Abstract: A conductive material composition and a conductive material prepared therefrom are provided. The conductive material composition includes 40-80 parts by weight of disulfide resin having at least one terminal reactive functional group and 20-60 parts by weight of metal material. The terminal reactive functional group is independently acrylate group, methacrylate group, glycidyl group, oxiranyl group, oxetanyl group, or 3,4-epoxycyclohexyl group.

Abstract: An electronic device, including a host, a main display, an auxiliary display, and a lifting mechanism, is provided. The main display is pivoted to the host. The auxiliary display is disposed on the host. The lifting mechanism is disposed between the auxiliary display and the host. The lifting mechanism is configured to lift the auxiliary display and maintain a lifting height of the auxiliary display.

Abstract: A foldable electronic device including a first body, a second body, a flexible display disposed on the first and the second bodies, a hinge assembly connected between the first and the second bodies, an extension chain assembly, and a linkage is provided. The first and the second bodies are rotated relatively to be unfolded or folded via the hinge assembly. An end of the linkage and an end of the extension chain assembly are pivoted together and coupled to the first body in a sliding and pivoting manner. Another end of the linkage is pivoted to the hinge assembly, and another end of the extension chain assembly is pivoted to the second body. In a transforming process between the folded and the unfolded states, an extension traveling of the extension chain assembly compensates a size difference of the flexible display between the folded and the unfolded states.

Abstract: A quenching fixture adapted to clamp at least one workpiece is provided. The quenching fixture includes a first positioning component and a second positioning component. Both of the first positioning component and the second positioning component have a positioning surface, multiple protrusions protruding from the positioning surface and a heat dissipation channel disposed between the protrusions in a staggered manner. The positioning surface of the first positioning component faces the positioning surface of the second positioning component, and the protrusions of the first positioning component overlap the protrusions of the second positioning component. The workpiece is clamped between the protrusions of the first positioning component and the protrusions of the second positioning component.

Abstract: A portable electronic apparatus includes a first body having a pivoting side and a heat dissipating hole located at the pivoting side, a second body, and a hinge mechanism. The second body is rotatably and slidably connected to the first body through the hinge mechanism including a rack fixed in the first body as corresponding to the pivoting side, a rotating shaft connected to the second body, and a driving component connected to the rotating shaft and mechanically coupled to the rack. When the second body rotates and unfolds with respect to the first body, the rotating shaft rotates together with the second body, the driving component rotates with the rotating shaft, and the driving component rotates and slides with respect to the rack and drives the second body to slide away from the pivoting side to increase a distance between the second body and the heat dissipating hole.

Abstract: In an approach to detecting the transmission of messages, analyzing said messages, calculating a message risk score and transmitting a warning notification, one or more computer processors detect transmission of a message from a user to a selected recipient. The one or more computer processors extract message information from the detected message. The one or more computer processors retrieve one or more historical conversations between the user and the selected recipient of the detected message. The one or more computer processors determine a risk score corresponding to sending the detected message to the selected recipient based on applying the extracted message information and the retrieved historical conversations to a cognitive model.

Abstract: A semiconductor structure includes a substrate. The semiconductor structure further includes a first III-V layer over the substrate, wherein the first III-V layer includes a first dopant type. The semiconductor structure further includes a second III-V layer over the first III-V layer, wherein the second III-V layer has a second dopant type opposite the first dopant type. The semiconductor structure further includes a third III-V layer over the second III-V layer, wherein the third III-V layer has the first dopant type. The semiconductor structure further includes a fourth III-V layer over the third III-V layer, the fourth III-V layer having the second dopant type. The semiconductor structure further includes an active layer over the fourth III-V layer. The semiconductor structure further includes a dielectric layer over the active layer.

Abstract: A semiconductor device includes an ultra-thick metal (UTM) structure. The semiconductor device includes a passivation layer including a first passivation oxide. The first passivation oxide includes an unbias film and a first bias film, where the unbias film is on portions of the UTM structure and on portions of a layer on which the UTM structure is formed, and the first bias film is on the unbias film. The passivation layer includes a second passivation oxide consisting of a second bias film, the second bias film being on the first bias film. The passivation layer includes a third passivation oxide consisting of a third bias film, the third bias film being on the second bias film.

Abstract: Systems, methods, and apparatus including computer-readable mediums for managing open blocks in memory systems such as NAND flash memory devices are provided. In one aspect, a method includes: evaluating a read disturbance level of an open block in a memory, the open block having one or more programmed word lines and one or more blank word lines, and in response to determining that the read disturbance level of the open block is beyond a threshold level, managing each memory cell in at least one of the blank word lines to have a smaller data storing capacity than each memory cell in at least one of the one or more programmed word lines so as to reduce impact of read disturbance.

