Patents by Inventor Chun Wang

Chun Wang has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20220181451
    Abstract: A method of forming a semiconductor device includes forming a source/drain region and a gate electrode adjacent the source/drain region, forming a hard mask over the gate electrode, forming a bottom mask over the source/drain region, wherein the gate electrode is exposed, and performing a nitridation process on the hard mask over the gate electrode. The bottom mask remains over the source/drain region during the nitridation process and is removed after the nitridation. The method further includes forming a silicide over the source/drain region after removing the bottom mask.
    Type: Application
    Filed: February 21, 2022
    Publication date: June 9, 2022
    Inventors: Tsan-Chun Wang, Su-Hao Liu, Liang-Yin Chen, Huicheng Chang, Yee-Chia Yeo
  • Publication number: 20220174051
    Abstract: A packet transmission method and apparatus, and a computer storage medium, and relates to the field of communications technologies. A first device obtains service type information of an original packet. The first device generates an encapsulating security payload (ESP) packet of the original packet based on a target security association, where the ESP packet includes a packet header, an ESP header, a service type field, a first encrypted part, and an ESP authentication data field, and the service type field includes the service type information. The first device sends the ESP packet to a second device. The second device parses the service type field to obtain the service type information of the original packet. The second device performs a target operation on the ESP packet based on a service policy and the service type information of the original packet.
    Type: Application
    Filed: February 15, 2022
    Publication date: June 2, 2022
    Applicant: HUAWEI TECHNOLOGIES CO., LTD.
    Inventor: Chunning WANG
  • Patent number: 11345991
    Abstract: A semiconductor device is manufactured by modifying an electromagnetic field within a deposition chamber. In embodiments in which the deposition process is a sputtering process, the electromagnetic field may be modified by adjusting a distance between a first coil and a mounting platform. In other embodiments, the electromagnetic field may be adjusted by applying or removing power from additional coils that are also present.
    Type: Grant
    Filed: July 12, 2019
    Date of Patent: May 31, 2022
    Assignee: Taiwan Semiconductor Manufacturing Company, Ltd.
    Inventors: Jen-Chun Wang, Ya-Lien Lee, Chih-Chien Chi, Hung-Wen Su
  • Patent number: 11340737
    Abstract: The present disclosure provides a touch structure and a method for manufacturing the touch structure, a touch substrate and a display substrate. The touch structure includes: a touch electrode; a first signal line and an auxiliary conductive structure provided at a side of the touch electrode, the auxiliary conductive structure has a conductivity greater than that of the touch electrode; and a first insulation layer provided between the auxiliary conductive structure and the first signal line, the auxiliary conductive structure is coupled to the touch electrode at multiple coupling positions and is coupled to the first signal line through a first via-hole penetrating through the first insulation layer.
    Type: Grant
    Filed: November 21, 2018
    Date of Patent: May 24, 2022
    Assignees: BEIJING BOE DISPLAY TECHNOLOGY CO., LTD., BOE TECHNOLOGY GROUP CO., LTD.
    Inventors: Weipin Hu, Congcong Wei, Chun Wang, Mingxiao Jiang, Xiao Sun
  • Patent number: 11342373
    Abstract: A method for manufacturing an image sensing device includes forming an interconnection layer over a front surface of a semiconductor substrate. A trench is formed to extend from a back surface of the semiconductor substrate. An etch stop layer is formed along the trench. A buffer layer is formed over the etch stop layer. An etch process is performed for etching the buffer layer. The buffer layer and the etch stop layer include different materials.
    Type: Grant
    Filed: April 8, 2020
    Date of Patent: May 24, 2022
    Assignee: TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.
    Inventors: Wei-Chuang Wu, Ming-Tsong Wang, Feng-Chi Hung, Ching-Chun Wang, Jen-Cheng Liu, Dun-Nian Yaung
  • Patent number: 11341772
    Abstract: A device verification system includes an operation panel, a computer coupled to the operation panel, and a server coupled to the computer. The operation panel includes an image acquisition unit. The computer receives an image of an operator acquired by the image acquisition unit and acquires a facial image of the operator from the image. The server receives the facial image from the computer. The server stores a facial image of an authorized operator and is configured to compare the received facial image to the stored facial image to determine whether the operator is verified.
