Abstract: A process of assigning a colour grade to a diamond, including the steps of (i) determining the N3 and C-center content of a diamond (110); (ii) comparing the N3 and C-center content of the diamond with a previously acquired data set from a plurality of diamonds each having a colour grading previously assigned thereto, and (iii) assigning a colour grade to the diamond upon a correlation of the N3 and C-center content of said diamond with a grade of said previously acquired data set; wherein said previously acquired data set comprises a correlation between N3 and C center content and optical absorbance in the visible light spectrum for each diamond of said plurality of diamonds.

Abstract: A cross-shape transfer blade is configured to, in operation, be mounted or coupled to an end of a transfer robot arm (TRA). The cross-shape robot or transfer blade includes a plurality of raised regions to contact a backside of a workpiece or thin workpiece such that the cross-shape transfer blade supports and transports the respective workpeice between various locations within a semiconductor manufacturing plant (FAB). The cross-shape transfer blade includes a first prong structure, a second prong structure, a first wing structure, and a second wing structure. Respective ones of the plurality of raised regions are at corresponding ones of the first prong structure, the second prong structure, the first wing structure, and the second wing structure minimizing contact between the backside of the workpiece or thin workpiece and the cross-shape transfer blade when the workpiece or thin workpiece is being transferred, transported, and supported by the cross-shape transfer blade.

Abstract: A system and method for chemical mechanical polishing (“CMP”) pad replacement on a CMP processing tool. A platen carrier having two or more platens is positioned within a platen cleaning process module. Each platen includes a CMP pad affixed thereto, and is capable of being independently rotated during operations. When a pad requires replacement, the platen carrier rotates towards a pad tearer tool, which extends and pivots to remove the used pad from the platen as the carrier rotates. A pad tape replacement module is positioned above the CMP tool with pad tape extending from a supply roll to a recycle roll. As the pad tape transits through the module, a backing of the tape is separated and recycled. A pad disposed in the pad tape is then applied to a platen via a pressure roller.

Abstract: A fitting for an upper brush in a double brush scrubbing chamber of a wafer cleaning system is disclosed. The fitting includes a base plate, a flanged pipe, and a threaded connector. The base plate includes a threaded hole with a stop surface therein and a channel extending from the stop surface through a lower surface of the base plate. The flanged pipe is inserted into the base plate such that the flange at the top end of a hollow tube rests on the stop surface and the hollow tube passes through the channel of the base plate. The threaded connector has a passage therethrough, and engages the threaded hole of the base plate to fix the flanged pipe in place. This structure is able to provide fluid while minimizing particle generation.

Abstract: A fitting for an upper brush in a double brush scrubbing chamber of a wafer cleaning system is disclosed. The fitting includes a base plate, a flanged pipe, and a threaded connector. The base plate includes a threaded hole with a stop surface therein and a channel extending from the stop surface through a lower surface of the base plate. The flanged pipe is inserted into the base plate such that the flange at the top end of a hollow tube rests on the stop surface and the hollow tube passes through the channel of the base plate. The threaded connector has a passage therethrough, and engages the threaded hole of the base plate to fix the flanged pipe in place. This structure is able to provide fluid while minimizing particle generation.

Abstract: A system and method for chemical mechanical polishing (“CMP”) pad replacement on a CMP processing tool. A platen carrier having two or more platens is positioned within a platen cleaning process module. Each platen includes a CMP pad affixed thereto, and is capable of being independently rotated during operations. When a pad requires replacement, the platen carrier rotates towards a pad tearer tool, which extends and pivots to remove the used pad from the platen as the carrier rotates. A pad tape replacement module is positioned above the CMP tool with pad tape extending from a supply roll to a recycle roll. As the pad tape transits through the module, a backing of the tape is separated and recycled. A pad disposed in the pad tape is then applied to a platen via a pressure roller.

