Patents by Inventor Chun On To

Chun On To has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20220399932
    Abstract: Systems and devices are provided in which an RF wireless bridge is employed to facilitate indirect transmission of communication signals between external devices located outside of an electromagnetically shielding enclosure within internal devices located within the enclosure, via the intermediate transmission of RF waves through an RF attenuating window forming a portion of the enclosure. The wireless bridge is formed from a first RF communication device located within the electromagnetically shielding enclosure, and a second RF communication device located outside of the enclosure, where the two RF communication devices are positioned with sufficient proximity such that the wireless bridge facilitates indirect communication through the RF attenuating window despite attenuation of RF energy by the RF attenuating window.
    Type: Application
    Filed: June 24, 2022
    Publication date: December 15, 2022
    Inventors: Kevan James Thompson ANDERSON, Donald Bruce PLEWES, Garry Ka Chun LIU, Lynsie Alexandra Marie THOMASON
  • Publication number: 20220396778
    Abstract: This invention generally relates to a novel RNA composition and its production method useful for generating and expanding induced pluripotent stem cells (iPS cells; iPSC) as well as adult stem cells (ASC). The RNA composition so defined can be used for producing not only non-transgenic but also tumor-free iPS cells. The defined RNA composition contans at least two types of different RNA constructs; one is “miR-302 precursor RNA (pre-miR-302)” and the other is “RNA-dependent RNA polymerase (RdRp)” mRNA. Both of pre-miR-302 and RdRp mRNA contain highly structured RNA comformations, such as hairpin and stem-loop structures. To produce highly structured RNAs, a novel PCR-IVT methodology has been developed and used with a specially designed RNA polymerase-helicase mixture activity.
    Type: Application
    Filed: January 19, 2022
    Publication date: December 15, 2022
    Inventors: Shi-Lung LIN, Sam LIN, Chun-Hung LIN
  • Publication number: 20220399681
    Abstract: A connector lock structure includes an insulating body, a plurality of terminals, a shell, a locking assembly, a sliding board, a pressing element and an unlocking tool. The insulating body is molded around the plurality of the terminals. The shell surrounds the insulating body. The locking assembly includes at least one lacking groove, and at least one elastic arm formed in the at least one lacking groove. The at least one elastic arm has a hook structure. The hook structure is cooperated with a blocking groove of a docking connector. The pressing element is mounted in the insulating body. The sliding board is slidably mounted under the pressing element. One end of the pressing element has a locking portion. The locking portion has a keyhole. The unlocking tool is inserted in the keyhole.
    Type: Application
    Filed: April 26, 2022
    Publication date: December 15, 2022
    Inventors: LI NIEN HSU, SHENG NAN YU, CHUN FU LIN
  • Publication number: 20220399339
    Abstract: A transistor structure including a first doped layer, a second doped layer, a channel layer, a gate, and a dielectric structure is provided. The second doped layer is located on the first doped layer. The channel layer is located between the first doped layer and the second doped layer. The gate penetrates through the second doped layer and the channel layer. The second doped layer and the channel layer respectively surround the gate. The dielectric structure is located between the gate and the second doped layer and located between the gate and the channel layer.
    Type: Application
    Filed: July 19, 2021
    Publication date: December 15, 2022
    Applicant: Powerchip Semiconductor Manufacturing Corporation
    Inventors: Chun-Sheng Chen, Chiu-Tsung Huang
  • Publication number: 20220396694
    Abstract: The present invention relates to a polypropylene composite resin light diffusion plate. The polypropylene composite resin light diffusion plate obtained by mixing hollow spheres made of an inorganic material with an eco-friendly, inexpensive, low specific gravity polypropylene composite resin can improve thermal expansion characteristic (area expansion rate) to a level equal to or superior to those of polycarbonate (PC) and polystyrene (PS), enhance optical characteristics (transmittance, shielding rate), and reduce manufacturing costs. The polypropylene composite resin light diffusion plate according to the present invention is manufactured in a flat plate shape by mixing a plurality of hollow spheres with a polymer resin containing a polypropylene (PP) resin and has an area expansion rate of 0.4-0.7% at 60° C., relative to an area at room temperature, due to mutual bonding of the polypropylene (PP) resin and the plurality of hollow spheres by covalent bonding therebetween.