Abstract: A conformal organic field-effect transistor includes an elastic substrate, a gate electrode, a polymer insulating layer, an organic semiconductor layer, and a source electrode and a drain electrode from the bottom up, the source electrode and the drain electrode being embedded in the organic semiconductor layer.

Abstract: A generating method of conference image and an image conference system are provided. In the method, a user and one or more tags in a captured actual image are identified. The moving behavior of the user is tracked, and the position of the viewing range in the actual image is adjusted according to the moving behavior. The virtual image corresponding to the tag is synthesized according to the position relation between the user and the tag, to generate a conference image.

Abstract: Surgical drill guides have modular configurations and are adapted to accommodate a wide range of anatomy. The surgical drill guides are adapted to be removed while leaving a guide wire in its intended location in human bone. The distal end of the drill guide acts as a safety stop for the guide wire by preventing the guide wire from penetrating too far past the far side of the bone.

Abstract: An interaction method between reality and virtuality and an interaction system between reality and virtuality are provided in the embodiments of the present invention. A marker is provided on a controller. A computing apparatus is configured to determine control position information of the controller in a space according to the marker in an initial image captured by an image capturing apparatus; determine object position information of a virtual object image in the space corresponding to the marker according to the control position information; and integrate the initial image and the virtual object image according to the object position information, to generate an integrated image. The integrated image is used to be played on a display. Accordingly, an intuitive operation is provided.

Abstract: A device that includes a substrate including a plurality of metal layers, and a plurality of dielectric layers. The device further includes a first passive component including a first terminal, a second terminal, and a first body, mounted to the substrate on one of the plurality of metal layers. The first terminal is coupled to a first ground signal and the second terminal is coupled to a second ground signal such that the first passive component is shorted. The first passive component may be an inductor, a capacitor or a resistor. The first passive component is operable as a heat sink, a heat shield, an electromagnetic shield, or as a tuning inductor.

Abstract: A text-to-speech (TTS) dubbing system is provided, including: a speech input unit, configured to obtain speech information; an input unit, configured to obtain target text information and a parameter adjustment instruction; and a processing unit, including: an acoustic module, configured to obtain a speech feature vector and an acoustic parameter of the speech information; and a text phoneme analysis module, configured to analyze a phoneme sequence corresponding to the target text information according to the target text information; and an audio synthesis unit, configured to adjust the acoustic parameter of the speech information according to the parameter adjustment instruction, and combine speech information obtained after the acoustic parameter is adjusted with the target text information to form a synthesized audio.

Abstract: Methods and devices for tissue graft fixation include fixation devices attached to an adjustable fixation loop of suture without compromising the graft or requiring additional material to complete the repair. Other fixation devices are attachable to an independent adjustable suture system. Adjustable fixation loops minimize slip/creep of the suture within the loop.

Abstract: An electronic device assembly is provided, including an electronic device body and a detachable lens module. The electronic device body has a housing and a first joining unit, wherein the first joining unit is disposed on the housing. The detachable lens module is detachably assembled onto the housing and has a second joining unit, wherein the first joining unit is joined to the second joining unit to electrically connect the detachable lens module to the electronic device body.

Abstract: Electrical devices, semiconductor packages and methods of forming the same are provided. One of the electrical devices includes a substrate, a conductive pad, a conductive pillar and a solder region. The substrate has a surface. The conductive pad is disposed on the surface of the substrate. The conductive pillar is disposed on and electrically connected to the conductive pad, wherein a top surface of the conductive pillar is inclined with respect to the surface of the substrate. The solder region is disposed on the top surface of the conductive pillar.

Abstract: A semiconductor device includes a substrate; an interconnect structure over the substrate; a first passivation layer over the interconnect structure; a first conductive pad, a second conductive pad, and a conductive line disposed over the first passivation layer and electrically coupled to conductive features of the interconnect structure; a conformal second passivation layer over and extending along upper surfaces and sidewalls of the first conductive pad, the second conductive pad, and the conductive line; a first conductive bump and a second conductive bump over the first conductive pad and the second conductive pad, respectively, where the first conductive bump and the second conductive bump extend through the conformal second passivation layer and are electrically coupled to the first conductive pad and the second conductive pad, respectively; and a dummy bump over the conductive line, where the dummy bump is separated from the conductive line by the conformal second passivation layer.

Abstract: A semiconductor device and a method of forming the same are provided. The semiconductor device includes a die structure including a plurality of die regions and a plurality of first seal rings. Each of the plurality of first seal rings surrounds a corresponding die region of the plurality of die regions. The semiconductor device further includes a second seal ring surrounding the plurality of first seal rings and a plurality of connectors bonded to the die structure. Each of the plurality of connectors has an elongated plan-view shape. A long axis of the elongated plan-view shape of each of the plurality of connectors is oriented toward a center of the die structure.