Patents by Inventor Chun Wang

Chun Wang has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20240374944
    Abstract: A battery module capable of suppressing spread of battery fire including a case, a plurality of battery packs, a plurality of temperature sensors, an energy consumption module and a controller. The case forms an accommodation space, and the battery packs is accommodated in the accommodation space. The temperature sensors are dispersedly configured to the accommodation space, and the temperature sensors respectively detect an ambient temperature around configure locations. The controller is coupled to the temperature sensors, and when the ambient temperature detected by one of the temperature sensors is greater than or equal to a first specific temperature range, the controller controls the energy consumption module to consume a battery capacity of at least one battery pack around the one of the temperature sensors.
    Type: Application
    Filed: May 12, 2023
    Publication date: November 14, 2024
    Inventors: Chung-Hsing CHANG, Wen-Yi CHEN, Way-Lung WU, Teng-Chi HUANG, Shi-Cheng TONG, Yong-Han CHEN, Yu-Chun WANG
  • Publication number: 20240381776
    Abstract: A semiconductor structure includes a substrate, a piezoelectric layer, and a stress structure. The substrate includes a first surface and a second surface, wherein a portion of the substrate proximal to the first surface defines a diaphragm. The piezoelectric layer is disposed over the first surface of the substrate and surrounds the diaphragm, wherein the piezoelectric layer includes a first portion and a second portion arranged along a periphery of the diaphragm from a top view. The stress structure includes a plurality of dielectric layers disposed over the piezoelectric layer and between the substrate and the piezoelectric layer, and a total thickness of a first portion of the stress structure overlapping the first portion of the piezoelectric layer is different from a total thickness of a second portion of the stress structure overlapping the second portion of the piezoelectric layer. A method for manufacturing a semiconductor structure is also provided.
    Type: Application
    Filed: May 10, 2023
    Publication date: November 14, 2024
    Inventors: SHENG KAI YEH, CHI-YUAN SHIH, SHIH-FEN HUANG, WEI CHUN WANG, SHAO-DA WANG
  • Publication number: 20240379557
    Abstract: A semiconductor device includes a transistor having a source/drain and a gate. The semiconductor device also includes a conductive contact for the transistor. The conductive contact provides electrical connectivity to the source/drain or the gate of the transistor. The conductive contact includes a plurality of barrier layers. The barrier layers have different depths from one another.
    Type: Application
    Filed: July 24, 2024
    Publication date: November 14, 2024
    Inventors: Chia-Yang Wu, Shiu-Ko JangJian, Ting-Chun Wang, Yung-Si Yu
  • Patent number: 12141663
    Abstract: A computer-implemented method includes gathering data samples into a data set, correcting for imbalance in the data set to produce a corrected data set by applying active learning to the data set to increase a number of double barreled question data samples occurring in the data set, selecting an optimal machine learning model for the corrected data set, training the optimal machine learning model using the corrected data set, operating the optimal machine learning model on new data to produce a prediction result, and generating a visual representation of at least one prediction results.
    Type: Grant
    Filed: June 24, 2020
    Date of Patent: November 12, 2024
    Assignee: SurveyMonkey Inc.
    Inventors: King Chung Ho, Fernando Espino Casas, Chun Wang, Melanie Lei
  • Publication number: 20240371262
    Abstract: Embodiments of the present disclosure provide a method for traffic flow control considering a bus stop in a connected environment, comprising: determining an influence region of the bus stop; dividing the influence region of the bus stop into influence subregions; collecting vehicle information of each of the influence subregions at time t; comparing lane changing pressures of different influence subregions of the bus stop; determining a predicted count of lane changing vehicles of each of the influence subregions based on lane changing pressure differences; and selecting optimal lane changing vehicles to complete lane changing. A vehicle density distribution in the influence region of the bus stop can be dynamically regulated through vehicle information interaction in the connected environment, thereby making the spatial distribution of the traffic flow more balanced, saving vehicle traveling time, and improving the operation efficiency of the traffic flow.
    Type: Application
    Filed: April 26, 2024
    Publication date: November 7, 2024
    Applicants: HEFEI UNIVERSITY OF TECHNOLOGY, ANHUI BAICHENG HUITONG TECHNOLOGY CO., LTD., HEFEI UNIVERSITY OF TECHNOLOGY DESIGN INSTITUTE (GROUP) CO., LTD.
