Abstract: A semiconductor device structure and a formation method are provided. The method includes forming a dummy gate stack over a substrate and forming a dielectric layer laterally surrounding the dummy gate stack. The method also includes introducing dopants into an upper portion of the dielectric layer and removing the dummy gate stack to form a trench surrounded by the dielectric layer. The method further includes forming a metal gate stack in the trench.

Abstract: A wireless transmission system includes a signal-transmitting device and a signal-receiving device. The signal-transmitting device is disposed in a remote-control apparatus for transmitting wireless signals wherein the remote-control apparatus is a mouse. The signal-receiving device is installed on an electronic apparatus to receive the wireless signals and trigger operations in response the wireless signals. The signal-receiving device includes a patch antenna including a dielectric substrate having a first surface and a second surface opposite to the first surface, a ground layer disposed on the first surface, and a radiating metal layer. The radiating metal layer is disposed on the second surface and includes a radiation receiving surface. A first position of the radiation receiving surface is separated from the ground layer by a first distance, and a second position of the radiation receiving surface is separated from the ground layer by a second distance less than the first distance.

Abstract: An information handling system includes a host processing system and a Liquid Crystal Display device. The host processing system includes a graphics processing unit (GPU) and the LCD device includes a memory device and a DisplayPort Configuration Data (DPCD) register. The host processing system 1) determines whether the first GPU supports a Dynamic Display Shifting (DDS) mode, 2) when the GPU does not support the DDS mode, provides a first indication to the LCD device that the GPU does not support the DDS mode, and 3) when the GPU supports the DDS mode, provides a second indication to the LCD device that the GPU supports the DDS mode. The LCD device retrieves a Panel Self Refresh (PSR) setting from the memory device and stores the PSR setting to the DPCD register in response to the first indication, and retrieves a DDS setting from the memory and stores the DDS setting to the DPCD register in response to the second indication.

Abstract: As deposited, hard mask thin films have internal stress components which are an artifact of the material, thickness, deposition process of the mask layer as well as of the underlying materials and topography. This internal stress can cause distortion and twisting of the mask layer when it is patterned, especially when sub-micron critical dimensions are being patterned. A stress-compensating process is employed to reduce the impact of this internal stress. Heat treatment can be employed to relax the stress, as an example. In another example, a second mask layer with an opposite internal stress component is employed to offset the internal stress component in the hard mask layer.

Abstract: A stacked testing assembly (100) includes a microfluidic cartridge (10) for analyzing a fluid sample and a testing setup, said microfluidic cartridge includes a number of layers (1, 2) stacked in a height direction with many different kinds of combinations, said testing setup (20) is capable of assembling and testing all kinds of said layers combinations with no change to the setup.

Abstract: A brightness compensation circuitry includes a data-setting switch unit receiving a data-setting signal, a pixel unit including a pixel driving circuit that receives the data-setting signal during a data-input period to generate a driving current, and a compensation circuit receiving the driving current generated by the pixel driving circuit. The compensation circuit controls the data-setting switch unit to conduct or not conduct by determining whether or not a magnitude of the driving current conforms with a criterion that is associated with target brightness of the pixel unit.

Abstract: A connector assembly includes a first connector and a second connector mating with the first connector. The first connector defines a first mating face, a first cleaning device disposed in the first mating face and a stiff first mating portion exposed upon the first mating face. The second connector defines a second mating face, a second cleaning device disposed in the second mating face and a stiff second mating portion exposed upon the second mating face. During mating the first connector to the second connector along the mating direction, the first cleaning device wipes the second mating face for wiping away the dirty attached to the second mating portion while the second cleaning device wipes the first mating face for wiping away the dirty attached to the first mating portion until the first and second mating portions mated with each other.

Abstract: A method for manufacturing a light-emitting diode (LED) includes plural steps as follows. A first type semiconductor layer is formed. A second type semiconductor layer is formed on the first type semiconductor layer. An impurity is implanted into a first portion of the second type semiconductor layer. The concentration of the impurity present in the first portion of the second type semiconductor layer is greater than the concentration of the impurity present in a second portion of the second type semiconductor layer after the implanting, such that the resistivity of the first portion of the second type semiconductor layer is greater than the resistivity of the second portion of the second type semiconductor layer.

Abstract: A method for manufacturing a display device is provided. The method includes: forming at least two bottom conductive lines on an array substrate; disposing at least four micro light emitting devices respectively on the bottom conductive lines; forming at least one filling material covering the micro light emitting devices; forming at least four openings in the filling material by photolithography, such that the micro light emitting devices are respectively exposed by the openings; and forming at least two upper conductive lines on the filling material, wherein the upper conductive lines are electrically connected to the micro light emitting devices through the openings, and the upper conductive lines and the bottom conductive lines cross at the micro light emitting devices.

