Patents by Inventor Chun Wei

Chun Wei has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 11830806
    Abstract: A semiconductor structure and method of manufacturing a semiconductor structure are provided. The semiconductor structure includes a package structure. The package structure includes a passivation layer formed over an interconnect structure; an electrically-conductive structure formed on the passivation layer and extending through the passivation layer to electrically contact the interconnect structure; a dielectric structure formed over the passivation layer and surrounding the electrically-conductive structure to expose at least a portion of a top surface of the electrically-conductive structure; and a metallic protection structure formed on the top surface of the electrically-conductive structure exposed from the dielectric structure. The top surface of the metallic protection structure is aligned with or lower than a top surface of the dielectric structure.
    Type: Grant
    Filed: April 29, 2021
    Date of Patent: November 28, 2023
    Assignee: TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY LTD.
    Inventors: Chun-Wei Chang, Hsuan-Ming Huang, Jian-Hong Lin, Ming-Hong Hsieh, Mingni Chang, Ming-Yih Wang
  • Publication number: 20230372640
    Abstract: A nebulizer (1) includes a host (10) and a nozzle tube (20). The host includes a main body (11), a control module (12) and a sensor (13). The nozzle tube (20) includes a tube (21), a nozzle (22) and a detecting structure (23). The tube (21) includes a chamber (210). The nozzle (22) is arranged on one side of the tube (21) and communicates with the chamber (210). The detecting structure (23) includes a shutter (231) and a swinging member (232) connected with the shutter (231). The shutter (231) is disposed corresponding to the position of the sensor (13). The air blown from the nozzle (22) flows into the tube (21) and blows the swinging member (232) to drive the shutter (231) to activate the sensor (13).
    Type: Application
    Filed: May 20, 2022
    Publication date: November 23, 2023
    Inventors: Po-Chang CHEN, Hsin-Chen WANG, Chia-Chin YANG, Hao-Hsiang CHEN, Chun-Wei HSU
  • Patent number: 11825297
    Abstract: A method and apparatus are disclosed. In an example from the perspective of a first User Equipment (UE), the first UE generates a message requesting inter-UE coordination information, wherein the message includes information associated with a first priority value. The first UE generates a Medium Access Control (MAC) Protocol Data Unit (PDU) including the message. The first UE sets a value of a priority field in a first sidelink control information (SCI) based on a second priority value of the message, wherein the second priority value of the message is a configured value and/or a lowest priority value among a defined set of priority values. The first UE transmits the first SCI to one or more UEs including a second UE, wherein the first SCI schedules a first Physical Sidelink Shared Channel (PSSCH) transmission for transmitting the MAC PDU.
    Type: Grant
    Filed: December 27, 2022
    Date of Patent: November 21, 2023
    Assignee: ASUSTek Computer Inc.
    Inventors: Ming-Che Li, Chun-Wei Huang, Yi-Hsuan Kung
  • Publication number: 20230365903
    Abstract: A semiconductor cleaning solution for cleaning a surface of a semiconductor device, and a method of use and a method of manufacture of the cleaning solution are disclosed. In an embodiment, a material is polished away from a first surface of the semiconductor device and the first surface is cleaned with the cleaning solution. The cleaning solution may include a host having at least one ring. The host may have a hydrophilic exterior and a hydrophobic interior.
    Type: Application
    Filed: July 26, 2023
    Publication date: November 16, 2023
    Inventors: Pinlei Edmund Chu, Chun-Wei Hsu, Ling-Fu Nieh, Chi-Jen Liu, Liang-Guang Chen, Yi-Sheng Lin
  • Publication number: 20230369449
    Abstract: The transistor includes a first III-V compound layer. A second III-V compound layer is disposed on the first III-V compound layer and is different from the first III-V compound layer in composition. A carrier channel is located between the first III-V compound layer and the second III-V compound layer. A source feature and a drain feature are disposed on the second III-V compound layer.