    Inventors: Weihua ZHANG, Taifeng NI, Heng DING, Chun WANG, Wenjia ZHU, Zeyang CHENG, Ye YU, Haijian BAI, Wanli DONG, Huiwen LIU
  • Publication number: 20240363779
    Abstract: The present invention provides a photovoltaic panel packaging structure and method for the same. The packaging structure comprises a frame and a solar photovoltaic panel. The solar photovoltaic panel includes a first frame surface and a second frame surface with a receiving space and grooves formed therein. The a solar photovoltaic panel is installed in the receiving space and stacked on top of a first stop portion. The solar photovoltaic panel includes a first encapsulating layer, a second encapsulating layer. The first encapsulating layer includes a plurality of engaging strips extending along the edges of the solar photovoltaic panel, the engaging strips are respectively embedded in the corresponding grooves to hold the solar photovoltaic panel in place in the frame. Meanwhile, a third encapsulating layer extends to connect to the second frame surface. As a result, weight and thickness can be reduced while reducing multiple packaging passes and simplifying the assembly process.
    Type: Application
    Filed: July 17, 2023
    Publication date: October 31, 2024
    Inventors: Yao-Chung Hsiao, Hui-Yun Wu, Hung-Chun Wang, Yu-Sheng Kuo
  • Publication number: 20240361681
    Abstract: A projection device including an imaging module, a freeform-surface reflective mirror, and a projection lens assembly is provided. The imaging module is configured to provide imaging beams and includes a display panel and a light-source module. The imaging beams are transmitted toward the projection lens assembly by the freeform-surface reflective mirror. The projection lens assembly includes a first optical axis and a second optical axis. The first optical axis passes through the projection lens assembly. The imaging beams emitted by the projection device form an imaging-beam region, in which the first optical axis does not pass through a geometric center of the imaging-beam region, and the second optical axis passes through a geometric center region of the display panel. The geometric center region is a region having a distance less than or equal to 40% of a minimum width of the display panel from a geometric center of the display panel.
    Type: Application
    Filed: April 24, 2024
    Publication date: October 31, 2024
    Applicant: Coretronic Corporation
    Inventors: Wei-Ting Wu, Wen-Chun Wang, Ching-Chuan Wei, You-Da Chen, Chun-An Wei, Yi-En Hsu
  • Patent number: 12130467
    Abstract: A backlight module comprises a back plate, a light-guiding plate arranged at the back plate and a light source module. The light-guiding plate has an incident surface and an emitting surface connected to each other. The light source module has a base board and at least one light-emitting unit. The base board is disposed at the emitting surface of the light-guiding plate. The light-emitting unit is mounted at the base board and faces the incident surface of the light-guiding plate. The base board comprises an electrically-connecting portion and at least one heat dissipation portion. The electrically-connecting portion is electrically connected to the light-emitting unit. The heat dissipation portion extends from the electrically-connecting portion toward a direction away from the light-guiding plate without being electrically connected to the light-emitting unit. A display device having the backlight module is also provided.
    Type: Grant
    Filed: December 13, 2023
    Date of Patent: October 29, 2024
    Assignee: RADIANT OPTO-ELECTRONICS CORPORATION
    Inventors: Kuan-Feng Chen, Che-Kai Chang, Jyun-Siang Chen, Chih-Chun Wang
  • Patent number: 12131632
    Abstract: Embodiments of the present disclosure provide a method for traffic flow control considering a bus stop in a connected environment, comprising: determining an influence region of the bus stop; dividing the influence region of the bus stop into influence subregions; collecting vehicle information of each of the influence subregions at time t; comparing lane changing pressures of different influence subregions of the bus stop; determining a predicted count of lane changing vehicles of each of the influence subregions based on lane changing pressure differences; and selecting optimal lane changing vehicles to complete lane changing. A vehicle density distribution in the influence region of the bus stop can be dynamically regulated through vehicle information interaction in the connected environment, thereby making the spatial distribution of the traffic flow more balanced, saving vehicle traveling time, and improving the operation efficiency of the traffic flow.
    Type: Grant
    Filed: April 26, 2024
    Date of Patent: October 29, 2024
    Assignees: HEFEI UNIVERSITY OF TECHNOLOGY, ANHUI BAICHENG HUITONG TECHNOLOGY CO., LTD., HEFEI UNIVERSITY OF TECHNOLOGY DESIGN INSTITUTE (GROUP) CO., LTD.
    Inventors: Weihua Zhang, Taifeng Ni, Heng Ding, Chun Wang, Wenjia Zhu, Zeyang Cheng, Ye Yu, Haijian Bai, Wanli Dong, Huiwen Liu
  • Patent number: 12131645
    Abstract: Embodiments of the present disclosure provide a method for lane changing decision for vehicles on expressways considering safety risks in a networked environment, which is applicable to a multi-lane expressway. The method includes collecting a demand for lane change of a target vehicle; collecting a roadway and a lane where the target vehicle is located; collecting intervals between the target vehicle and a front vehicle and a rear vehicle on a lane that is switching into; determining a lane change direction of the vehicle; and executing a lane change operation by the target vehicle. A lane changing decision model provided in the embodiments of the present disclosure helps to improve the efficiency of lane change and the safety of lane change in expressways and provides a support for changing lanes in a multi-lane expressway.
