Abstract: A mounting apparatus for an expansion card includes a shaft fixed to the expansion card, and a rotary member rotatably mounted to the shaft. The rotary member includes a cam, an operation portion opposite to the cam, and a latching portion formed between the cam and the operation portion. When fitting the expansion card to an expansion socket, the operation portion is operated to rotate the rotary member about the shaft, and the latching portion is latched to the expansion socket. When disassembling the expansion card from the expansion socket, the cam is levered against a top of the expansion socket to lift out the expansion card, thereby disassembling the expansion card from the expansion socket.

Abstract: A semiconductor package includes a die pad; a semiconductor die mounted on the die pad; a plurality of leads disposed along peripheral edges of the die pad; a ground bar between the leads and the die pad; and a plurality of bridges connecting the ground bar with the die pad, wherein a gap between two adjacent bridges has a length that is equal to or less than 3 mm.

Abstract: The present invention provides an imaging and measuring apparatus for the surface and the internal interface of an object, which comprises a broadband wave source, a wave-splitting structure, a wave-delaying device, a reflecting component, and a sensor. The broadband wave source transmits a broadband incident wave. The wave-splitting structure splits the broadband incident wave into a first incident beam, a second incident beam, and a third incident beam. The first incident beam is illuminated on an object under test, which reflects a measuring beam. The wave-delaying device receives the second incident beam and reflects a reference beam. The reflecting component receives the third incident beam and reflects a calibration beam. The sensor receives a first interference signal of the measuring beam and the reference beam, and a second interference signal of the reference beam and the calibration beam.

Abstract: An electronic device includes a chassis, a cover on the chassis, a fixing member fixed on the cover and a handling member. A pair of latches are arranged on the chassis and each define a latching hole. The fixing member includes a substrate and a pair of side plates each defining a locking groove. A pair of catches extend upwards from the substrate and each define a locking groove. Cooperatively the locking groove and the latching groove forms a closed groove. The handling member includes a pivot received in the closed groove, and a pair of shafts in the guiding grooves. Firstly, the handling member rotates around the shafts to cause the pivot to engage with the latch, and then rotates into the aperture around the pivot to cause the shafts to move upwards to make the cover moving relative to the chassis to lock with the chassis.

Abstract: A bracket for mounting a data storage device thereon includes a holding frame and an operating structure. The holding frame includes a substrate and first and second sidewalls extending from two opposite sides of the substrate. A receiving space is defined in the holding frame for receiving the data storage device therein. The operating structure is mounted to the first sidewall and includes an active member and a passive member connected with the active member. The active member defines a receiving groove for receiving one side of the data storage device therein. The passive member defines a sliding groove for receiving one end of the active member therein. The active member is slideable in the sliding groove of the passive member. The passive member is slideable along the first sidewall.

Abstract: A retention assembly for securing an expansion card includes a support plate, a retention seat mounted on the supporting plate, and a holder located on the retention seat. The support plate defines a through hole therein. The retention seat defines a sliding groove therethrough aligning with the through hole of the support plate. The holder includes a clamping portion at one end thereof. The holder extends through the sliding groove of the retention seat and the through hole of the supporting plate. The clamping portion extends beyond the supporting plate for clamping the expansion card.

Abstract: A semiconductor chip package includes a chip; first and second connection pads arranged in a matrix and disposed about the chip, and the first and second connection pads have different bottom surface shapes when viewed from a bottom of the QFN package; bonding pads provided on an active surface of the chip and being electrically connected with corresponding said connection pads through bonding wires; and a package body encapsulating the chip, the bonding wires and an upper portion of each of the connection pads such that a lower portion of each of the connection pads extends outward from a bottom of the package body.

Abstract: Indole compounds of the formula: wherein L1, L2, R1, R2, Ra, Rb, Rc, Rd, and Re are defined herein. Also disclosed are methods of using of the indole compounds in inhibiting tubulin polymerization and treating cancer and other angiogenesis-related disorders.