Abstract: An operating method of a display device includes providing a first supply voltage to a light emitting diode to make a driving current pass through the light emitting diode. The light emitting diode is electrically connected with an electrically controlled switch, the electrically controlled switch is electrically connected with a control circuit, the control circuit is configured to drive the electrically controlled switch according to a data signal and a scan signal, the first supply voltage is a pulse width modulation voltage, and a duty cycle of the first supply voltage is less than 100%.

Abstract: A method for manufacturing a display device is provided. The method includes: forming at least two bottom conductive lines on an array substrate; disposing at least four micro light emitting devices respectively on the bottom conductive lines; forming at least one filling material covering the micro light emitting devices; forming at least four openings in the filling material by photolithography, such that the micro light emitting devices are respectively exposed by the openings; and forming at least two upper conductive lines on the filling material, wherein the upper conductive lines are electrically connected to the micro light emitting devices through the openings, and the upper conductive lines and the bottom conductive lines cross at the micro light emitting devices.

Abstract: A stacked testing assembly (100) includes a microfluidic cartridge (10) for analyzing a fluid sample and a testing setup, said microfluidic cartridge includes a number of layers (1, 2) stacked in a height direction with many different kinds of combinations, said testing setup (20) is capable of assembling and testing all kinds of said layers combinations with no change to the setup.

Abstract: A display device includes an array substrate, the bottom conductive lines, the micro light emitting devices, the conductive layers, the upper conductive lines, and a filling material. The bottom conductive lines are present on the array substrate. The conductive layers are respectively present between the micro light emitting devices and the bottom conductive lines. The upper conductive lines cross the bottom conductive lines at the micro light emitting devices. Each of the micro light emitting devices is present between at least one of the bottom conductive lines and at least one of the upper conductive lines. The filling material is present on the array substrate and has at least four openings to respectively expose the micro light emitting devices. The upper conductive lines are electrically connected to the micro light emitting devices respectively through the openings.

Abstract: A transfer head array includes a body and a plurality of transfer heads. The body has a first surface, a second surface opposite to the first surface, and a plurality of recesses. The first surface has at least one chucking region and at least one interference avoidance region, and the recesses are separated from each other and are disposed in the interference avoidance region. The transfer heads are disposed on the chucking region.

Abstract: A method for preparing a plurality of micro-devices for transfer includes temporarily bonding the micro-devices onto a carrier substrate; testing the micro-devices on the carrier substrate to determine if there is at least one first failed micro-device in the micro-devices; and removing the first failed micro-device from the carrier substrate.

Abstract: An operating method of a display device includes providing a first supply voltage to a light emitting diode to make a driving current pass through the light emitting diode. The light emitting diode is electrically connected with an electrically controlled switch, the electrically controlled switch is electrically connected with a control circuit, the control circuit is configured to drive the electrically controlled switch according to a data signal and a scan signal, the first supply voltage is a pulse width modulation voltage, and a duty cycle of the first supply voltage is less than 100%.

Abstract: A method for preparing a plurality of micro-devices for transfer includes temporarily bonding the micro-devices onto a carrier substrate; testing the micro-devices on the carrier substrate to determine if there is at least one first failed micro-device in the micro-devices; and removing the first failed micro-device from the carrier substrate.

Abstract: A method for repairing a light-emitting diode (LED) lighting device is provided. The method includes the operations below. First, the LED lighting device is obtained. The LED lighting device includes a substrate having a top surface and a recess, a first bottom electrode disposed on the top surface and on a bottom surface of the recess, a second bottom electrode disposed on the top surface, an LED disposed in the recess and on the first bottom electrode, and a top transparent electrode disposed on the LED and the second bottom electrode. Then, a test is performed to know whether the first bottom electrode, the LED, the top transparent electrode, and the second bottom electrode form a part of an electrical loop. Finally, a connecting member is formed to electrically connect the first bottom electrode and the second bottom electrode if the electrical loop is open.

Abstract: An electrical connector includes an insulator adapted to be downwardly assembled into the housing of the cradle, and a set of contacts upwardly assembled into the insulator. Each contact includes a vertical retention section received in the corresponding retention slot in the insulator via an upward insertion process, and an upper spring arm extending from an upper edge of the retention section for mechanically and electrically connecting to the machine case, and a lower spring arm extending from a lower edge of the retention section for mechanically and electrically connecting to the cable. The free end of the upper spring arm is downwardly abutted against by the insulator while that of the lower spring arm is not.

Abstract: A machine case includes a sink-like main portion and opposite deck stations by two ends of said main portion, and a terminal module. Said terminal module includes an insulator defining opposite top and bottom surfaces and a set of contacts retained to the insulator via a first insert molding process and arranged along a transverse direction. Each of said contacts is stamped and bent from sheet metal and unitarily formed with an upper contacting section and a lower contacting section. One of said upper contacting section and said lower contacting section defines an exposed end for originally linking to a contact carrier. The insulator forms a set of recesses originally formed between the contacting sections of neighboring contacts during the first insert molding while successively filled with material by the corresponding deck station in which said terminal module is embedded.