Patents by Inventor Chun Wang

Chun Wang has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 12107333
    Abstract: This invention provides an antenna assembly equipped with a sub-wavelength structured enhancer, comprising an antenna supporting substrate with a top surface and a bottom surface opposite to each other; a first patch antenna is disposed on the top surface of the antenna supporting substrate or inside of the antenna supporting substrate; a ground layer is disposed under the bottom surface of the antenna supporting substrate; a signal feeding layer for transmitting satellite communicating signals is disposed on one of surfaces of the antenna supporting substrate, or inside of the antenna supporting substrate, or under the first patch antenna, or under a side of the ground layer back to the antenna supporting substrate; and a solid sub-wavelength structured enhancer is disposed above the first patch antenna and spaced with each other by an air gap ranging between 7 mm and 47 mm.
    Type: Grant
    Filed: September 14, 2022
    Date of Patent: October 1, 2024
    Assignee: AuthenX Inc.
    Inventors: Yu-Chun Wang, Po-Kuan Shen, Sheng-Fu Lin, Jenq-Yang Chang, Mao-Jen Wu
  • Patent number: 12100789
    Abstract: A display device, including a circuit substrate, a light-emitting layer, a quarter-wave plate, and a band-pass polarizing layer, is provided. The light-emitting layer is disposed on the circuit substrate and has light-emitting structures, which are electrically connected to the circuit substrate and include first light-emitting structures, which have a first main light-emitting wavelength. The quarter-wave plate is disposed in overlap with the light-emitting structures and is located between the band-pass polarizing layer and the light-emitting layer. The band-pass polarizing layer includes at least one first band-pass polarizing pattern, which have a first absorption axis. The first wavelength range is the first main light-emitting wavelength±10 nm. An average transmittance of the first band-pass polarizing patterns to light with a wavelength outside the first wavelength range and a polarization direction parallel to the first absorption axis is less than 20%.
    Type: Grant
    Filed: November 15, 2021
    Date of Patent: September 24, 2024
    Assignee: Coretronic Corporation
    Inventors: Ping-Yen Chen, Wen-Chun Wang, Chung-Yang Fang, Yu-Fan Chen
  • Patent number: 12100335
    Abstract: This disclosure provides systems, devices, apparatus, and methods, including computer programs encoded on storage media, for a power efficient display architecture. A display processor may obtain an indication that UC is to be displayed at a first resolution or a second resolution, where the first resolution is higher than the second resolution. The display processor may drive a first display via a first controller of a first DPU based on the indication. The display processor may drive a second display via a controller of a second DPU if the UC is to be displayed at the first resolution, or drive the second display via a second controller of the first DPU if the UC is to be displayed at the second resolution.
    Type: Grant
    Filed: November 17, 2022
    Date of Patent: September 24, 2024
    Assignee: QUALCOMM Incorporated
    Inventors: Chun Wang, Sreekanth Modaikkal, Kumar Saurabh, Samson Kim, Kit Fong Ng
  • Publication number: 20240310126
    Abstract: A vapor chamber includes a first cover, a second cover and a partition. The second cover and the first cover are bonded together to form a heat dissipation space. The second cover has at least two through holes. The at least two through holes correspond to the heat dissipation space. The at least two through holes are configured for at least two pipes to be inserted therein. The partition is located in the heat dissipation space, and protrudes from the first cover. The partition divides the heat dissipation space into an air tight subspace and an open subspace which are not in fluid communication with each other. The partition surrounds the open subspace. The open subspace is in fluid communication with the at least two through holes.
    Type: Application
    Filed: September 27, 2023
    Publication date: September 19, 2024
    Applicant: VAST GLORY ELECTRONICS & HARDWARE & PLASTIC(HUI ZHOU) LTD.
    Inventors: Lei Lei LIU, Hua-Yuan LIN, Yao-Chun WANG, Zhijie YANG
  • Publication number: 20240306893
    Abstract: The present disclosure relates to a therapeutic endoscope. The therapeutic endoscope includes a main body, an image sensor unit connected to the main body, and a cover attached to the main body. The cover includes a first opening adjacent to the image sensor unit, a second opening opposite to the first opening, and a sidewall extending between the first opening and the second opening. The sidewall of the cover includes a third opening connecting the first opening and the second opening. When the therapeutic endoscope is used by a user, the third opening is configured to be disposed on a right hand side or a left hand side of the user. The present disclosure also relates to a cover for a therapeutic endoscope.
