a light conversion layer and an adjustable structure. The light emitting layer has a plurality of light emitting units for emitting light. The light conversion layer converts the wavelength of the light emitted by at least one light emitting unit to provide converted light. The adjustable structure is controlled to adjust a light penetrating area to correspond to the affected part to be treated, wherein at least one of the light and the converted light passes through the light penetrating area to irradiate the affected part.
    Type: Application
    Filed: July 28, 2023
    Publication date: February 29, 2024
    Inventors: Jih-Ping LIN, Chun-Kai LEE, Fang-Iy WU, Cheng-Hsu CHOU
  • Publication number: 20240074337
    Abstract: A memory device includes a substrate, a bottom electrode disposed over the substrate, a top electrode disposed over the bottom electrode, and a phase change layer disposed between the top electrode and bottom electrode. The phase change layer includes a GeSbTe material that contains a Ge content of about 20 at % or less, a Sb content of about 30 at % or more, and a Te content of about 40 at % at or more.
    Type: Application
    Filed: August 26, 2022
    Publication date: February 29, 2024
    Applicant: Taiwan Semiconductor Manufacturing Company, Ltd.
    Inventors: Hengyuan Lee, Cheng-Chun Chang, Chen-Feng Hsu, Tung-Ying Lee, Xinyu BAO