Patents by Inventor Chun Yang
Chun Yang has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Patent number: 12289853Abstract: The invention provides a mounting assembly and a server. The mounting assembly includes fixed base, adjustable base, first protrusion and second protrusion. Adjustable base is rotatably disposed on fixed base. When adjustable base is at first mounting position, first protrusion protrudes from adjustable base along protruding direction and is configured for horizontal installation and removal of first expansion card with respect to motherboard. When adjustable base is at second mounting position, second protrusion protrudes from adjustable base along protruding direction and is configured for vertical installation and removal of second expansion card with respect to motherboard. A position at which first protrusion is located when protruding along protruding direction is different from position at which second protrusion is located when protruding along protruding direction.Type: GrantFiled: June 12, 2023Date of Patent: April 29, 2025Assignees: INVENTEC (PUDONG) TECHNOLOGY CORPORATION, INVENTEC CORPORATIONInventor: Chi-Chun Yang
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Patent number: 12283514Abstract: The present disclosure provides a method and a system therefore for processing wafer. The method includes: extracting a first gas from a chamber via a first route; blocking a second route used to be pumped down to chuck a wafer placed in the chamber, wherein the second route connects the chamber and the first route; and providing a second gas via a third route to purge a junction of the first route and the second route.Type: GrantFiled: August 30, 2021Date of Patent: April 22, 2025Assignee: TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY LTD.Inventors: Sheng-Chun Yang, Chih-Lung Cheng, Yi-Ming Lin, Po-Chih Huang, Yu-Hsiang Juan, Xuan-Yang Zheng, Ren-Jyue Wang, Chih-Yuan Wang
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Publication number: 20250121104Abstract: Compounds, e.g., radioimmunoconjugates, including a chelating moiety or a metal complex thereof, a linker, and an antibody or antigen-binding fragment thereof targeting both EGFR and cMET. Pharmaceutical compositions of such compounds and methods of treatment for conditions, e.g., cancer, using such compounds or pharmaceutical compositions.Type: ApplicationFiled: December 20, 2022Publication date: April 17, 2025Inventors: Sadaf AGHEVLIAN, Natalie GRINSHTEIN, Ian R. DUFFY, Thomas I. KOSTELINK, Andrew Grier BUCHANAN, Yariv MAZOR, Srinath KASTURIRANGAN, Qun DU, Chunning YANG, Frank Irvine COMER
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Patent number: 12276824Abstract: A light guide element includes first and second surfaces, a light-incident surface, and microstructure groups arranged on the first surface. Each microstructure group includes a first microstructure and a second microstructure separated from and being mirror image structures of each other. A first intersection line is provided between a first light-receiving surface of the first microstructure and the first surface. A first distance is provided between the first intersection line and a light-incident intersection line in a first direction. A second intersection line is provided between a second light-receiving surface of the second microstructure and the first surface. A second distance is provided between the second intersection line and the light-incident intersection line in the first direction. A variation trend of the first distance in a second direction is opposite to a variation trend of the second distance in the second direction.Type: GrantFiled: May 12, 2024Date of Patent: April 15, 2025Assignee: Coretronic CorporationInventors: Tzeng-Ke Shiau, Ying-Shun Syu, Wei-Chun Yang, Yi-Cheng Lin
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Publication number: 20250088392Abstract: The present disclosure provides a receiver circuit, which includes: a first comparator circuit, a second comparator circuit, and an inverter circuit. The inverter circuit has a first input terminal and a second input terminal. A first output terminal of the first comparator circuit is electrically connected to the first input terminal of the inverter circuit, and a second output terminal of the second comparator circuit is electrically connected to the second input terminal of the inverter circuit.Type: ApplicationFiled: September 12, 2023Publication date: March 13, 2025Inventors: SHU-CHUN YANG, WEI CHIH CHEN
