Abstract: A two-phase immersion cooling device includes an upper box body, a lower box body, a plurality of heating elements, and a condenser. The walls of the upper box body form a first cavity. The lower box body defines a second cavity containing coolant. The heating elements are disposed in the second cavity and immersing in the coolant. The condenser in the upper box body includes multiple rows and columns of condensing tubes, is arranged across or along the upper box body to fill the first cavity. The lower box body is detachably and hermetically connected to the bottom of the upper box body, connecting the second cavity with the first cavity to form an accommodating cavity.

Abstract: A composition for inhibiting Parkinson's disease is provided, comprising 1 part by weight of soybean oil, 5 to 14 parts by weight of an emulsifier, 0.5 to 2 parts by weight of lecithin, 81 to 91 parts by weight of deionized water, and 2.345 to 17.833 parts by weight of cinnamaldehyde. Furthermore, the present invention also provides a method for manufacturing the composition for inhibiting Parkinson's disease, to produce the aforementioned composition for inhibiting Parkinson's disease.

Abstract: An electrically controlled optical screen including a switchable scattering element and an electrically controlled decorating module is provided. The switchable scattering element is disposed on a side of the electrically controlled decorating module and is configured to switch between a scattering state and a transparent state. The electrically controlled decorating module includes a first polarizer, a first quarter-wave plate, a cholesteric liquid crystal layer, an electrically controlled wave plate, a second quarter-wave plate and a second polarizer, which are sequentially stacked. The electrically controlled wave plate has a liquid crystal layer. The second polarizer is disposed between the switchable scattering element and the second quarter-wave plate.

Abstract: A pixel array is provided. The pixel array includes a plurality of pixels, wherein each of the pixels includes a light emitting diode, a first transistor, a second transistor, a third transistor, a fourth transistor, and a fifth transistor. The first transistor receives a first data signal and a first scan signal. The second transistor is coupled to the first transistor and an anode of the light emitting diode. The third transistor receives a system high voltage and a first control signal, and is coupled to the second transistor. The fourth transistor is coupled to an anode of a light emitting diode of an adjacent pixel, a control terminal of the third transistor, and a cathode of the light emitting diode. The fifth transistor is coupled to the cathode of the light emitting diode, and receives a second control signal and a system low voltage.

Abstract: An image processing model generation method includes: inputting at least one training sample lesion image into an initial image processing model, the initial image processing model including a classification layer and a marking layer; calling the classification layer; calling the marking layer; obtaining a loss value of the at least one training sample lesion image in the initial image processing model; determining whether the loss value is within a preset range; if not, updating parameters of the initial image processing model, an image processing model with updated parameters being used as an initial image processing model in next training; and repeating above steps until the loss value is within the preset range.

Abstract: An electronic label device for an electronic shelf label system includes a display module, a driving chip and a system circuit board. The display module includes a driving substrate and a display medium arranged on the driving substrate. The driving chip is arranged on the driving substrate and is electrically connected with the driving substrate. The driving chip controls the display module to display images. The driving chip includes a switch circuit. The system circuit board is electrically connected with the driving substrate and the driving chip. The system circuit board includes a main controller and a light-emitting element, which is electrically connected with the switch circuit. The main controller transmits a control signal to the driving chip, and the driving chip controls the switch circuit, based on the control signal, to drive the light-emitting element to emit light.

Abstract: An apparatus (e.g., an access point (AP)) announces to one or more stations (STAs), in a frame, one or more preamble detection (PD) channels in a frequency segment such that each of the one or more STAs monitors a respective one of the one or more PD channels to detect any transmission on the one or more PD channels. The apparatus then wirelessly communicates with at least one of the one or more STAs on one of the one or more PD channels during a transmission opportunity (TXOP).

Abstract: Apparatuses, systems, and techniques are presented to generate image data. In at least one embodiment, one or more neural networks are used to cause a lighting effect to be applied to one or more objects within one or more images based, at least in part, on synthetically generated images of the one or more objects.

Abstract: A ceramic article includes a ceramic body including a spinel (MgAl2O4) structure, wherein a ratio of a density of the spinel structure to a theoretical density of a spinel is greater than 99.5%. A semiconductor apparatus for manufacturing a semiconductor structure includes a ceramic article including a spinel (MgAl2O4) structure, wherein a ratio of a density of the spinel structure to a theoretical density of a spinel is greater than 99.5%. A method of manufacturing a ceramic article includes providing a green body; heating the green body to a sintering temperature; compressing the green body; applying a electrical pulse to the green body; and forming a ceramic body including a spinel (MgAl2O4) structure after heating, compressing and applying the electrical pulse to the green body.