    Type: Application
    Filed: May 21, 2024
    Publication date: September 19, 2024
    Inventor: Pa-Chun WANG
  • Publication number: 20240314674
    Abstract: A wireless communication method employed by an access point (AP) includes: negotiating with another AP for setting up a coordinated service period (SP), and sending a first announcement frame inside a first basic service set (BSS) to inform that the coordinated SP has been created. The step of negotiating with the another AP for setting up the coordinated SP includes: receiving a request frame from the another AP, wherein the request frame includes a plurality of SP parameters; and sending a response frame to the another AP. The AP belongs to the first BSS, and the another AP belongs to a second BSS different from the first BSS.
    Type: Application
    Filed: May 31, 2024
    Publication date: September 19, 2024
    Applicant: MEDIATEK INC.
    Inventors: Chien-Fang Hsu, Chao-Chun Wang, James Chih-Shi Yee
  • Patent number: 12094077
    Abstract: A method for processing an image, an apparatus for processing an image, an electronic device, and a storage medium. The method includes: obtaining a first aim-to-mask flag of a pixel to be interpolated; obtaining second aim-to-mask flags of pixels in a preset neighborhood of the pixel to be interpolated; determining flag categories and a number corresponding to each of the flag categories, in the first aim-to-mask flag and the second aim-to-mask flags; obtaining a third aim-to-mask flag of the pixel to be interpolated based on the flag categories and the number corresponding to each of the flag categories; obtaining interpolation data of the pixel to be interpolated based on the third aim-to-mask flag of the pixel to be interpolated; and performing motion compensation on the pixel to be interpolated based on the interpolation data.
    Type: Grant
    Filed: July 16, 2021
    Date of Patent: September 17, 2024
    Assignee: AMLOGIC (SHANGHAI) CO., LTD.
    Inventors: Ping Ji, Tao Ji, Chun Wang, Dongjian Wang, Xuyun Chen
  • Patent number: 12086463
    Abstract: A host system coupled to a storage system provides hardware support for command abort. The host system includes a host controller, which detects that a host driver has disabled an enable indicator of a submission queue (SQ). In response to the detection, the host controller stops further fetching from the SQ. The host controller sends all entries that have been fetched from the SQ to the storage device, and sets a status indicator of the SQ to indicate stopped fetching of the SQ.
    Type: Grant
    Filed: April 19, 2022
    Date of Patent: September 10, 2024
    Assignee: MediaTek Inc.
    Inventors: Chih-Chieh Chou, Chia-Chun Wang, Liang-Yen Wang, Szu-Chi Liu, Chin Chin Cheng
  • Patent number: 12089134
    Abstract: An access point (AP) includes a transmitter (TX) circuit, a receiver (RX) circuit, and a control circuit. The control circuit negotiates with at least one another AP via the TX circuit and the RX circuit, for setting up a coordinated service period (SP). In addition, a method for setting up the coordinated SP in a multiple AP environment includes: sending a request frame from a first AP to at least one second AP, wherein the request frame includes a plurality of SP parameters; receiving a response frame generated from the at least one second AP in response to the request frame; and in response to the response frame, setting up the coordinated SP by sending a setup frame to the at least one another AP, wherein the setup frame is set by updating at least a portion of the plurality of SP parameters.
    Type: Grant
    Filed: November 10, 2021
    Date of Patent: September 10, 2024
    Assignee: MEDIATEK INC.
    Inventors: Chien-Fang Hsu, Chao-Chun Wang, James Chih-Shi Yee
  • Patent number: 12089254
    Abstract: A first station (STA) and a second STA perform bandwidth negotiation with a bandwidth extension indication. Then the first STA and the second STA communicate wirelessly according to the bandwidth negotiation.
    Type: Grant
    Filed: February 23, 2023
    Date of Patent: September 10, 2024
    Assignee: MediaTek Singapore Pte. Ltd.