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Patent number: 12249493Abstract: A method includes loading a wafer over a wafer chuck in a process chamber; performing a deposition process on the loaded wafer; supplying a fluid medium to a fluid guiding structure in the wafer chuck from a fluid inlet port on the wafer chuck, the fluid guiding structure comprising a plurality of arc-shaped channels fluidly communicated with each other; guiding the fluid medium from a first one of the arc-shaped channels of the fluid guiding structure to a second one of the arc-shaped channels of the fluid guiding structure. The second one of the arc-shaped channels of the fluid guiding structure is concentric with the first one of the arc-shaped channels of the fluid guiding structure from a top view.Type: GrantFiled: February 22, 2023Date of Patent: March 11, 2025Assignee: TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.Inventors: Sheng-Chun Yang, Yi-Ming Lin, Po-Wei Liang, Chu-Han Hsieh, Chih-Lung Cheng, Po-Chih Huang
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Publication number: 20250072007Abstract: A MRAM layout structure with multiple unit cells, including a first word line, a second word line and a third word line extending through active areas, wherein two ends of a first MTJ are connected respectively to a second active area and one end of a second MTJ, and two ends of a third MTJ are connected respectively to a third active area and one end of a fourth MTJ, and a first bit line and a second bit line connected respectively to the other end of the second MTJ and the other end of the fourth MTJ.Type: ApplicationFiled: November 13, 2024Publication date: February 27, 2025Applicant: UNITED MICROELECTRONICS CORP.Inventors: Yi-Ting Wu, Cheng-Tung Huang, Jen-Yu Wang, Yung-Ching Hsieh, Po-Chun Yang, Jian-Jhong Chen, Bo-Chang Li
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Patent number: 12235543Abstract: An electronic device is provided. The electronic device includes a frame, a working panel, a case, and an adhesive material. The frame includes a side wall and a back plate. The working panel is disposed on the back plate. The case is disposed on the frame and adjacent to the working panel. The adhesive material is disposed on the case. The side wall has an outer surface facing away from the working panel. In a cross-section view of the electronic device, a portion of the adhesive material is in contact with the outer surface of the side wall of the frame, and a length of the adhesive material is greater than or equal to 50% of a length of the side wall of the frame along an extension direction.Type: GrantFiled: March 19, 2024Date of Patent: February 25, 2025Assignee: INNOLUX CORPORATIONInventors: Wen-Cheng Huang, Ting-Sheng Chen, Chia-Chun Yang, Chin-Cheng Kuo
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Publication number: 20250062127Abstract: A method of a semiconductor-on-insulator structure includes the following steps. A semiconductor donor substrate is provided. A first implantation process is performed to form an exfoliation layer of the semiconductor donor substrate with a first ion concentration. A second implantation process is performed on a perimeter region of the exfoliation layer to form a high concentration region of the exfoliation layer with a second ion concentration higher than the first ion concentration. The semiconductor donor substrate is bonded to a semiconductor handle substrate, so that the exfoliation layer with the high concentration region is bonded to the semiconductor handle substrate. An annealing process is performed to separate the exfoliation layer from the rest of the semiconductor donor substrate.Type: ApplicationFiled: August 15, 2023Publication date: February 20, 2025Applicant: Taiwan Semiconductor Manufacturing Company, Ltd.Inventors: Su-Chun Yang, Jui Hsuan Tsai, Jih-Churng Twu, Chung-Shi Liu, Chen-Hua Yu
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Publication number: 20250059295Abstract: Provided are T ell engaging molecules that bind an antigen on a non-immune cell and an antigen on an immune cell. The T cell engaging molecules can bind STEAP2 on a cancer cell and, e.g., a CD3 on a T cell. The T cell engaging molecules can also bind STEAP2 on a cancer cell and, e.g., a CD8 on a T cell. Alternatively, the T cell engaging molecules can bind STEAP2 on a cancer cell and both CD3 and CD8 on a T cell.Type: ApplicationFiled: April 10, 2024Publication date: February 20, 2025Inventors: Zachary BRITTON, Sao Fong CHEUNG, Jeong Min HAN, Yariv MAZOR, Suzanne SITNIKOVA, Dewald van DYK, Even WALSENG, Chunning YANG, Simon DOVEDI, Saso CEMERSKI, Natalie BURROWS, Nikolaos IOANNOU, Oisin HUHN