    Type: Application
    Filed: November 9, 2020
    Publication date: December 15, 2022
    Inventor: Chun Nam HWANG
  • Publication number: 20220398067
    Abstract: A multiply-accumulate (MAC) device for compute-in-memory (CIM) includes an input driver configured to provide a plurality of input signals including a first input signal and a second input signal. A lookup table (LUT) stores or accesses a plurality of CIM weight signals including a first CIM weight signal and a second CIM weight signal. The LUT is configured to receive the first input signal and the second input signal and provide a sum output based on the first and second input signals and the first and second CIM weight signals.
    Type: Application
    Filed: December 23, 2021
    Publication date: December 15, 2022
    Applicant: Taiwan Semiconductor Manufacturing Company, Ltd.
    Inventors: Chia-Fu Lee, Po-Hao Lee, Yi-Chun Shih, Yu-Der Chih
  • Publication number: 20220396672
    Abstract: Disclosed are an organic ion conductive polymer gel elastomer including a polymer matrix; a plasticizing solvent impregnated into the polymer matrix to plasticize the polymer matrix so that the polymer matrix is in a gel state; and an ion conductive dopant ionized by the plasticizing solvent and dispersed in the polymer matrix, wherein the plasticizing solvent and the ion conductive dopant are non-hydrophilic, and a method of preparing the organic ion conductive polymer gel elastomer.
    Type: Application
    Filed: September 1, 2020
    Publication date: December 15, 2022
    Inventors: Jin Woo BAE, Chang Soo HAN, Kyoung Yong CHUN, Young Jun SON
  • Publication number: 20220396033
    Abstract: An automatic leveling device of a 3D printer, and a 3D printer is provided. The automatic leveling device includes a photoelectric switch, an electromagnetic assembly and a probe assembly. The photoelectric switch is arranged in a housing and defines a photosensitive groove. The electromagnetic assembly is arranged in the housing and defines a sliding hole. The probe assembly is slidably engaged in the sliding hole, and an end of the probe assembly is engaged in the photosensitive groove. The electromagnetic assembly is capable of driving the probe assembly to make the end of the probe assembly move out of the photosensitive groove. The automatic leveling device has the advantages of simple structure, low manufacturing difficulty, low production cost, simple and stable leveling mode, high detection repetition accuracy and no complex circuit and software cooperation.
    Type: Application
    Filed: February 8, 2021
    Publication date: December 15, 2022
    Applicants: Shenzhen Creality 3D Technology Co., Ltd., Shenzhen Creality 3D Technology Co., Ltd.
    Inventors: HUI-LIN LIU, JING-KE TANG, CHUN CHEN, DAN-JUN AO, PENG-JIAN LI, BIN QIAO, PIN CHEN
  • Publication number: 20220396914
    Abstract: The present application relates to a sizing agent composition, a carbon fiber material and a composite material. The sizing agent composition includes a first composition solution and a second composition solution, and those solutions respectively has specific compound. The sizing agent comprising the composition has an excellent bonding property with a carbon fiber, and further the sizing agent can efficiently enhance heat resistance, wear resistance and processability of the carbon fiber material. The carbon fiber material sized with the sizing agent has a high adhesion property with specific resin material, therefore producing the composite material with high processability.
    Type: Application
    Filed: June 3, 2022
    Publication date: December 15, 2022
    Inventors: Sheng-Shiun LIN, Yu-Sheng LI, Ching-Cheng CHUNG, Cheng-Chun CHOU, Long-Tyan HWANG
  • Publication number: 20220395953
    Abstract: A method includes bonding a first package component on a composite carrier, and performing a first polishing process on the composite carrier to remove a base carrier of the composite carrier. The first polishing process stops on a first layer of the composite carrier. A second polishing process is performed to remove the first layer of the composite carrier. The second polishing process stops on a second layer of the composite carrier. A third polishing process is performed to remove a plurality of layers in the composite carrier. The plurality of layers include the second layer, and the third polishing process stops on a dielectric layer in the first package component.