Abstract: To protect device keys, an optical media recording device capable of performing AACS encryption on data does not have any device keys, and the optical media recording device performs AACS encryption by activating recording software stored in a memory the optical media recording device, and utilizing a pre-calculated media key stored in the memory of the optical media recording device to perform AACS encryption on the data.

Abstract: An electronic device with enhanced heat spread. A printed circuit board is disposed in a casing and includes a first metal ground layer, a second metal ground layer, and a metal connecting portion. The first metal ground layer is opposite the second metal ground layer. The metal connecting portion is connected between the first and second metal ground layers. The second metal ground layer is connected to the casing. A chip is electrically connected to the printed circuit board and includes a die and a heat-conducting portion connected to the die and soldered with the first metal ground layer. Heat generated by the chip is conducted to the casing through the heat-conducting portion, first metal ground layer, metal connecting portion, and second metal ground layer.

Abstract: This invention relates to methods of inhibiting tubulin polymerization and treating cancer and other angiogenesis-related disorders with indole compounds of the formula: wherein L1, L2, R1, R2, Ra, Rb, Rc, Rd, and Re are defined herein.

Abstract: An electronic device with enhanced heat spread. A printed circuit board is disposed in a casing and includes a first metal ground layer, a second metal ground layer, and a metal connecting portion. The first metal ground layer is opposite the second metal ground layer. The metal connecting portion is connected between the first and second metal ground layers. The second metal ground layer is connected to the casing. A chip is electrically connected to the printed circuit board and includes a die and a heat-conducting portion connected to the die and soldered with the first metal ground layer. Heat generated by the chip is conducted to the casing through the heat-conducting portion, first metal ground layer, metal connecting portion, and second metal ground layer.

Abstract: Indole compounds of the formula: wherein L1, L2, R1, R2, Ra, Rb, Rc, Rd, and Re are defined herein. Also disclosed are methods of using of the indole compounds in inhibiting tubulin polymerization and treating cancer and other angiogenesis-related disorders.

Abstract: This invention relates to methods of inhibiting tubulin polymerization and treating cancer and other angiogenesis-related disorders with indole compounds of the formula: wherein L1, L2, R1, R2, Ra, Rb, Rc, Rd, and Re are defined herein.

Abstract: Indole compounds of the formula: wherein L1 is CO; L2 is a bond; R1 is aryl or heteroaryl; R2 is H, aryl, heteroaryl, halogen, nitro, nitroso, cyano, azide, isothionitro, OR, OC(O)R, OC(O)OR, OC(O)NRR?, SO2R, SO3R, SO2NRR?, SR, NRR?, NRSO2NR?R?, NRSO2R?, NRSO3R?, NRC(O)R?, NRC(O)NR?R?, NRC(O)OR?, NRC(N)NR?R?, C(O)OR, or C(O)NRR?; each of Ra, Rb, Rc, and Rd, independently, is R, halogen, nitro, nitroso, cyano, azide, isothionitro, OR, OC(O)R, OC(O)OR, OC(O)NRR?, SO2R, SO3R, SO2NRR?, SR, NRR?, NRSO2NR?R?, NRSO2R?, NRSO3R?, NRC(O)R?, NRC(O)NR?R?, NRC(O)OR?, NRC(N)NR?R?, C(O)R, C(O)OR, C(O)NRR?, or Rb and Rc, Ra and Rb, or Rc and Rd taken together are O(CH2)nO; and Rc is H, alkyl, alkenyl, alkynyl, cyclyl, heterocyclyl, halogen, nitro, nitroso, cyano, azide, isothionitro, OR, OC(O)R, OC(O)OR, OC(O)NRR?, SO2R, SO3R, SO2NRR?, SR, NRR?, NRSO2NR?R?, NRSO2R?, NRSO3R?, NRC(O)R?, NRC(O)NR?R?, NRC(O)OR?, NRC(N)NR?R?, C(O)R, C(O)OR, or C(O)NRR?; in which each of R, R?, and R?, independently, is H, alkyl, alkenyl, alky

Abstract: Indole compounds of the formula: 1