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Publication number: 20250053064Abstract: Optical devices and methods of manufacture are presented in which a non-linear material is deposited or otherwise placed. Once the non-linear material has been deposited, implantation regions are formed within the non-linear material using an implantation process. The implantation regions are removed using an etching process, and electrodes are formed to the remaining material.Type: ApplicationFiled: August 11, 2023Publication date: February 13, 2025Inventors: Su-Chun Yang, Chen Chiang Yu, Jui Hsuan Tsai, Jih-Churng Twu, Chung-Shi Liu, Chen-Hua Yu
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Publication number: 20250044347Abstract: An adjustable supporting device including a circuit board, a first fixing module, an adjusting module, a second fixing module, and a supporting base is configured to support a test circuit module. The supporting base is positioned in a first opening of the circuit board, a second opening of the first fixing module, and a third opening of the adjusting module and abuts against the second fixing module and a carrier of the test circuit module. The supporting base includes a first portion abutting against the second fixing module, a second portion connected to a third portion, the third portion connected to a fourth portion, and the fourth portion abutting against the carrier. The first portion and the second portion adjust the parallelism between the test circuit module and a semiconductor element through contact, thereby adjusting the horizontal flatness of multiple contact points of the test circuit module.Type: ApplicationFiled: October 5, 2023Publication date: February 6, 2025Applicant: HERMES TESTING SOLUTIONS INC.Inventors: Yi-Chun Yang, Sih-Ying Chang
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Patent number: 12208289Abstract: Disclosed herein is an anti-CD79b antibody or antigen-binding fragment thereof, a drug conjugate thereof and use thereof. The anti-CD79b antibody or antigen-binding fragment thereof herein comprises: HCDR1 comprising the amino acid sequence of SEQ ID NO: 1; HCDR2 comprising the amino acid sequence of SEQ ID NO: 2; HCDR3 comprising the amino acid sequence of SEQ ID NO: 3; LCDR1 comprising the amino acid sequence of SEQ ID NO: 4; LCDR2 comprising the amino acid sequence of SEQ ID NO: 5; and LCDR3 comprising the amino acid sequence of SEQ ID NO: 6.Type: GrantFiled: October 31, 2019Date of Patent: January 28, 2025Assignee: NewBio Therapeutics, Inc.Inventors: Nianhe Han, Liwei Song, Deqiang An, Di Zeng, Huali Li, Chun Yang
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Publication number: 20250031434Abstract: A method includes bonding a first semiconductor die and a second semiconductor die to a substrate, where a gap is disposed between a first sidewall of the first semiconductor die and a second sidewall of the second semiconductor die, performing a plasma treatment to dope top surfaces and sidewalls of each of the first semiconductor die and the second semiconductor die with a first dopant, where a concentration of the first dopant in the first sidewall decreases in a vertical direction from a top surface of the first semiconductor die towards a bottom surface of the first semiconductor die, and a concentration of the first dopant in the second sidewall decreases in a vertical direction from a top surface of the second semiconductor die towards a bottom surface of the second semiconductor die, and filling the gap with a spin-on dielectric material.Type: ApplicationFiled: July 17, 2023Publication date: January 23, 2025Inventors: Yu-Hung Lin, Jih-Churng Twu, Su-Chun Yang, Shih-Peng Tai, Yu-Hao Kuo
