Abstract: When a driving circuit of an anti-fuse memory device programs a selected anti-fuse memory cell, voltage differences between unselected bit lines and unselected anti-fuse control lines would be eliminated or decreased to an acceptable value by floating unselected anti-fuse control lines or by applying a second control line voltage to the unselected anti-fuse control lines. Leakage currents flowing from unselected bit lines through ruptured anti-fuse transistors of the anti-fuse memory device to the unselected anti-fuse control lines would be decreased or eliminated, and program disturbance would be avoided.

Abstract: A breathable water resistant film includes a substrate and a nanofiber layer disposed on the substrate. The nanofiber layer is formed by an electrospinning process. An electrospinning solution used in the electrospinning process includes a first additive, an alcohol, and a second additive. The first additive includes nylon copolymer, and the second additive includes polysilazane.

Abstract: The present invention provides methods of hypo-acylated lipopolysaccharide (LPS) for improving anti-oxidation and preventing/treating endotoxemia and diseases associated with endotoxemia.

Abstract: A method for manufacturing a non-volatile memory device is provided. The method includes forming a trench through a sacrificial layer and extending into a substrate, filling a first insulating material into the trench, and implanting a dopant in the first insulating material by an implantation process. Then, the first insulating material is partially removed to form a first recess between the sacrificial layers. The lowest point of the first recess is lower than the top surface of the substrate. The method includes filling a second insulating material in the first recess and removing the sacrificial layer to form a second recess adjacent to the second insulating material The method includes forming a first polycrystalline silicon layer in the second recess, and sequentially forming a dielectric layer and a second polycrystalline silicon layer on the first polycrystalline silicon layer.

Abstract: A non-woven film for electronic components is provided in the present disclosure. The non-woven film for electronic components includes a polyetherimide substrate and an aerogel. The aerogel is disposed on the polyetherimide substrate. The aerogel has a moisture content between 0.7% and 0.9% and a porosity between 85% and 95%.

Abstract: A moisture-sensed shrinking ink applied to a digital printing process for fabric has a viscosity between 2.5 cP and 10.0 cP and a surface tension between 22 dyne/cm and 32 dyne/cm, in which the moisture-sensed shrinking ink includes 15 parts by weight to 35 parts by weight of a moisture-sensed shrinking resin and 65 parts by weight to 85 parts by weight of water.

Abstract: The present disclosure provides a moisture-sensed deforming fabric which includes a base cloth and a moisture-sensed shrinking ink. The moisture-sensed shrinking ink is jetted on one of surfaces of the base cloth by a digital printing process, and the moisture-sensed shrinking ink forms a hydrophilic region on the surface of the base cloth.

Abstract: A package structure including a lead frame structure, a die, an adhesive layer, and at least one three-dimensional (3D) printing conductive wire is provided. The lead frame structure includes a carrier and a lead frame. The carrier has a recess. The lead frame is disposed on the carrier. The die is disposed in the recess. The die includes at least one pad. The adhesive layer is disposed between a bottom surface of the die and the carrier and between a sidewall of the die and the carrier. The 3D printing conductive wire is disposed on the lead frame, the adhesive layer, and the pad, and is electrically connected between the lead frame and the pad.

Abstract: An automatic device for brewing beverages at least comprises an ice cube meter, at least one beverage supply device, at least one robotic arm, a feed conveyor belt, a plurality of feeders, and a film sealing machine, mainly uses the robotic arm to take up ice cubes and a beverage from the ice cube meter and the beverage supply device with a hand-shake cup, then shake and mix, and pour the shaken and mixed beverage and ice cubes into a beverage cup, the beverage cup is conveyed to pass through the feeders by the feed conveyor belt, ingredient is squeezed into the beverage cup by the feeder, and finally the beverage cup containing the beverage, ice cubes and ingredient is conveyed by the feed conveyor belt to the film sealing machine for sealing.

Abstract: A heat dissipating module includes a heat dissipating assembly, a centrifugal fan, an airflow guiding hood and an auxiliary fan. The heat dissipating assembly includes a heat dissipating board and fins disposed thereon. Heat dissipating channels are formed between the fins. The centrifugal fan is disposed at a side of the heat dissipating channels. The airflow guiding hood covers the heat dissipating assembly and the centrifugal fan and is provided with a first airflow opening over the centrifugal fan, a second airflow opening over the fins and a third airflow opening at another side of the heat dissipating channels. The auxiliary fan is disposed between the fins and the second airflow opening.

Abstract: A heat dissipating module includes a heat dissipating assembly, a centrifugal fan, an airflow guiding hood and an auxiliary fan. The heat dissipating assembly includes a heat dissipating board and fins disposed thereon. Heat dissipating channels are formed between the fins. The centrifugal fan is disposed at a side of the heat dissipating channels. The airflow guiding hood covers the heat dissipating assembly and the centrifugal fan and is provided with a first airflow opening over the centrifugal fan, a second airflow opening over the fins and a third airflow opening at another side of the heat dissipating channels. The auxiliary fan is disposed between the fins and the second airflow opening.