Abstract: This application embodiment relates to the field of neural architecture search technology, particularly to an apparatus and method for collaborative neural network search. The apparatus includes a first node for providing a preset search space and dataset, a second node for generating a variational autoencoder and partitioning the search space; at least two cooperating third nodes, the third node is used to determine the performance of multiple candidate neural architectures, train a performance predictor, and update the embedding position based on the gradient direction provided by the performance trainer, wherein data information is shared between different third nodes.

Abstract: In accordance with an example embodiment of the present invention, a method comprises allocating a control channel resource in a wireless relay transmission frame on a wireless relay link; generating a control signaling based on at least one of a resource allocation scheme, a status of the wireless relay link and a traffic condition of the wireless relay link; mapping the control signaling to the allocated control channel resource via at least one of a time-first mapping, a frequency-first mapping, and a multiplexing mapping; and transmitting the control signaling in the allocated control channel resource on the wireless relay link to at least one associated relay node.

Abstract: A method is provided for fabricating a semiconductor wafer having a device side, a back side opposite the device side and an outer periphery edge. Suitably, the method includes: forming a top conducting layer on the device side of the semiconductor wafer; forming a passivation layer over the top conducting layer, the passivation layer being formed so as not to extend to the outer periphery edge of the semiconductor wafer; and forming a protective layer over the passivation layer, the protective layer being spin coated over the passivation layer so as to have a smooth top surface at least in a region proximate to the outer periphery edge of the semiconductor wafer.

Abstract: Disclosed are a method for managing data and a storage device thereof. The storage device includes at least one memory including a plurality of planes, each plane includes a plurality of blocks, and peer blocks in different planes are belonged to operate in a multi-plane mode. The plurality of blocks are detected to find a unavailable block. Then, available blocks corresponding to the unavailable block in planes other than the plane where the unavailable block is located are marked as backup blocks that do not operate in the multi-plane mode. A first block with effective data is selected from the plurality of blocks operating in the multi-plane mode. Data of the first block is moved to a backup block in the same plane.

Abstract: In accordance with an example embodiment of the present invention, a method comprises allocating a control channel resource in a wireless relay transmission frame on a wireless relay link; generating a control signaling based on at least one of a resource allocation scheme, a status of the wireless relay link and a traffic condition of the wireless relay link; mapping the control signaling to the allocated control channel resource via at least one of a time-first mapping, a frequency-first mapping, and a multiplexing mapping; and transmitting the control signaling in the allocated control channel resource on the wireless relay link to at least one associated relay node.

Abstract: An ion source head includes a curved liner that is configured to more closely and accurately repel, direct, or deflect ion species generated within an ion source cavity of an ion source container of an ion source head towards an ion beam opening that extends through the ion source container of the ion source head. This prevents or reduces the ion species from becoming trapped in the ion source cavity instead of exiting the ion source cavity through the ion beam opening that extends through the ion source container of the ion source head. The curved liner may be received by a curved structure of the ion source container of the ion source head. The ion source head may be utilized within an implanter tool to refine or process a solid target with the ion beam generated by the ion source head with the curved liner.

Abstract: A focus ring for a plasma-based semiconductor processing tool is designed to provide and/or ensure etch rate uniformity across a wafer during a plasma etch process. The focus ring may include an angled inner wall that is angled away from a center of the focus ring to direct a plasma toward the wafer. The angle of the angled inner wall may be greater than approximately 130 degrees relative to the top surface of the wafer and/or may be less than approximately 50 degrees relative to an adjacent lower surface of the focus ring to reduce and/or eliminate areas of overlapping plasma on the wafer (which would otherwise cause non-uniform etch rates). Moreover, an inner diameter may be configured to be in a range of approximately 209 millimeters to 214 millimeters to further reduce and/or eliminate areas of overlapping plasma on the wafer.