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Publication number: 20250029521Abstract: An image display device is disclosed in which electrical connection to a rotary body is reliably maintained during rotation of the rotary body and supply of power and transmission and reception of a signal are stabilized. Since transmission and reception of a signal between a communication transmitter and a communication receiver are implemented through a cavity formed in a motor, introduction of an external signal is blocked, and thus security and control stability are ensured. Even when a rotary module rotates at a high speed, damage thereto due to friction is prevented, and thus the durability thereof is ensured. Rotation of the rotary module is stabilized through structural stabilization.Type: ApplicationFiled: November 21, 2023Publication date: January 23, 2025Applicants: HYUNDAI MOTOR COMPANY, KIA CORPORATION, SL CORPORATIONInventors: Joon Bo Shim, Yong Duk Bae, Cheol Chun Yang, Ji Hun Park, Hee Beom Park, Jung Hee Seo, Gyun Chae
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Publication number: 20250019438Abstract: The present disclosure relates to antibodies or fragments thereof comprising an antigen binding domain capable of binding to a CD3 protein or a fragment thereof. The present disclosure also relates to such antibodies that bind to CD3 having optimized affinity to induce T cell activation, but without being associated with excessive cytokine release and reduced tolerability. The disclosure also relates to methods of producing these antibodies and their therapeutic uses.Type: ApplicationFiled: April 9, 2024Publication date: January 16, 2025Inventors: Yariv MAZOR, Zachary BRITTON, Xiuling LI, Sterling PAYNE, Even WALSENG, Chunning YANG
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Publication number: 20250020390Abstract: A refrigerator includes a box body, a door body, a hinge assembly, and a mounting block. The door body is connected to the box body. The hinge assembly includes a first hinge shaft and a second hinge shaft. The mounting block includes a first trajectory groove and a second trajectory groove. During a process of the door body being rotated to open or close, the first hinge shaft moves relative to the first trajectory groove, and the second hinge shaft moves relative to the second trajectory groove. The first trajectory groove includes a curved groove segment. An end of the curved groove segment extends in a direction proximate to a first side edge, and a distance between the curved groove segment and the door side wall is decreased along a direction from a door rear wall to a door front wall.Type: ApplicationFiled: September 27, 2024Publication date: January 16, 2025Applicant: HISENSE REFRIGERATOR CO., LTD.Inventors: Chun YANG, Dong GUO, Xiangping ZHANG
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Publication number: 20250011426Abstract: Provided herein are multispecific antibodies containing a lambda charge pair introduced into the interface of a heavy chain and a light chain to reduce chain mispairing.Type: ApplicationFiled: April 5, 2024Publication date: January 9, 2025Inventors: Yariv MAZOR, Vaheh OGANESYAN, Chi-I CHIANG, John David BAGERT, Xiuling LI, Sterling PAYNE, Even WALSENG, Ying FU, Chunlei WANG, Chunning YANG
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Publication number: 20240425853Abstract: A modified small interfering RNA (siRNA) molecule comprising phosphorothioate (PS) intemucleotide linkages in the antisense strand for reducing off-target effects and methods and uses thereof. The siRNAs targeting Hypoxia Inducible Factor 1 Subunit Alpha (HIF1a) with high specificity and silencing efficiency.Type: ApplicationFiled: July 21, 2022Publication date: December 26, 2024Applicant: MICROBIO (SHANGHAI) CO. LTD.Inventors: Yi-Chung Chang, Chi-Fan Yang, Hui-Yu Chen, Chia-Chun Yang
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Patent number: 12178052Abstract: A MRAM circuit structure is provided in the present invention, with the unit cell composed of three transistors in series and four MTJs, wherein the junction between first transistor and third transistor is first node, the junction between second transistor and third transistor is second node, and the other ends of first transistor and third transistor are connected to a common source line. First MTJ is connected to second MTJ in series to form a first MTJ pair that connecting to the first node, and third MTJ is connected to fourth MTJ in series to form a second MTJ pair that connecting to the second node.Type: GrantFiled: July 7, 2021Date of Patent: December 24, 2024Assignee: UNITED MICROELECTRONICS CORP.Inventors: Yi-Ting Wu, Cheng-Tung Huang, Jen-Yu Wang, Yung-Ching Hsieh, Po-Chun Yang, Jian-Jhong Chen, Bo-Chang Li