Abstract: A semiconductor device includes a first semiconductor die package. The first semiconductor package includes a molding compound, and a conductive element in the molding compound, wherein a top surface of the conductive element is above or co-planar with a top-most surface of the molding compound. The semiconductor device further includes a second semiconductor die package. The second semiconductor package includes a plurality of copper-containing contacts on a single metal pad, wherein each of the plurality of copper-containing contacts is bonded to the conductive element.

Abstract: A routing plane includes an authentication packaging system that receives client authentication information, as part of a request from a requesting client that is to be routed to a target service. The authentication packaging system combines the authentication information with assertion information indicative of an assertion as to the identity of the routing plane, using an entropy, such as a signing key. The authentication package is attached to the request and is sent to the target service. The target service validates the authentication package based on the entropy and authenticates the routing plane based on the assertion information and performs authentication processing based on the authentication information.

Abstract: A package structure including a lead frame structure, a die, an adhesive layer, and at least one three-dimensional (3D) printing conductive wire is provided. The lead frame structure includes a carrier and a lead frame. The carrier has a recess. The lead frame is disposed on the carrier. The die is disposed in the recess. The die includes at least one pad. The adhesive layer is disposed between a bottom surface of the die and the carrier and between a sidewall of the die and the carrier. The 3D printing conductive wire is disposed on the lead frame, the adhesive layer, and the pad, and is electrically connected between the lead frame and the pad.

Abstract: A trace configuration calculating method is applied to pivotal connection of a first workpiece and a hinge. A first trace space is formed at a position where the hinge is pivoted to the first workpiece. A first trace is disposed through the first trace space. The trace configuration calculating method includes the hinge and the first workpiece rotating first and second angles to make the first trace space have first and second contour cross-sections respectively, overlapping the first and second contour cross-sections to form a first intersection area, calculating a first maximum inscribed circle according to the first intersection area, and determining a first optimal center and a first maximum diameter of the first trace according to the first maximum inscribed circle.

Abstract: A preparation method of separation membrane is provided. First, a polyimide composition including a dissolvable polyimide, a crosslinking agent, and a solvent is provided. The dissolvable polyimide is represented by formula 1: wherein B is a tetravalent organic group derived from a tetracarboxylic dianhydride containing aromatic group, A is a divalent organic group derived from a diamine containing aromatic group, A? is a divalent organic group derived from a diamine containing aromatic group and carboxylic acid group, and 0.1?X?0.9. The crosslinking agent is an aziridine crosslinking agent, an isocyanate crosslinking agent, an epoxy crosslinking agent, a diamine crosslinking agent, or a triamine crosslinking agent. A crosslinking process is performed on the polyimide composition. The polyimide composition which has been subjected to the crosslinking process is coated on a substrate to form a polyimide membrane. A dry phase inversion process is performed on the polyimide membrane.

Abstract: A preparation method of separation membrane is provided. First, a polyimide composition including a dissolvable polyimide, a crosslinking agent and a solvent is provided. The dissolvable polyimide is represented by formula 1: wherein B is a tetravalent organic group derived from a tetracarboxylic dianhydride containing aromatic group, A is a divalent organic group derived from a diamine containing aromatic group, A? is a divalent organic group derived from a diamine containing aromatic group and carboxylic acid group, and 0.1?X?0.9. The crosslinking agent is an aziridine crosslinking agent, an isocyanate crosslinking agent, an epoxy crosslinking agent, a diamine crosslinking agent, or a triamine crosslinking agent. A crosslinking process is performed on the polyimide composition. The polyimide composition which has been subjected to the crosslinking process is coated on a substrate to form a polyimide membrane. A wet phase inversion process is performed on the polyimide membrane.

Abstract: A functional resin material is manufactured by the following reagents including a polyol, a polyamine, a first cross-linking agent, a second cross-linking agent, and a nanocellulose. Each of the first cross-linking agent and the second cross-linking agent includes an isocyanate block.

Abstract: An anti-staining fabric includes a base cloth and an anti-staining resin. The anti-staining resin is disposed on the base cloth, in which a method of fabricating the anti-staining resin includes the following steps. A first thermal process is performed to mix a polyol, a cross-linking agent, and a choline to form a first mixture, in which a reaction temperature of the first thermal process is between 90° C. and 120° C. A second thermal process is performed to mix the first mixture and a chain extender to form the anti-staining resin, in which the chain extender includes a first reagent and a second reagent, and a reaction temperature of the second thermal process is between 120° C. and 150° C.