    Type: Application
    Filed: July 27, 2023
    Publication date: November 16, 2023
    Inventors: Chun-Wei Hsu, Jiun-Lei Jerry Yu, Fu-Wei Yao, Chen-Ju Yu, Fu-Chih Yang, Chun Lin Tsai
  • Publication number: 20230369460
    Abstract: Provided are a semiconductor structure and a manufacturing method thereof. The manufacturing method of the semiconductor structure includes the following. A gate structure is formed on a substrate. A tilt implanting process is performed to implant group IV elements into the substrate to form a doped region, and the doped region is located on two sides of the gate structure and partially located under the gate structure. A part of the substrate on two sides of the gate structure is removed to form a first recess. A cleaning process is performed on the surface of the first recess. A wet etching process is performed on the first recess to form a second recess. A semiconductor layer is formed in the second recess.
    Type: Application
    Filed: June 9, 2022
    Publication date: November 16, 2023
    Applicant: United Microelectronics Corp.
    Inventors: Kuang-Hsiu Chen, Wei-Chung Sun, Chao Nan Chen, Chun-Wei Yu, Kuan Hsuan Ku, Shao-Wei Wang
  • Publication number: 20230360848
    Abstract: An EMI filter system includes a circuit board and a choke. The circuit board includes at least three capacitors. The choke mounts on the circuit board and includes a non-circular magnetic core and at least three windings. The at least three windings are wound on the non-circular magnetic core. The at least three capacitors are disposed adjacent to the choke, and first outlet ends of the at least three windings are respectively connected to the corresponding at least three capacitors.
    Type: Application
    Filed: February 16, 2023
    Publication date: November 9, 2023
    Inventors: Chun-Wei Wu, Chia-Hao Yeh, Hung-Chuan Lin
  • Publication number: 20230362488
    Abstract: A clamping device, an electronic device, and a remote control method of the electronic device. The clamping device includes a clamping unit, a first communication unit, and a control unit. The clamping unit is suitable for clamping the electronic device. The first communication unit is suitable for pairing with a second communication unit of the electronic device. The control unit is coupled to the clamping unit and the first communication unit. When the clamping unit is switched from an off mode to an on mode, the control unit controls the first communication unit to pair with the second communication unit and sends a screen-off command to the second communication unit via the first communication unit after the pairing is completed. When the clamping unit is in a clamping mode, the control unit sends an application open command to the second communication unit via the first communication unit.
    Type: Application
    Filed: October 20, 2022
    Publication date: November 9, 2023
    Applicant: ASUSTeK COMPUTER INC.
    Inventors: Yea-Chin Yeh, Chi-Hwa Ho, Yi-Teng Tsai, Chun-Wei Lu
  • Patent number: 11806168
    Abstract: A physiological detection system including a light source module, a photo sensor and a processor is provided. The light source module is configured to provide light to illuminate a skin region. The photo sensor is configured to detect emergent light passing the skin region with at least one signal source parameter and output an image signal. The processor is configured to calculate a confident level according to the image signal to accordingly adjust the at least one signal source parameter.
    Type: Grant
    Filed: January 23, 2019
    Date of Patent: November 7, 2023
    Assignee: PIXART IMAGING INC.
    Inventors: Sheau-Foong Chong, Chun-Wei Chen
  • Publication number: 20230354215
    Abstract: A method and apparatus are disclosed. In an example, a User Equipment (UE) triggers a first Power Headroom Report (PHR). The UE receives one or more uplink grants indicative of a first Physical Uplink Shared Channel (PUSCH) and a second PUSCH on a second serving cell, wherein the first PUSCH at least partially overlaps with the second PUSCH in time domain. The UE selects the first PUSCH, from among the first PUSCH and the second PUSCH, based on one or more first characteristics of the first PUSCH and/or one or more second characteristics of the second PUSCH. The UE determines the first PHR for the second serving cell based on the first PUSCH. The UE transmits a PHR Medium Access Control (MAC) Control Element (CE), include the first PHR, to a network node that configured the UE to report one PHR for one serving cell.