    Type: Grant
    Filed: May 24, 2024
    Date of Patent: October 29, 2024
    Assignees: HEFEI UNIVERSITY OF TECHNOLOGY, SOUTHEAST UNIVERSITY, HEFEI UNIVERSITY OF TECHNOLOGY DESIGN INSTITUTE (GROUP) CO., LTD
    Inventors: Weihua Zhang, Yangyang Gan, Zhongxiang Feng, Zeyang Cheng, Zhibin Li, Jian Lu, Chun Wang, Wenjia Zhu, Heng Ding, Ye Yu, Haijian Bai
  • Publication number: 20240355784
    Abstract: A three-dimensional (3D) integrated circuit (IC) is provided. In some embodiments, the 3D IC comprises a first IC die comprising a first substrate, a first interconnect structure disposed over the first substrate, and a first through substrate via (TSV) disposed through the first substrate. The 3D IC further comprises a second IC die comprising a second substrate, a second interconnect structure disposed over the second substrate, and a second TSV disposed through the second substrate. The 3D IC further comprises a bonding structure arranged between back sides of the first IC die and the second IC die opposite to corresponding interconnect structures and bonding the first IC die and the second IC die. The bonding structure comprises conductive features disposed between and electrically connecting the first TSV and the second TSV.
    Type: Application
    Filed: June 28, 2024
    Publication date: October 24, 2024
    Inventors: Kuo-Ming Wu, Ching-Chun Wang, Dun-Nian Yaung, Hsing-Chih Lin, Jen-Cheng Liu, Min-Feng Kao, Yung-Lung Lin, Shih-Han Huang, I-Nan Chen
  • Patent number: 12121288
    Abstract: In some aspects, the present disclosure pertains to methods of treating a tissue volume comprising (a) administering an implantable composition comprising a releasable membrane-active agent to a target site such that the membrane-active agent is locally released to the tissue volume and (b) performing irreversible, reversible and/or thermal treatment by application of a pulsed electric field to the tissue volume. In other aspects, the present disclosure pertains to embolic compositions that comprise releasable membrane-active agents.
    Type: Grant
    Filed: March 17, 2021
    Date of Patent: October 22, 2024
    Assignees: Boston Scientific Scimed, Inc., Regents of the University of Minnesota
    Inventors: Bruce R. Forsyth, Chun Wang, Samuel Hanson
  • Publication number: 20240347910
    Abstract: A mobile device supporting wideband operations includes a grounding radiation element, a first radiation element, a second radiation element, a third radiation element, a fourth radiation element, a fifth radiation element, and a sixth radiation element. The first radiation element has a first feeding point. The first radiation element is coupled through the second radiation element to the grounding radiation element. The fourth radiation element has a second feeding point. The fifth radiation element is adjacent to the fourth radiation element. The fifth radiation element is coupled through the sixth radiation element to the grounding radiation element. A first antenna structure is formed by the grounding radiation element, the first radiation element, the second radiation element, and the third radiation element. A second antenna structure is formed by the grounding radiation element, the fourth radiation element, the fifth radiation element, and the sixth radiation element.
    Type: Application
    Filed: July 5, 2023
    Publication date: October 17, 2024
    Inventors: Kun-Sheng CHANG, Ching-Chi LIN, Chuan-Chun WANG
  • Patent number: 12117596
    Abstract: An image lens assembly includes five lens elements, which are, in order from an object side to an image side along an optical path, a first lens element, a second lens element, a third lens element, a fourth lens element and a fifth lens element. The first lens element has positive refractive power. The third lens element has negative refractive power. The fourth lens element with positive refractive power has an object-side surface being convex in a paraxial region thereof and an image-side surface being convex in a paraxial region thereof. The fifth lens element has an object-side surface being convex in a paraxial region thereof and an image-side surface being concave in a paraxial region thereof. The image-side surface of the fifth lens element includes at least one convex critical point in an off-axis region thereof.
    Type: Grant
    Filed: October 16, 2023
    Date of Patent: October 15, 2024
    Assignee: LARGAN PRECISION CO., LTD.
