Abstract: A probe cleaning sheet for preventing a probe pin damage and manufacturing method thereof, during the process of a probe pin puncturing the cleaning layer, the material of the cleaning layer and the plurality of high and low density cleaning particles of abrasive material contained in the high density cleaning material and the low density cleaning material are able to efficiently scrape away foreign material from the surface of the probe pin. In addition, the negative charge carried by the silicone itself and its lipophilic characteristics are used to transfer the foreign material on the probe pin to the cleaning layer, and the protective layer is used to prevent overpressure from the probe pin directly impacting the substrate and causing damage to the tips of the probe pin.

Abstract: The present application discloses a capacitive sensing device and a sensing method thereof. A plurality of driving signals corresponding to a plurality of driving codes are outputted to a plurality of driving electrodes, thereby, a plurality of sensing signal are generated on a plurality of sensing electrodes corresponding to the driving electrodes, where the sensing signals are decoded to sensing data by an operation circuit. Hereby, the calculation function of the operation circuit according to the present application may be simplified.

Abstract: The present disclosure relates to a method and an associated process tool. The method includes generating electromagnetic radiation that is directed toward a perimeter of a pair of bonded workpieces and toward a radiation sensor that is arranged behind the perimeter of the pair of bonded workpieces. The electromagnetic radiation is scanned along a vertical axis. An intensity of the electromagnetic radiation that impinges on the radiation sensor is measured throughout the scanning. Measuring the intensity includes recording a plurality of intensity values of the electromagnetic radiation at a plurality of different positions along the vertical axis extending past top and bottom surfaces of the pair of bonded workpieces. A position of an interface between the pair of bonded workpieces is determined based on a maximum measured intensity value of the plurality of intensity values.

Abstract: A pedal with anti-collision detection is installed on the rear of a vehicle. The pedal includes a pedal body and a radar device, with an insertion portion extending from the rear lateral side of the pedal body. Arc ribs are arranged from a rear lateral side of the pedal body toward a front lateral side of the pedal body at intervals, and straight ribs extend from the rear lateral side toward the front lateral side in a radial arrangement. The arc ribs and the straight ribs are interlaced, forming reinforcement spaces therebetween. An installation space is formed on an inner side of the front lateral side toward the rear lateral side for receiving the radar device. Each reinforcement space contains a reinforcement structure, thereby strengthening the structural strength of the pedal for protecting the radar device.

Abstract: In an embodiment, a method includes: placing a wafer on an implanter platen, the wafer including integrated circuit dies; measuring a position of the wafer by measuring a positions of an outer edge of the integrated circuit dies with a camera; determining an angular displacement between the position of the wafer and a reference position of the wafer; and rotating the implanter platen by the angular displacement.

Abstract: In an embodiment, a pattern transfer processing chamber includes a pattern transfer processing chamber and a loading area external to the pattern transfer processing chamber. The loading area is configured to transfer a wafer to or from the pattern transfer processing chamber. The loading area comprises a first region including a loadport, a second region including a load-lock between the first region and the pattern transfer processing chamber, and an embedded baking chamber configured to heat a patterned photoresist on the wafer.

Abstract: The present application discloses a capacitive sensing device and a sensing method thereof. A plurality of driving signals corresponding to a plurality of driving codes are outputted to a plurality of driving electrodes, thereby, a plurality of sensing signal are generated on a plurality of sensing electrodes corresponding to the driving electrodes, where the sensing signals are decoded to sensing data by an operation circuit. Hereby, the calculation function of the operation circuit according to the present application may be simplified.

Abstract: The present disclosure provides a semiconductor package including a substrate, a display unit, a flexible substrate, a driving circuit, and a memory. The substrate has a first surface and a second surface opposite to each other, and the first surface has a display region and a bonding region. The display unit is disposed on the display region of the first surface. The flexible substrate is disposed below the second surface and has a connection portion extended to the bonding region of the first surface. The driving circuit is disposed on the flexible substrate and electrically connects with the display unit. The memory is disposed on the flexible substrate and electrically connects with the driving circuit.

Abstract: The present disclosure provides a semiconductor package including a substrate, a display unit, a driving circuit, and at least one of memory. The substrate has a display region and a peripheral region. The display unit is disposed in the display region and electrically connects with the display unit. The memory is disposed in the peripheral region and electrically connected with the driving circuit. The driving circuit and the memory are spaced apart from each other.

Abstract: A micro-lens structure includes a substrate and a micro-lens. The micro-lens includes a shape adjustment portion and a lens pattern. The shape adjustment portion includes a plurality of shape adjustment patterns on the substrate. The lens pattern covers the shape adjustment patterns.