    Type: Application
    Filed: April 25, 2023
    Publication date: November 2, 2023
    Inventor: Chun-Wei Huang
  • Publication number: 20230353900
    Abstract: An image sensor includes a photosensitive sensor, a floating diffusion node, a reset transistor, and a source follower transistor. The reset transistor comprises a first source/drain coupled to the floating diffusion node and a second source/drain coupled to a first voltage source. The source follower transistor comprises a gate coupled to the floating diffusion node and a first source/drain coupled to the second source/drain of the reset transistor. A first elongated contact contacts the second source/drain of the reset transistor and the first source/drain of the source follower transistor. The first elongated contact has a first dimension in a horizontal cross-section and a second dimension in the horizontal cross-section. The second dimension is perpendicular to the first dimension, and the second dimension is less than the first dimension.
    Type: Application
    Filed: July 3, 2023
    Publication date: November 2, 2023
    Inventors: Yun-Wei CHENG, Chia CHUN-WEI, Chun-Hao CHOU, Kuo-Cheng LEE
  • Publication number: 20230352587
    Abstract: A semiconductor device and a method of forming the same, the semiconductor device includes a substrate, a gate structure and an epitaxial structure. The gate structure is disposed on the substrate, and the epitaxial structure is disposed in the substrate, at one side of the gate structure. The epitaxial structure includes a portion being protruded from a top surface of the substrate, and the portion includes a discontinuous sidewall, with a distance between a turning point of the discontinuous sidewalls and the gate structure being a greatest distance between the epitaxial structure and the gate structure.
    Type: Application
    Filed: July 4, 2023
    Publication date: November 2, 2023
    Applicant: UNITED MICROELECTRONICS CORP.
    Inventors: Kuang-Hsiu Chen, Sung-Yuan Tsai, Chi-Hsuan Tang, Chun-Wei Yu, Yu-Ren Wang
  • Publication number: 20230351633
    Abstract: There is provided a vehicle system including a sensing unit, a processing unit, a control unit and a display unit. The sensing unit is configured to capture an image frame containing an eyeball image from a predetermined distance. The processing unit is configured to calculate a pupil position of the eyeball image in the image frame and generate a drive signal corresponding to the pupil position. The control unit is configured to trigger a vehicle device associated with the pupil position according to the drive signal. The display unit is configured to show information of the vehicle device.
    Type: Application
    Filed: July 7, 2023
    Publication date: November 2, 2023
    Inventors: CHUN-WEI CHEN, SHIH-WEI KUO
  • Publication number: 20230354373
    Abstract: Methods, systems, and apparatuses are provided for configuring sidelink (SL) configured grant configuration in SL carrier aggregation. A method for a first device in a wireless communication system can comprise receiving a first sidelink configured grant configuration, wherein the first sidelink configured grant configuration indicates and/or includes a first frequency information and one or more first SL resources, and performing one or more first SL transmissions via the one or more first SL resources on a first SL frequency indicated by the first frequency information.
    Type: Application
    Filed: April 26, 2023
    Publication date: November 2, 2023
    Inventors: Yi-Hsuan Kung, Chun-Wei Huang, Ming-Che Li, Li-Chih Tseng
  • Publication number: 20230354302
    Abstract: A method and apparatus are disclosed. In an example from the perspective of a first device configured with a plurality of carriers/cells for sidelink communication, the first device determines a first sidelink message for transmission to a first destination associated with a first set of carriers/cells of the plurality of carriers/cells. The first device triggers, based on the first sidelink message, a first scheduling request to a network node. The first device transmits a first signaling of the first scheduling request to the network node. The first signaling includes first information associated with the first destination and/or second information associated with the first set of carriers/cells.
