Abstract: Devices and methods for controlling wafer uniformity using a gas baffle plate are disclosed. In one example, a device for plasma-based processes is disclosed. The device includes: a housing defining a process chamber and a baffle plate arranged above a wafer in the process chamber. The baffle plate is configured to control plasma distribution on the wafer. The baffle plate has a shape of an annulus that comprises a first annulus sector and a second annulus sector. The first annulus sector has a first inner radius. The second annulus sector has a second inner radius that is different from the first inner radius.

Abstract: An electronic device includes a cover plate, a touch sensing layer, and a display module. The cover plate includes a glass layer and at least one transparent covering layer. The glass layer has a first surface and a second surface. The transparent covering layer is disposed on and in contact with at least one of the first surface or the second surface of the glass layer and is laminated with the glass layer. The touch sensing layer is disposed under the cover plate. The display module is disposed under the touch sensing layer.

Abstract: A touch panel includes a substrate, a first sensing electrode layer, and a second sensing electrode layer. The first sensing electrode layer is disposed on the substrate and includes a plurality of first-axis conductive units separated from each other. The second sensing electrode layer is disposed on the substrate and includes a plurality of second-axis conductive units separated from each other and crossing the first-axis conductive units. Each of the second-axis conductive units includes two first conductive layers and a second conductive layer laminated between the first conductive layers.

Abstract: Apparatus, systems, and methods for conducting an etch removal process on a workpiece are provided. The method can include generating a plasma from a deposition process gas in a plasma chamber using a plasma source to deposit a passivation layer on certain layers of a high aspect ratio structure. The method can include generating a plasma from an etch process gas in a plasma chamber using a plasma source to remove certain layers from the high aspect ratio structure. The method can include removing silicon nitride layers at a faster etch rate than silicon dioxide layers on the high aspect ratio structure.

Abstract: An electronic device includes a cover plate, a touch sensing layer, and a display module. The cover plate includes a glass layer and at least one transparent covering layer. The glass layer has a first surface and a second surface. The transparent covering layer is disposed on and in contact with at least one of the first surface or the second surface of the glass layer and is laminated with the glass layer. The touch sensing layer is disposed under the cover plate. The display module is disposed under the touch sensing layer.

Abstract: A cover plate used in an electronic device includes a glass layer and at least one transparent covering layer. The glass layer has a first surface and a second surface. The transparent covering layer contacts and is disposed on at least one of the first surface and the second surface, and the transparent covering layer is laminated with the glass layer. The cover plate has a Young's modulus of about 10 GPa to about 200 GPa.

Abstract: Apparatus, systems, and methods for conducting a silicon containing material removal process on a workpiece are provided. In one example implementation, the method can include generating species from a process gas in a first chamber using an inductive coupling element. The method can include introducing a fluorine containing gas with the species to create a mixture. The mixture can include exposing a silicon structure of the workpiece to the mixture to remove at least a portion of the silicon structure.

Abstract: Compounds of general formula (I): wherein R1, R2, R3, R4, R5a, R* X1, X2, Z and Y are as defined herein are positive modulators of the calcium-activated chloride channel (CaCC), TMEM16A. The compounds are useful for treating diseases and conditions affected by modulation of TMEM16A, particularly respiratory diseases and conditions.

Abstract: A touch sensing layer includes a first-axis conductive unit, a second-axis conductive unit, and at least one dummy electrode. The first-axis conductive unit substantially extends along a first axial direction. The second-axis conductive unit substantially extends along a second axial direction and includes two conductive electrodes and a conductive bridge. The two conductive electrodes are respectively located at opposite sides of the first-axis conductive unit. The conductive bridge crosses the first-axis conductive unit and is connected to the two conductive electrodes. The dummy electrode includes at least one part located in a gap formed between the first-axis conductive unit and one of the two conductive electrodes.

Abstract: A touch sensing layer includes a first-axis conductive unit, a second-axis conductive unit, and at least one dummy electrode. The first-axis conductive unit substantially extends along a first axial direction. The second-axis conductive unit substantially extends along a second axial direction and includes two conductive electrodes and a conductive bridge. The two conductive electrodes are respectively located at opposite sides of the first-axis conductive unit. The conductive bridge crosses the first-axis conductive unit and is connected to the two conductive electrodes. The dummy electrode includes at least one part located in a gap formed between the first-axis conductive unit and one of the two conductive electrodes.