    Type: Application
    Filed: November 16, 2021
    Publication date: December 15, 2022
    Inventors: Chun-Wei Chang, Ming-Fa Chen, Chao-Wen Shih, Ting-Chu Ko
  • Publication number: 20220399306
    Abstract: A data storage device includes a substrate including a number of contact pads and a number of passive component packages coupled to the contact pads. The data storage device further includes a memory controller coupled to the substrate, and one or more NAND die stacks coupled to the substrate and in electrical communication with the memory controller. One or more of the passive component packages include a first passive component, a second passive component electrically connected to the first passive component, and a first terminal coupled to the first passive component. The passive component packages further include a second terminal coupled to the second passive component, and a third terminal coupled to a common node of the first passive component and the second passive component.
    Type: Application
    Filed: June 10, 2021
    Publication date: December 15, 2022
    Inventors: Ai-Wen WANG, Wei-Chun SHEN, Yu-Mei CHEN, Guiyang JIANG
  • Publication number: 20220400214
    Abstract: A smart parking management system and a smart parking management method are provided. The system includes a first smart pole, multiple second smart poles, and a processing device. An image capturing range of the first smart pole covers an entrance of a road section. An image capturing range of each second smart pole covers at least a parking space of the road section. The processing device is communicatively coupled to the first smart pole and the second smart poles. The processing device identifies first vehicle information of a first vehicle entering the road section according to an image stream captured by the first smart pole, obtains a movement trajectory of the first vehicle in the road section based on the first vehicle information and an image stream captured by each second smart pole, and determines where the first vehicle is parked according to the movement trajectory.
    Type: Application
    Filed: April 22, 2022
    Publication date: December 15, 2022
    Applicant: PEGATRON CORPORATION
    Inventors: Ying-Hsin Lin, Chun-Sheng Chao, Yu-Hung Tseng
  • Publication number: 20220397945
    Abstract: A buckle base and buckle-fixing pin combination to be used in fixing a printed circuit board to a sheet includes a buckle base and a buckle-fixing pin. The buckle base is in a generally U-shaped form. The buckle base includes a first leg, a second leg, and a bridge therebetween. The first and second legs are connected to the bridge. The buckle-fixing pin forms a longitudinal slot therein.
    Type: Application
    Filed: June 11, 2021
    Publication date: December 15, 2022
    Inventors: Chun CHANG, Kai-Yuan CHUANG, Wei-Pin CHEN, Jyue HOU
  • Publication number: 20220399234
    Abstract: A method of semiconductor die singulation is provided. The method includes forming a first trench along a singulation lane of a semiconductor wafer. A second trench is formed extending from a bottom of the first trench. A portion of the semiconductor wafer remains between a bottom of the second trench and a backside of the semiconductor wafer. A cut is formed by way of a laser to singulate die of the semiconductor wafer. The cut extends through the portion of the semiconductor wafer remaining between the bottom of the second trench and the backside of the semiconductor wafer.
    Type: Application
    Filed: June 15, 2021
    Publication date: December 15, 2022
    Inventors: WeiCheng Chuang, PaoTung Pan, Che Lun Cheng, Yao Jung Chang, Yu-Wen Chu, Chun-Hui Lee, Che-Kai Hsu, Kuan Lin Huang
  • Publication number: 20220395747
    Abstract: A display device electrically connectable to an external operation device and a host is provided. The display device includes an imaging unit, a display controller, an image receiving port, a command output port and at least one computing device. The image receiving port obtains image data from the host and transmit to the display controller. The display controller controls the imaging unit to display the image data. The at least one computing device has a host operation mode and a display operation mode. The computing device receives a control command from the external operation device, sends the control command to the host through the command output port in the host operation mode, and sends the control command to the display controller to adjust the display setting in the display operation mode.
    Type: Application
    Filed: October 7, 2021
    Publication date: December 15, 2022
    Applicants: MICRO-STAR INT'L CO.,LTD., MSI COMPUTER (SHENZHEN) CO.,LTD.