    Type: Application
    Filed: April 14, 2023
    Publication date: November 2, 2023
    Inventors: Ming-Che Li, Li-Chih Tseng, Yi-Hsuan Kung, Chun-Wei Huang
  • Patent number: 11804538
    Abstract: A method of forming a high electron mobility transistor (HEMT) includes a first III-V compound layer and a second III-V compound layer disposed on the first III-V compound layer and is different from the first III-V compound layer in composition. A source feature and a drain feature are disposed on the second III-V compound layer. A p-type layer is disposed on a portion of the second III-V compound layer between the source feature and the drain feature. A gate electrode is disposed on the p-type layer. A capping layer is disposed on the second III-V compound layer.
    Type: Grant
    Filed: May 26, 2021
    Date of Patent: October 31, 2023
    Assignee: TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.
    Inventors: Chun-Wei Hsu, Jiun-Lei Jerry Yu, Fu-Wei Yao, Chen-Ju Yu, Fu-Chih Yang, Chun Lin Tsai
  • Publication number: 20230345559
    Abstract: A method and apparatus are disclosed from the perspective of a first device to perform sidelink communication. In one embodiment, the method includes the first device performing sidelink resource selection or reselection procedure for a sidelink transmission to a second device, wherein the sidelink resource selection or reselection procedure is performed to select at least one sidelink resource from candidate sidelink resources within a time duration of selection window. The method further includes the first device selecting a first sidelink resource based on sidelink active time or wake-up time of the second device, wherein the first sidelink resource is within the time duration of selection window. The method also includes the first device performing the sidelink transmission on the first sidelink resource to the second device.
    Type: Application
    Filed: June 27, 2023
    Publication date: October 26, 2023
    Inventors: MING-CHE LI, Li-Chih Tseng, Yi-Hsuan Kung, Chun-Wei Huang, Li-Te Pan
  • Publication number: 20230344563
    Abstract: In an example, a first User Equipment (UE) receives a sidelink transmission, associated with enabled sidelink Hybrid Automatic Repeat Request (HARQ) feedback, from a second UE in a first timing. The first UE attempts to access a channel for transmission of a sidelink HARQ feedback in a first feedback resource in a second timing. The sidelink HARQ feedback is in response to the sidelink transmission. The attempt to access the channel for the transmission of the sidelink HARQ feedback in the first feedback resource fails. The first UE performs channel access for a second feedback resource. The second feedback resource is within a window and/or within a predefined duration of the first timing or the second timing. In response to successfully performing the channel access, the first UE performs, in the second feedback resource, a sidelink feedback transmission of the sidelink HARQ feedback to the second UE.
    Type: Application
    Filed: March 10, 2023
    Publication date: October 26, 2023
    Inventors: Chun-Wei Huang, Ming-Che Li
  • Publication number: 20230345622
    Abstract: A package component and forming method thereof are provided. The package component includes a substrate and a conductive layer. The substrate includes a first surface. The conductive layer is disposed over the first surface. The conductive layer includes a first conductive feature and a second conductive feature. The second conductive feature covers a portion of the first conductive feature. A resistance of the second conductive feature is lower than a resistance of the first conductive feature.
    Type: Application
    Filed: April 25, 2022
    Publication date: October 26, 2023
    Inventors: CHUN-WEI CHANG, JIAN-HONG LIN, SHU-YUAN KU, WEI-CHENG LIU, YINLUNG LU, JUN HE
  • Patent number: 11798800
    Abstract: A solvent recycle system minimizes chemical consumption used in various semiconductor processes. The solvent is recycled from a nozzle bath via the addition of buffer tank to connect the bath and circulation pumps. Improvements to the bath design further maintain solvent cleanness by preventing intrusion of particles and overflow conditions in the bath.
    Type: Grant
    Filed: June 25, 2021
    Date of Patent: October 24, 2023
    Assignee: TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.
    Inventors: Chun-Wei Liao, Tung-Hung Feng, Hui-Chun Lee, Shih-Che Wang