Abstract: An imaging optical lens assembly includes five lens elements. The five lens elements in order from an object side to an image side along an optical path are a first lens element, a second lens element, a third lens element, a fourth lens element and a fifth lens element. Each of the five lens elements has an object-side surface facing the object side and an image-side surface facing the image side. The first lens element has positive refractive power, the second lens element has negative refractive power and the third lens element has negative refractive power. With specific conditions being satisfied, the imaging optical lens assembly can be miniaturized while providing good image quality.

Abstract: A device detects a primary channel busy for an operating bandwidth having a plurality of channel segments comprising the primary channel and at least one non-primary channel. In response to detecting the primary channel busy, the device obtains a transmission opportunity (TXOP) through a first non-primary channel of the at least one non-primary channel. Then, the device performs a transmission at least on the first non-primary channel during the TXOP.

Abstract: A display device includes a multiple of light-emitting elements and a multiple of driving circuits. Each of the multiple of driving circuits is configured to generate a driving current flowing through one of the multiple of light-emitting elements. Each of the multiple of driving circuits includes a first transistor, a second transistor, a reset circuit, a first control circuit and a second control circuit. The driving current flows from a first system high voltage terminal through the first transistor, the second transistor and one of the multiple of light-emitting elements to a system low voltage terminal. The first control circuit is configured to control the first transistor to modulate pulse amplitude of the driving current. The second control circuit is configured to control the second transistor to modulate pulse width of the driving current.

Abstract: A semiconductor device is manufactured by modifying an electromagnetic field within a deposition chamber. In embodiments in which the deposition process is a sputtering process, the electromagnetic field may be modified by adjusting a distance between a first coil and a mounting platform. In other embodiments, the electromagnetic field may be adjusted by applying or removing power from additional coils that are also present.

Abstract: A mobile device with high radiation efficiency includes a ground element, a first radiation element, a second radiation element, a third radiation element, a fourth radiation element, a dielectric substrate, a speaker body, and a cable. The first radiation element and the fourth radiation element are coupled to the ground element. The second radiation element and the third radiation element are coupled to a feeding point. An antenna structure is formed by the first radiation element, the second radiation element, the third radiation element, and the fourth radiation element. The speaker body has a first vertical projection on the dielectric substrate, and the first vertical projection at least partially overlaps the third radiation element. The cable is coupled to the speaker body. The cable has a second vertical projection on the dielectric substrate, and the second vertical projection does not overlap the antenna structure at all.

Abstract: A method of forming a semiconductor device includes forming a source/drain region and a gate electrode adjacent the source/drain region, forming a hard mask over the gate electrode, forming a bottom mask over the source/drain region, wherein the gate electrode is exposed, and performing a nitridation process on the hard mask over the gate electrode. The bottom mask remains over the source/drain region during the nitridation process and is removed after the nitridation. The method further includes forming a silicide over the source/drain region after removing the bottom mask.

Abstract: A preparation method of a positive electrode material of a lithium battery is provided, including mixing a compound containing at least one ethylenically-unsaturated group and one carbonyl group or a derivative thereof and a Ni-rich oxide of lithium and transition metal to react. The compound containing at least one ethylenically-unsaturated group and one carbonyl group is selected from a group consisting of a maleimide-based compound, an acrylate-based compound, a methacrylate-based compound, an acrylamide-based compound, a vinylamide-based compound, and a combination thereof, and the Ni-rich oxide of lithium and transition metal is represented by formula I, LiNixMyO2 ??Formula I wherein x+y=1, 1>x?0.5, and M is at least one transition metal element except Ni.

Abstract: A method of forming a semiconductor device includes forming an electronic component over a substrate; forming a first insulating layer over the electronic component; forming a contact plug extending through the first insulating layer to the electronic component, wherein the contact plug includes a first portion formed of a conductive material and a second portion formed of an oxide of the conductive material disposed over the first portion; performing a treatment to expose the contact plug and the first insulating layer to a gas mixture of N2 and NH3; after performing the treatment, forming a second insulating layer over the contact plug and the first insulating layer; and forming an interconnect in the second insulating layer and in contact with the contact plug.

Abstract: A semiconductor package with improved solderability at sidewall includes a chip, a molding compound encapsulating the chip, and multiple leads distributed at sidewalls of the semiconductor package. The leads are formed as a conductive layer that is electrically connected to bonding pads of the chip. Each of the leads has a stepped surface exposed from the molding compound, wherein the stepped surface is shaped by two sequentially overlapped photoresist layers. The stepped surface of each lead allows to accommodate more solder to enhance the reliability of a solder joint between the semiconductor and a printed circuit board. Therefore, the solder joints of the semiconductor package are easily inspected by automatic optical inspection (AOI) equipment.

Abstract: Described are electrostatic chucks designed for use in supporting a workpiece during a workpiece processing step, the electrostatic chuck including a gas flow system.

Abstract: The disclosure relates to methods of analyzing a post-translationally modified protein of interest using electrophoresis, the methods comprising deglycosylating the protein of interest after labeling.