    Inventors: Chun-Te YEH, Chia-Fu LIU, Chung-Wen CHEN
  • Publication number: 20220400581
    Abstract: A portable electronic device including a first body, a second body, a heat source, a first heat pipe, a second heat pipe, and a heat conducting element is provided. The second body is pivotally connected to the first body. The heat source is disposed in the first body and thermally coupled to the heat source. The second heat pipe is disposed in the first body and thermally coupled to the first heat pipe. The heat conducting element is connected to and thermally coupled to the second body, and the heat conducting element slidably contacts the second heat pipe and is thermally coupled to the second heat pipe.
    Type: Application
    Filed: June 6, 2022
    Publication date: December 15, 2022
    Applicant: Acer Incorporated
    Inventors: Chun-Chieh Wang, Wen-Neng Liao, Cheng-Wen Hsieh, Tsung-Ting Chen
  • Publication number: 20220395666
    Abstract: An oscillating positive expiratory pressure device includes a housing, a top cover, and an oscillating unit. The housing includes a bottom wall and a surrounding wall. The bottom wall has an inclined enclosing surface extending downwardly and terminating at an opening. The oscillating unit is swingably connected to and disposed within the housing. The oscillating unit includes a swing member, and first and second weighting pieces. The swing member includes a swing arm, and first and second swing blocks connected to the swing arm. The first weighting piece is carried on the first swing block. The second weighting piece is carried on the second swing block. The swing arm is swingable to move the second swing block to block and unblock the opening.
    Type: Application
    Filed: June 8, 2022
    Publication date: December 15, 2022
    Inventors: Chun-Hung CHEN, Ling-Ling Leonard LIN, Min-Hsien HUANG
  • Publication number: 20220398582
    Abstract: An information delivery method for transferring fund is provided. The information delivery method includes receiving payment information, determining whether a transfer condition is met according to the payment information, in response to determining that the transfer condition is met, obtaining source account information of a source entity and destination account information of a destination entity in the payment information, determining a transfer path according to the source account information of the source entity and the destination account information of the destination entity, and transmitting the payment information from the source entity to the destination entity according to the transfer path.
    Type: Application
    Filed: June 11, 2021
    Publication date: December 15, 2022
    Applicant: OBOOK INC.
    Inventors: Chun-Kai Wang, Chung-Han Hsieh, Chih-Yang Liu, Wei-Te Lin, I-Cheng Lin, Jun-De Liao, Kang-Hsien Chang, Chun-Jen Chen, Pei-Hsuan Weng, Yi-Hsuan Lai, Ming-Hung Lin, Shu-Ming Chang, Zih-Hao Lin
  • Publication number: 20220399227
    Abstract: In one exemplary aspect, a method for semiconductor manufacturing comprises forming first and second silicon nitride features on sidewall surfaces of a contact hole, where the contact hole is disposed in a dielectric layer and above a source/drain (S/D) feature. The method further comprises forming a contact plug in the contact hole, the contact plug being electrically coupled to the S/D feature, removing a top portion of the contact plug to create a recess in the contact hole, forming a hard mask layer in the recess, and removing the first and second silicon nitride features via selective etching to form first and second air gaps, respectively.
    Type: Application
    Filed: July 26, 2022
    Publication date: December 15, 2022
    Inventors: Hsin-Che CHIANG, Ju-Li HUANG, Chun-Sheng LIANG, Jeng-Ya YEH
  • Publication number: 20220400566
    Abstract: The disclosure provides an electronic device including a support plate and a first panel. The support plate includes a first bridge member and a second bridge member. The first panel is disposed on the support plate and includes a substrate, a signal line, a third bridge member, and a fourth bridge member. The signal line is disposed on the substrate. The third bridge member penetrates through the substrate and is electrically connected to the signal line and the first bridge member. The fourth bridge member penetrates through the substrate and is electrically connected to the signal line and the second bridge member.
    Type: Application
    Filed: May 13, 2022
    Publication date: December 15, 2022
    Applicant: Innolux Corporation
    Inventors: Ming-Chun Tseng, Kung-Chen Kuo, Yi-Hua Hsu