    Type: Grant
    Filed: October 15, 2019
    Date of Patent: May 24, 2022
    Assignee: Fulian Precision Electronics (Tianjin) Co., LTD.
    Inventors: Cheng-Yu Wang, Shih Chun Wang, Yu-Wen Chen
  • Publication number: 20220151948
    Abstract: The present invention relates to prevention and/or treatment of diseases or disorders associated with a damaged or leaky vasculature in a subject. The present invention provides for methods, combinations and pharmaceutical compositions for preventing and/or treating a disease or disorder associated with a damaged or leaky vasculature in a subject, using, inter alia, an effective amount of a nanoparticle comprising an inner core comprising a non-cellular material, an outer surface comprising a cellular membrane derived from a platelet; and optionally an agent for preventing, treating, diagnosing, or prognosing the disease or disorder and/or monitoring prevention or treatment of the disease or disorder. Exemplary diseases or disorders include hemorrhage (bleeding), cardiovascular diseases or disorders, diseases or disorders associated with narrowing of a blood vessel, tumors or cancers.
    Type: Application
    Filed: February 1, 2022
    Publication date: May 19, 2022
    Inventors: Liangfang Zhang, Che-Ming Jack Hu, Ronnie H. Fang, Brian T. Luk, Kuei-Chun Wang, Shu Chien
  • Publication number: 20220157864
    Abstract: Some embodiments relate an integrated circuit (IC) including a first substrate including a plurality of imaging devices. A second substrate is disposed under the first substrate and includes a plurality of logic devices. A first interconnect structure is disposed between the first substrate and the second substrate and electrically couples imaging devices within the first substrate to one another. A second interconnect structure is disposed between the first interconnect structure and the second substrate, and electrically couples logic devices within the second substrate to one another. A bond pad structure is coupled to a metal layer of the second interconnect structure and extends along inner sidewalls of both the first interconnect structure and the second interconnect structure. An oxide layer extends from above the first substrate to below a plurality of metal layers of the first interconnect structure, and lines inner sidewalls of the bond pad structure.
    Type: Application
    Filed: February 1, 2022
    Publication date: May 19, 2022
    Inventors: Sin-Yao Huang, Ching-Chun Wang, Dun-Nian Yaung, Feng-Chi Hung, Ming-Tsong Wang, Shih Pei Chou
  • Patent number: 11335248
    Abstract: A display device includes a pixel driving circuit including a data writing unit, a light emitting unit and a compensation unit. The data writing unit includes first and second capacitors. A first terminal of the first capacitor is coupled to a first node, and a second terminal of the first capacitor is coupled to a second node. A first terminal of the second capacitor is coupled to the first node. The light emitting unit includes a first switch and a light emitting element. A control terminal of the first switch is coupled to the second node, and a first terminal of the first switch is coupled to a second terminal of the second capacitor. The compensation unit includes a second switch. The second switch is coupled to the second node and a second terminal of the first switch.
    Type: Grant
    Filed: March 17, 2021
    Date of Patent: May 17, 2022
    Assignee: AU OPTRONICS CORPORATION
    Inventors: Shu-Hao Huang, Hsien-Chun Wang, Sung-Yu Su
  • Publication number: 20220145458
    Abstract: Embodiments of the present disclosure provide a reaction gas supply system and a control method. The reaction gas supply system includes a plurality of precursor containers and a plurality of supply regulator devices. The precursor container is connected to at least one of the reaction chambers. The plurality of precursor containers include at least a pair of precursor containers of an arbitrary combination. A supply regulator device is arranged between each pair of precursor containers. The supply regulator device is configured to connect the corresponding pair of precursor containers. With the reaction gas supply system and the control method of the present disclosure, the reaction gas may be ensured to be supplied stably, the utilization rate of the precursor may be increased, and the production efficiency and the product quality may be increased.