    Inventors: Kai Ying Lu, Yongho Seok, James Chih-Shi Yee, Chao-Chun Wang, Jianhan Liu
  • Patent number: 12080956
    Abstract: A mobile device with high radiation efficiency includes a ground element, a first radiation element, a second radiation element, a third radiation element, a fourth radiation element, a dielectric substrate, a speaker body, and a cable. The first radiation element and the fourth radiation element are coupled to the ground element. The second radiation element and the third radiation element are coupled to a feeding point. An antenna structure is formed by the first radiation element, the second radiation element, the third radiation element, and the fourth radiation element. The speaker body has a first vertical projection on the dielectric substrate, and the first vertical projection at least partially overlaps the third radiation element. The cable is coupled to the speaker body. The cable has a second vertical projection on the dielectric substrate, and the second vertical projection does not overlap the antenna structure at all.
    Type: Grant
    Filed: August 10, 2022
    Date of Patent: September 3, 2024
    Assignee: ACER INCORPORATED
    Inventors: Kun-Sheng Chang, Ching-Chi Lin, Chuan-Chun Wang
  • Publication number: 20240280646
    Abstract: An information handling system may include a strain force fuse formed on a circuit board of the information handling system, the strain force fuse configured to experience an impedance discontinuity in response to a mechanical force applied to the circuit board at or proximate to the strain force fuse and a management controller electrically coupled to the strain force fuse and configured to provide out-of-band management facilities for management of the information handling system, the management controller further configured to detect whether the impedance discontinuity has occurred.
    Type: Application
    Filed: February 17, 2023
    Publication date: August 22, 2024
    Applicant: Dell Products L.P.
    Inventors: Craig L. CHAIKEN, Kuo-Chieh LAI, Hong-Ling CHEN, Hou-Chun WANG
  • Publication number: 20240280524
    Abstract: An information handling system may include a circuit board, an integrated circuit package mounted on the circuit board, the integrated circuit package comprising: a plurality of solder balls for electrically coupling the integrated circuit package to the circuit board, the plurality of solder balls comprising a first solder ball and a second solder ball, an internal electrical coupling coupled between the first solder ball and the second solder ball, and a management controller electrically coupled to the internal electrical coupling, the first solder ball, and the second solder ball, and configured to provide out-of-band management facilities for management of the information handling system, the management controller further configured to detect whether an impedance discontinuity has occurred with respect to one or both of the first solder ball and the second solder ball.
    Type: Application
    Filed: February 17, 2023
    Publication date: August 22, 2024
    Applicant: Dell Products L.P.
    Inventors: Craig L. CHAIKEN, Hou-Chun WANG, Kuo-Chieh LAI, Hong-Ling CHEN
  • Publication number: 20240272349
    Abstract: A backlight module comprises a back plate, a light-guiding plate arranged at the back plate and a light source module. The light-guiding plate has an incident surface and an emitting surface connected to each other. The light source module has a base board and at least one light-emitting unit. The base board is disposed at the emitting surface of the light-guiding plate. The light-emitting unit is mounted at the base board and faces the incident surface of the light-guiding plate. The base board comprises an electrically-connecting portion and at least one heat dissipation portion. The electrically-connecting portion is electrically connected to the light-emitting unit. The heat dissipation portion extends from the electrically-connecting portion toward a direction away from the light-guiding plate without being electrically connected to the light-emitting unit. A display device having the backlight module is also provided.
    Type: Application
    Filed: December 13, 2023
    Publication date: August 15, 2024
    Inventors: Kuan-Feng CHEN, Che-Kai CHANG, Jyun-Siang CHEN, Chih-Chun WANG
  • Patent number: 12063070
    Abstract: A wireless radio frequency conversion system is disclosed. The wireless radio frequency conversion system includes a primary distributing device, a one-to-many conversion device, a plurality of first optical fiber networks, a plurality of remote antenna devices, and a plurality of antennas. The primary distributing device is configured to receive a first photoelectric signal. The one-to-many conversion device is configured to perform an optical-electrical conversion and a one-to-many conversion to the first photoelectric signal so as to generate a plurality of second photoelectric signals. The plurality of first optical fiber networks are configured to transmit the plurality of second photoelectric signals. The plurality of remote antenna devices are configured to receive and perform an optical-electrical conversion to the plurality of second photoelectric signals so as to generate a plurality of third photoelectric signals.