Abstract: The invention provides a fat composition comprising from 20% to 50% by weight of palmitic acid (C16:0), from 20% to 45% by weight of oleic acid (C18:1), and from 17% to 40% by weight of linoleic acid (C18:2), said percentages of acid being based on the total weight of C8 to C24 fatty acids; wherein the fat composition has a weight ratio of oleic acid (C18:1) to linoleic acid (C18:2) of from 0.4 to 2.4; wherein the percentage of palmitic acid on the second position of triglyceride (SN-2 of C16:0) is at least 40% based on the total amount of palmitic acid; and wherein the fat composition comprises at most 5.0% by weight of PPP triglycerides and has a weight ratio of OPL triglycerides to OPO triglycerides from 0.80 to 1.60 based on the total glycerides present in the fat composition, wherein O is oleic acid, P is palmitic acid and L is linoleic acid.

Abstract: Devices and methods for controlling wafer uniformity in plasma-based process is disclosed. In one example, a device for plasma-based processes is disclosed. The device includes: a housing defining a process chamber and a gas distribution plate (GDP) arranged in the process chamber. The housing comprises: a gas inlet configured to receive a process gas, and a gas outlet configured to expel processed gas. The GDP is configured to distribute the process gas within the process chamber. The GDP has a plurality of holes evenly distributed thereon. The GDP comprises a first zone and a second zone. The first zone is closer to the gas outlet than the second zone. At least one hole in the first zone is closed.

Abstract: Disclosed are a method for managing data and a storage device thereof. The storage device includes at least one memory including a plurality of planes, each plane includes a plurality of blocks, and peer blocks in different planes are belonged to operate in a multi-plane mode. The plurality of blocks are detected to find a unavailable block. Then, available blocks corresponding to the unavailable block in planes other than the plane where the unavailable block is located are marked as backup blocks that do not operate in the multi-plane mode. A first block with effective data is selected from the plurality of blocks operating in the multi-plane mode. Data of the first block is moved to a backup block in the same plane.

Abstract: Methods for processing a workpiece are provided. Conducting a thermal treatment on a workpiece are provided. The workpiece contains at least one layer of metal. The method can include generating one or more species from a process gas. The process gas can include hydrogen or deuterium. The method can include filtering the one or more species to create a filtered mixture and exposing the workpiece to the filtered mixture. An oxidation process on a workpiece are provided. The method can be conducted at a process temperature of less than 350° C.

Abstract: Implementations of the present disclosure generally relate to the fabrication of integrated circuits. More specifically, implementations disclosed herein relate to apparatus, systems, and methods for reducing substrate outgassing. A substrate is processed in an epitaxial deposition chamber for depositing an arsenic-containing material on a substrate and then transferred to a degassing chamber for reducing arsenic outgassing on the substrate. The degassing chamber includes a gas panel for supplying hydrogen, nitrogen, and oxygen and hydrogen chloride or chlorine gas to the chamber, a substrate support, a pump, and at least one heating mechanism. Residual or fugitive arsenic is removed from the substrate such that the substrate may be removed from the degassing chamber without dispersing arsenic into the ambient environment.

Abstract: A cover plate used in an electronic device includes a glass layer and at least one transparent covering layer. The glass layer has a first surface and a second surface. The transparent covering layer contacts and is disposed on at least one of the first surface and the second surface, and the transparent covering layer is laminated with the glass layer. The cover plate has a Young's modulus of about 10 GPa to about 200 GPa.

Abstract: A thin double-sided vibrating speaker includes a magnet member, a first vibration assembly and a second vibration assembly; the magnet member includes a main magnetic plate, a first magnetic path unit, a second magnetic path unit and side magnetic path units, the first magnetic path unit is disposed on one surface of the main magnetic plate, the second magnetic path unit is disposed on another surface of the main magnetic plate, the side magnetic path units are disposed on the main magnetic plate and correspond to two sides of the first magnetic path unit, the first vibration assembly is disposed on one surface of the magnet member, and the second vibration assembly is disposed on another surface of the magnet member. Accordingly, in addition to achieving the requirement of thinning, the thin double-sided vibrating speaker of the present disclosure also has the effect of vibration reduction and two-way sounding.