    Type: Application
    Filed: March 31, 2020
    Publication date: May 12, 2022
    Inventors: Chun WANG, Bo ZHENG, Zhenguo MA, Jing WANG, Xin WU, Xiaojuan WANG, Jing SHI
  • Publication number: 20220150416
    Abstract: A transferring preview stream method provides services to share a preview stream from one client selecting a function of taking photos or videos to another client selecting a function of preview. Clients engaging in a communication session and executing a camera function are configured to periodically receive current location information provided by their location-aware components and form a list of a new group by determining a proximity of distance based on the current location information. The method is intended to set up transmission sessions between clients in the list for transferring preview streams from clients selecting the function of taking photos or videos to another clients selecting the function of preview. The clients selecting the function of preview can adjust the camera parameters of the other clients selecting the function of taking photos or videos in order to get good quality of photos or videos.
    Type: Application
    Filed: November 7, 2020
    Publication date: May 12, 2022
    Inventor: Ping-Chun Wang
  • Publication number: 20220150796
    Abstract: An access point (AP) includes a transmitter (TX) circuit, a receiver (RX) circuit, and a control circuit. The control circuit negotiates with at least one another AP via the TX circuit and the RX circuit, for setting up a coordinated service period (SP). In addition, a method for setting up the coordinated SP in a multiple AP environment includes: sending a request frame from a first AP to at least one second AP, wherein the request frame includes a plurality of SP parameters; receiving a response frame generated from the at least one second AP in response to the request frame; and in response to the response frame, setting up the coordinated SP by sending a setup frame to the at least one another AP, wherein the setup frame is set by updating at least a portion of the plurality of SP parameters.
    Type: Application
    Filed: November 10, 2021
    Publication date: May 12, 2022
    Applicant: MEDIATEK INC.
    Inventors: Chien-Fang Hsu, Chao-Chun Wang, James Chih-Shi Yee
  • Patent number: 11329160
    Abstract: A semiconductor device includes a semiconductor fin, a lining oxide layer, a silicon nitride based layer and a gate oxide layer. The semiconductor fin has a top fin surface, an upper fin side surface portion adjacent to the top fin surface, and a lower fin side surface contiguously connected to the upper fin side surface portion. The lining oxide layer peripherally encloses the lower fin side surface portion of the semiconductor fin. The silicon nitride based layer is disposed conformally over the lining oxide layer. The gate oxide layer is disposed conformally over the top fin surface and the upper fin side surface portion.
    Type: Grant
    Filed: February 16, 2017
    Date of Patent: May 10, 2022
    Assignee: TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.
    Inventors: Cheng-Ta Wu, Shiu-Ko Jangjian, Chung-Ren Sun, Ming-Te Chen, Ting-Chun Wang, Jun-Jie Cheng
  • Patent number: 11329965
    Abstract: A method for dynamic encryption and signing includes: obtaining, by a terminal during session connection, a predetermined first key index and a randomly-generated first signature index; signing session request data with a first signature corresponding to the first signature index; encrypting the session request data with a first key corresponding to the first key index; sending the encrypted session request data and the first signature index to the server; and receiving, from the server, session response data signed with a second signature corresponding to a second signature index and encrypted with a second key corresponding to a second key index, after decryption and signature verification by the server over the session request data succeed. The second signature index and the second key index are randomly selected by the server and saved in a login session object accessible by both the server and the terminal.
    Type: Grant
    Filed: June 25, 2020
    Date of Patent: May 10, 2022
    Assignee: TENCENT TECHNOLOGY (SHENZHEN) COMPANY LIMITED
    Inventors: Yixin Guo, Hang Yu, Chun Wang, Xianhua Du
  • Publication number: 20220134947
    Abstract: A vehicle interior component comprising a cover with a surface providing a display region is disclosed. The component may comprise a composite layer/structure and light source to provide light at a first and a second visible color/wavelength. The composite layer may comprise light-transmissive segments with color and light-transmissive transparent/translucent segments; light at the first wavelength is transmitted through a first segment and transparent/translucent segment to present a first image/visual effect at the display region; light at the second wavelength is transmitted through a second segment and transparent/translucent segment to present a second image/visual effect at the display region; light at the first wavelength is obstructed by the second segment; light at the second wavelength is obstructed by the first segment; transparent/translucent segments transmit light at first and second wavelengths. The composite layer may comprise a multi-layer form on the cover.