    Type: Grant
    Filed: September 8, 2022
    Date of Patent: August 13, 2024
    Inventors: Po-Kuan Shen, Yu-Chun Wang, Kai-Lun Han, Jenq-Yang Chang, Mao-Jen Wu
  • Publication number: 20240266182
    Abstract: The present disclosure discloses a pattern sheet, a semiconductor intermediate product, and a hole etching method. The pattern sheet includes a substrate, a dielectric layer, and a mask structure. The mask structure includes a multi-layer mask layer. An uppermost mask layer is a photoresist layer. A thickness of each layer of the mask layer and etching selectivity ratios between the layers below the mask layer satisfy that in each two neighboring layers of the mask layer, a lower layer of the mask layer is etched to form a through-hole penetrating a thickness of the lower layer of the mask layer, a remaining thickness of the upper layer of the mask layer is greater than or equal to zero.
    Type: Application
    Filed: April 2, 2021
    Publication date: August 8, 2024
    Inventors: Qiushi XIE, Xiaoping SHI, Qingjun ZHOU, Dongsan LI, Chun WANG, Yiming ZHANG
  • Patent number: 12057884
    Abstract: A wireless radio frequency conversion system is disclosed. The baseband device generates or receives a baseband signal. The remote radio device transforms between the baseband signal and a radio frequency signal. The beamforming device adjusts amplitude and phase of the radio frequency signal or adjusts scale factor and phase factor of the baseband signal. The conversion device performs an optical-electrical conversion to the radio frequency signal. One of the beamforming device, the conversion device, and the wireless radio frequency conversion system having a one-to-many conversion device performs a one-to-many conversion to the radio frequency signal or the baseband signal to generate radio frequency signals or baseband signals, or performs a many-to-one conversion to the radio frequency signals or the baseband signals to generate the radio frequency signal or the baseband signal. The front-end module amplifies the radio frequency signal. The antenna transmits or receives the radio frequency signal.
    Type: Grant
    Filed: September 8, 2022
    Date of Patent: August 6, 2024
    Inventors: Po-Kuan Shen, Yu-Chun Wang, Kai-Lun Han, Jenq-Yang Chang, Mao-Jen Wu
  • Patent number: 12045970
    Abstract: A method for detecting defects in product applied in a computer device inputs an image of a product under test to an automatic encoder to obtain a reconstructed image, and the image is segmented into N image blocks and the reconstructed image is segmented into N image blocks. The computer device associates each of the N testing blocks with one reconstructed blocks according to positions of the N testing blocks in the image and positions of the N reconstructed blocks in the reconstructed image. The computer device further calculates mean square errors between each of the N testing blocks and each of the N reconstructed blocks, and associates each mean square error with each of the N testing blocks, whether the product has defects being determined based on the mean square errors corresponding to each of the N testing blocks.
    Type: Grant
    Filed: December 24, 2021
    Date of Patent: July 23, 2024
    Assignee: HON HAI PRECISION INDUSTRY CO., LTD.
    Inventors: Chin-Pin Kuo, Wei-Chun Wang
  • Patent number: 12046662
    Abstract: A semiconductor device structure is provided. The semiconductor device structure includes a dielectric structure over the substrate. The semiconductor device structure includes a contact structure passing through the dielectric structure. The contact structure includes a contact layer, a first barrier layer, and a second barrier layer, the contact layer passes through the first barrier layer, the first barrier layer passes through the second barrier layer, the first barrier layer surrounds the contact layer, the second barrier layer surrounds a first upper portion of a sidewall of the first barrier layer and exposes a first lower portion of the sidewall of the first barrier layer, and the sidewall faces away from the contact layer.
    Type: Grant
    Filed: April 26, 2023
    Date of Patent: July 23, 2024
    Assignee: TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.
    Inventors: Chia-Yang Wu, Shiu-Ko Jangjian, Ting-Chun Wang, Yung-Si Yu
  • Patent number: D1041592
    Type: Grant
    Filed: March 14, 2024
    Date of Patent: September 10, 2024
    Inventor: Chun Wang