    Inventors: Chung-Yu Wei, Hung-Shuo Chen, Kuan-Chun Wang, Wei-Yu Chen
  • Patent number: 12118925
    Abstract: A display device includes a multiple of light-emitting elements and a multiple of driving circuits. Each of the multiple of driving circuits is configured to generate a driving current flowing through one of the multiple of light-emitting elements. Each of the multiple of driving circuits includes a first transistor, a second transistor, a reset circuit, a first control circuit and a second control circuit. The driving current flows from a first system high voltage terminal through the first transistor, the second transistor and one of the multiple of light-emitting elements to a system low voltage terminal. The first control circuit is configured to control the first transistor to modulate pulse amplitude of the driving current. The second control circuit is configured to control the second transistor to modulate pulse width of the driving current.
    Type: Grant
    Filed: September 7, 2023
    Date of Patent: October 15, 2024
    Assignee: AU OPTRONICS CORPORATION
    Inventors: Che-Chia Chang, Shang-Jie Wu, Yu-Chieh Kuo, Hsien-Chun Wang, Sin-An Lin, Mei-Yi Li, Yu-Hsun Chiu, Ming-Hung Chuang, Yi-Jung Chen
  • Patent number: 12112524
    Abstract: An image augmentation method applied to an electronic device is provided. The method includes constructing a variational learner and a discriminator based on a fully convolutional neural network. A target image is obtained by inputting a gas leakage image into the variational learner. A variational autoencoder model is obtained by training the variational learner based on a discrimination result of the discriminator on the target image. A reconstruction accuracy rate is calculated based on a test image, an augmented model is obtained by adjusting the variational autoencoder model based on the gas leakage image, in response that the reconstruction accuracy rate being less than a preset threshold; and an augmented image is obtained by inputting the image to be augmented into the augmented model.
    Type: Grant
    Filed: May 31, 2022
    Date of Patent: October 8, 2024
    Assignee: HON HAI PRECISION INDUSTRY CO., LTD.
    Inventors: Wei-Chun Wang, Guo-Chin Sun
  • Patent number: 12113586
    Abstract: Embodiments of this application disclose a signal processing method and a related apparatus, to estimate a passive intermodulation (PIM) signal strength. The method in embodiments of this application includes: obtaining first downlink signal data corresponding to each of N cells in a preset bandwidth resource scheduling solution. Then, first characteristic data corresponding to each piece of the first downlink signal data is determined. Then, a first passive intermodulation PIM signal strength corresponding to a first cell is determined based on a preset signal strength evaluation model and the first characteristic data corresponding to each of the N cells, to accurately estimate impact of the first PIM signal on the first cell.
    Type: Grant
    Filed: April 28, 2022
    Date of Patent: October 8, 2024
    Assignee: Huawei Technologies Co., Ltd.
    Inventors: Jingfang Zha, Chunyuan Chen, Qingjiang Wang, Chun Wang
  • Patent number: 12109085
    Abstract: An inversion maintenance device has a case, an inverting mechanism, and a control system. The case forms an inversion space. The inverting mechanism has an inverting base and multiple adapting modules. The inverting base is pivotally mounted in the inversion space. The adapting modules are mounted on the inverting base. Each of the adapting modules has an adapting port. The inverting base is capable of inverting to make the adapting port face downward and cover the inversion space. Dental handpieces can be mounted on the adapting modules. The control system has a control module and an operation input terminal. The operation input terminal is electrically connected to the control module and is capable of controlling the control module to inject a working fluid with pressure into the dental handpiece via the adapting module.
    Type: Grant
    Filed: March 22, 2022
    Date of Patent: October 8, 2024
    Assignee: MICROP TECHNOLOGY (TAIWAN), INC.
    Inventor: Shih-Chun Wang
  • Patent number: 12106970
    Abstract: The present disclosure discloses a pattern sheet, a semiconductor intermediate product, and a hole etching method. The pattern sheet includes a substrate, a dielectric layer, and a mask structure. The mask structure includes a multi-layer mask layer. An uppermost mask layer is a photoresist layer. A thickness of each layer of the mask layer and etching selectivity ratios between the layers below the mask layer satisfy that in each two neighboring layers of the mask layer, a lower layer of the mask layer is etched to form a through-hole penetrating a thickness of the lower layer of the mask layer, a remaining thickness of the upper layer of the mask layer is greater than or equal to zero.
    Type: Grant
    Filed: April 2, 2021
    Date of Patent: October 1, 2024
    Assignee: BEIJING NAURA MICROELECTRONICS EQUIPMENT CO., LTD.
    Inventors: Qiushi Xie, Xiaoping Shi, Qingjun Zhou, Dongsan Li, Chun Wang, Yiming Zhang
  • Patent number: D1049265
    Type: Grant
    Filed: December 14, 2023
    Date of Patent: October 29, 2024
    Inventor: Chun Wang