    Type: Application
    Filed: January 14, 2022
    Publication date: May 5, 2022
    Inventor: Chun WANG
  • Patent number: 11322540
    Abstract: The present disclosure relates to an integrated circuit. The integrated circuit includes a plurality of interconnects within a dielectric structure over a substrate. A passivation structure is arranged over the dielectric structure. The passivation structure has sidewalls connected to one or more upper surfaces of the passivation structure. A bond pad is arranged directly between the sidewalls of the passivation structure. An upper passivation layer is disposed over the passivation structure and the bond pad. The upper passivation layer extends from over an upper surface of the bond pad to within a recess in the upper surface of the bond pad.
    Type: Grant
    Filed: October 14, 2020
    Date of Patent: May 3, 2022
    Assignee: Taiwan Semiconductor Manufacturing Company, Ltd.
    Inventors: Kai-Chun Hsu, Ching-Chun Wang, Dun-Nian Yaung, Jeng-Shyan Lin, Shyh-Fann Ting
  • Patent number: 11322481
    Abstract: A three-dimensional (3D) integrated circuit (IC) is provided. In some embodiments, a second IC die is bonded to a first IC die by a first bonding structure. A third IC die is bonded to the second IC die by a second bonding structure. The second bonding structure is arranged between back sides of the second IC die and the third IC die opposite to corresponding interconnect structures and comprises a first TSV (through substrate via) disposed through a second substrate of the second IC die and a second TSV disposed through a third substrate of the third IC die. The second bonding structure further comprises conductive features with oppositely titled sidewalls disposed between the first TSV and the second TSV.
    Type: Grant
    Filed: June 16, 2020
    Date of Patent: May 3, 2022
    Assignee: Taiwan Semiconductor Manufacturing Company, Ltd.
    Inventors: Kuo-Ming Wu, Ching-Chun Wang, Dun-Nian Yaung, Hsing-Chih Lin, Jen-Cheng Liu, Min-Feng Kao, Yung-Lung Lin, Shih-Han Huang, I-Nan Chen
  • Patent number: 11319602
    Abstract: A probe combination for detecting cancer includes one or more sets of partial hepatitis B virus (HBV) targeting probes. When sequences of each of the sets of partial HBV targeting probes are aligned, an overall sequence of the aligned set of probes matches a reference sequence of a genome of a HBV genotype or a direct repeat (DR) region on the genome. In the aligned set of probes, each of the probes overlap with one or two adjacent probes by a portion of a length of the probe. The probe combination may further includes one or more sets of hotspot gene targeting probes targeting cancer hotspot genes such as CTNNB1, TERT, and TP53 genes, one or more sets of exogenous gene targeting probes targeting portions of a lambda phage genome, and endogenous gene targeting probes targeting endogenous genes such as GAPDH and GdX genes.
    Type: Grant
    Filed: January 31, 2018
    Date of Patent: May 3, 2022
    Assignee: TCM BIOTECH INTERNATIONL CORP.
    Inventors: You-Yu Lin, Ya-Chun Wang, Sheng-Tai Tzeng
  • Publication number: 20220128083
    Abstract: The disclosed embodiments relate to a screw nut and an electronic device having the same. The screw nut is configured for fixation of a fastener. The screw nut includes an inner nut component, a cushioning component, and an outer nut component. The inner nut component has a screw hole portion configured for fixation of the fastener. The cushioning component is sleeved on the inner nut component. The outer nut component is sleeved on the cushioning component. The cushioning component is connected between the inner nut component and the outer nut component so that the inner nut component is movably connected to the outer nut component.
    Type: Application
    Filed: December 15, 2020
    Publication date: April 28, 2022
    Inventors: HSIN-CHUAN HSU, Ming Chun Wang
  • Patent number: 11310736
    Abstract: Embodiments of the present invention provide a method and apparatus for providing wideband channel access to wireless devices, such as 20 MHz only wireless stations. A Target Wakeup Time (TWT) Channel field contains a bitmap indicating a temporary primary channel for using during a TWT Service Period (SP). The temporary primary channel is determined through a negotiation between a requesting STA and a responding STA, and the responding STA assigns resource units (RUs) to the requesting STA according to the temporary primary channel. After the TWT SP, the requesting STA switches back to a primary channel.
    Type: Grant
    Filed: December 3, 2018
    Date of Patent: April 19, 2022
    Assignee: MEDIATEK SINGAPORE PTE. LTD.
    Inventors: Yongho Seok, Chao-Chun Wang, James Chih-Shi Yee