Abstract: In accordance with an example embodiment of the present invention, a method comprises allocating a control channel resource in a wireless relay transmission frame on a wireless relay link; generating a control signaling based on at least one of a resource allocation scheme, a status of the wireless relay link and a traffic condition of the wireless relay link; mapping the control signaling to the allocated control channel resource via at least one of a time-first mapping, a frequency-first mapping, and a multiplexing mapping; and transmitting the control signaling in the allocated control channel resource on the wireless relay link to at least one associated relay node.

Abstract: Systems and methods for processing a workpiece are provided. In one example, a method includes placing a workpiece on a workpiece support in a processing chamber. The workpiece has at least one material layer and at least one structure thereon. The method includes admitting a process gas into a plasma chamber, generating one or more species from the process gas, and filtering the one or more species to create a filtered mixture. The method further includes providing RF power to a bias electrode to generate a second mixture and exposing the workpiece to the second mixture to etch a least a portion of the material layer and to form a film on at least a portion of the material layer.

Abstract: A touch panel includes a substrate, a first sensing electrode layer, and a second sensing electrode layer. The first sensing electrode layer is disposed on the substrate and includes a plurality of first-axis conductive units separated from each other. The second sensing electrode layer is disposed on the substrate and includes a plurality of second-axis conductive units separated from each other and crossing the first-axis conductive units. Each of the second-axis conductive units includes two first conductive layers and a second conductive layer laminated between the first conductive layers.

Abstract: A lens module includes a printed circuit board; a lens mounted on one side of the printed circuit board, and a shielding cover. The shielding cover comprises a cavity. A part of the printed circuit board and a part of the lens are received in the cavity of the shielding cover. The disclosure also relates to an electronic device using the lens module. The lens module can filter the magnetic interference of the external signal and facilitate heat generated by the lens module dissipate outside.

Abstract: A process of assigning a colour grade to a diamond, including the steps of (i) determining the N3 and C-center content of a diamond (110); (ii) comparing the N3 and C-center content of the diamond with a previously acquired data set from a plurality of diamonds each having a colour grading previously assigned thereto, and (iii) assigning a colour grade to the diamond upon a correlation of the N3 and C-center content of said diamond with a grade of said previously acquired data set; wherein said previously acquired data set comprises a correlation between N3 and C center content and optical absorbance in the visible light spectrum for each diamond of said plurality of diamonds.

Abstract: In accordance with an example embodiment of the present invention, a method comprises allocating a control channel resource in a wireless relay transmission frame on a wireless relay link; generating a control signaling based on at least one of a resource allocation scheme, a status of the wireless relay link and a traffic condition of the wireless relay link; mapping the control signaling to the allocated control channel resource via at least one of a time-first mapping, a frequency-first mapping, and a multiplexing mapping; and transmitting the control signaling in the allocated control channel resource on the wireless relay link to at least one associated relay node.

Abstract: Systems and methods for processing a workpiece are provided. In one example, a method includes placing a workpiece on a workpiece support in a processing chamber. The method includes performing a spacer treatment process to expose the workpiece to species generated from a first process gas in a first plasma to perform a spacer treatment process on a spacer layer on the workpiece. The first plasma can be generated in the processing chamber. After performing the spacer treatment process, the method can include performing a spacer etch process to expose the workpiece to neutral radicals generated from a second process gas in a second plasma to etch at least a portion of the spacer layer on the workpiece. The second plasma can be generated in a plasma chamber that is remote from the processing chamber.

Abstract: Methods for processing a workpiece are provided. conducting a thermal treatment on a workpiece are provided. The workpiece contains at least one layer of metal. The method can include generating one or more species from a process gas. The process gas can include hydrogen or deuterium. The method can include filtering the one or more species to create a filtered mixture and exposing the workpiece to the filtered mixture. an oxidation process on a workpiece are provided. The method can be conducted at a process temperature of less than 350° C.

Abstract: A highly integrated, fully automatic chemiluminescence detection equipment and its operation method are disclosed. The chemiluminescence detection equipment comprises a control module, a first electrical machine, a reagent wheel disc tank, a sampling module, a washing module, a second electrical machine and a detection module. Compared with the traditional large-scale chemiluminescence detection equipment, the chemiluminescence detection equipment of the present invention has the advantage of high integration, and greatly reduces the overall volume and weight of the chemiluminescence detection equipment.

Abstract: In an embodiment, a system includes: a base with a bore hole, wherein the base is configured to secure a wafer at a first position on the base; a pin extending through the bore hole; a focus ring horizontally surrounding the wafer at the first position and extending upwardly from the base, wherein the wafer is configured to be moved vertically between the first position and a second position above the focus ring via the pin; and a slit valve above the focus ring, wherein the wafer is configured to be moved horizontally between the second position and the slit valve via a robotic arm.