Abstract: A tool-free hard disk bracket includes a base having abase body with a guide groove, and an engaging member connected to the base body. A frame includes a first side arm movably engaging with the engaging member. A handgrip is rotatably connected to one end of the base body. An operating unit includes an operating member releasably engaging with the handgrip and having a rotating shaft portion inserted rotatably and movably into the guide groove. The operating member is operated to rotate and release engagement with the handgrip, and is further operated to move along the guide groove toward the engaging member to push the engaging member to pivot and release engagement with the first side arm.

Abstract: An image sensor structure including a substrate, a light sensing device, a filter structure, and a separation wall is provided. The light sensing device is located in the substrate. The filter structure is located above the light sensing device. The filter structure includes a main filter layer and a first subordinate filter layer. The separation wall surrounds a sidewall of the filter structure. A refractive index of the filter structure is greater than a refractive index of the separation wall.

Abstract: The present disclosure provides a semiconductor package including a substrate, a display unit, a driving circuit, and at least one of memory. The substrate has a display region and a peripheral region. The display unit is disposed in the display region and electrically connects with the display unit. The memory is disposed in the peripheral region and electrically connected with the driving circuit. The driving circuit and the memory are spaced apart from each other.

Abstract: A pad structure is formed on an IC die and includes a first conductive layer, a dielectric layer, a second conductive layer and a passivation layer. The first conductive layer is formed on an upper surface of the IC die and having a hollow portion. The dielectric layer covers the first conductive layer. The second conductive layer is formed on the dielectric layer and electrically connected to the first conductive layer. The passivation layer covers the second conductive layer and has an opening exposing the second conductive layer for receiving a bonding wire.

Abstract: The application provides a rotating device, including: an annular base, a first positioning member, a second positioning member, and a driving member. The driving member includes a pushing structure. The driving member drives the pushing structure to rotate around the outer edge of the peripheral portion in a first rotating direction or a second rotating direction; when the pushing structure rotates in the first rotating direction, the first stop portion and the third stop portion fit the peripheral portion in response to the push of the pushing structure, and the second stop portion and the fourth stop portion stop the pushing structure; and when the pushing structure rotates in the second rotating direction, the second stop portion and the fourth stop portion fit the peripheral portion in response to the push of the pushing structure, and the first stop portion and the third stop portion stop the pushing structure.

Abstract: The present disclosure provides a semiconductor package including a substrate, a display unit, a flexible substrate, a driving circuit, and a memory. The substrate has a first surface and a second surface opposite to each other, and the first surface has a display region and a bonding region. The display unit is disposed on the display region of the first surface. The flexible substrate is disposed below the second surface and has a connection portion extended to the bonding region of the first surface. The driving circuit is disposed on the flexible substrate and electrically connects with the display unit. The memory is disposed on the flexible substrate and electrically connects with the driving circuit.

Abstract: The present disclosure provides a semiconductor package including a substrate, a display unit, a flexible circuit board, a driving circuit, and a memory. The substrate has a first surface and a second surface opposite to each other, and the first surface has a display region and a bonding region. The display unit is disposed on the display region of the first surface. The flexible circuit board is disposed below the second surface and has a connection portion extended to the bonding region of the first surface. The driving circuit is disposed on the flexible circuit board and electrically connects to the display unit. The memory is disposed on the flexible circuit board and electrically connects to the driving circuit.

Abstract: A system module applied to the machine controller for simulating a machine operation screen based on a non-invasive data-extraction system, is disclosed. An image capture device of the system module can receive an original operation screen outputted from the machine controller, and transmit the original operation screen to the non-invasive data-extraction system and a high-speed image process unit for extraction of the information shown on the operation screen. The software control system can extract the operational information of the machine controller in real time, to create a machine operation flow for generating a simulated machine operation screen which is then outputted to a screen of the machine controller. As a result, the site working staff can be provided with operational information associated with the machine in real time, for example, the operational information includes currently executed operation screen, position of mouse cursor and pop-up window detection result.

Abstract: The application provides a rotating device, including: an annular base, a first positioning member, a second positioning member, and a driving member. The driving member includes a pushing structure. The driving member drives the pushing structure to rotate around the outer edge of the peripheral portion in a first rotating direction or a second rotating direction; when the pushing structure rotates in the first rotating direction, the first stop portion and the third stop portion fit the peripheral portion in response to the push of the pushing structure, and the second stop portion and the fourth stop portion stop the pushing structure; and when the pushing structure rotates in the second rotating direction, the second stop portion and the fourth stop portion fit the peripheral portion in response to the push of the pushing structure, and the first stop portion and the third stop portion stop the pushing structure.

Abstract: A tool-free hard disk bracket includes a base having abase body with a guide groove, and an engaging member connected to the base body. A frame includes a first side arm movably engaging with the engaging member. A handgrip is rotatably connected to one end of the base body. An operating unit includes an operating member releasably engaging with the handgrip and having a rotating shaft portion inserted rotatably and movably into the guide groove. The operating member is operated to rotate and release engagement with the handgrip, and is further operated to move along the guide groove toward the engaging member to push the engaging member to pivot and release engagement with the first side arm.