Abstract: An electrical connector includes an insulator adapted to be downwardly assembled into the housing of the cradle, and a set of contacts upwardly assembled into the insulator. Each contact includes a vertical retention section received in the corresponding retention slot in the insulator via an upward insertion process, and an upper spring arm extending from an upper edge of the retention section for mechanically and electrically connecting to the machine case, and a lower spring arm extending from a lower edge of the retention section for mechanically and electrically connecting to the cable. The free end of the upper spring arm is downwardly abutted against by the insulator while that of the lower spring arm is not.

Abstract: A machine case includes a sink-like main portion and opposite deck stations by two ends of said main portion, and a terminal module. Said terminal module includes an insulator defining opposite top and bottom surfaces and a set of contacts retained to the insulator via a first insert molding process and arranged along a transverse direction. Each of said contacts is stamped and bent from sheet metal and unitarily formed with an upper contacting section and a lower contacting section. One of said upper contacting section and said lower contacting section defines an exposed end for originally linking to a contact carrier. The insulator forms a set of recesses originally formed between the contacting sections of neighboring contacts during the first insert molding while successively filled with material by the corresponding deck station in which said terminal module is embedded.

Abstract: An electrical connector for use within a machine case includes an insulator and a plurality of contacts. The insulator defines opposite top and bottom surfaces thereon in a vertical direction. The contacts are retained to the insulator via an insert molding process. Each of said contacts is stamped and bent from sheet metal and unitarily formed with an upper contacting section exposed upon the top surface, and a lower contacting sections exposed upon the bottom surface. Each of said upper contacting section and said lower contacting section extends along a longitudinal direction perpendicular to both said vertical direction and said transverse direction. Each of the upper contacting section and the lower contacting section is planar and stationary. One of said upper contacting section and said lower contacting section has an outer end exposed to an exterior for originally linking to a contact carrier.

Abstract: An optoelectronic assembly includes a printed circuit board (PCB) defining opposite upper and lower surfaces, and equipped, on the upper surface, with an active component and an Integrated Circuit (IC) linked to each other via the flip chip technology, a lens module located on the side of the lower surface and communicating with the active component through via holes in the PCB, and a fiber assembly located in the lens module to be optically coupled to the active component via said lens module.

Abstract: An optoelectronic assembly includes a printed circuit board (PCB), a glass carrier positioned upon the PCB and equipped with thereon an active component and an Integrated Circuit (IC) linked to each other via the flip chip technology, an optical waveguide embedded within the PCB, and a ferrule located around the optical waveguide to couple an external optical device thereto for optical transmission therebetween.

Abstract: An electrical connector for use with an electronic package, includes an insulative housing with contacts, a cover assembled on the housing and including a main body with a mating portion, the mating portion formed with an entrance, and a loading component engaging with the mating portion of the cover and passing through the entrance of the cover to directly press the electronic package.

Abstract: A plug connector includes a connector tab connected to and extending longitudinally away from a rear body, the tab includes opposite first and second major surfaces. A first plurality of contacts is carried by the tab on the first major surface and a second plurality of contacts is carried by the tab on the second major surface. The contacts include differential signal pairs. Each pair of the differential signal pairs is consisting of two individual contacts and said two contacts are located adjacent to each other but at the first and second main surface respectively.

Abstract: A light-emitting diode (LED) includes a first type semiconductor layer, a second type semiconductor layer, a current controlling structure, a first electrode, and a second electrode. The second type semiconductor layer is joined with the first type semiconductor layer. The current controlling structure is joined with the first type semiconductor layer, and the current controlling structure has at least one current-injecting zone therein. The first electrode is electrically coupled with the first type semiconductor layer through the current-injecting zone of the current controlling structure. The second electrode is electrically coupled with the second type semiconductor layer.

Abstract: A light-emitting diode (LED) includes a first type semiconductor layer, a second type semiconductor layer, a first current controlling structure, and a first electrode. The second type semiconductor layer is joined with the first type semiconductor layer. The second type semiconductor layer has a first region and a second region, in which the first region has a first threading dislocation density, the second region has a second threading dislocation density, and the first threading dislocation density is greater than the second threading dislocation density. The first current controlling structure is joined with the first type semiconductor layer and has at least one first current-injecting zone therein, in which the vertical projection of the second region on the first current controlling structure at least partially overlaps with the first current-injecting zone. The first electrode is electrically coupled with the first type semiconductor layer.

Abstract: A micro-light-emitting diode (micro-LED) includes a first type semiconductor layer, a second type semiconductor, a first current controlling layer, a first electrode, and a second electrode. The second type semiconductor layer and the first current controlling layer are joined with the first type semiconductor layer. The first current controlling layer has at least one opening therein. The first electrode is electrically coupled with the first type semiconductor layer through the opening. The second electrode is electrically coupled with the second type semiconductor layer. At least one of the first electrode and the second electrode has a light-permeable part. A vertical projection of the first current controlling layer on said one of the first electrode and the second electrode overlaps with the light-permeable part. The light-permeable part is transparent or semi-transparent.

Abstract: A micro-light-emitting diode (micro-LED) includes a first type semiconductor layer, a second type semiconductor layer, a first edge isolation structure, a first electrode, and a second electrode. The second type semiconductor layer and the first edge isolation structure are joined with the first type semiconductor layer. The first electrode is electrically coupled with the first type semiconductor layer. At least a part of a vertical projection of an edge of the first type semiconductor layer on the first electrode overlaps with the first electrode. The first edge isolation structure is at least partially located on the part of the first type semiconductor layer. The second electrode is electrically coupled with the second type semiconductor layer.

Abstract: An electrical connector assembly (100) for electrically connecting an abutment connector (3) comprises an electrical connector (1) with a plurality of contacts (12) and a support device, the support device includes a support member (2) for positioning the abutment connector (3) being assembled in a horizontal direction and a press member (4) assembled to the support member (2), the support member (2) includes a bottom wall (22) and a top wall (21) opposite to each other, the bottom wall (22) includes a spring portion (221) supports the abutment connector (3) to make it disconnect with the contacts (12), when the press member (4) is inserted into the support member (2), the spring portion (221) moves downwardly to make the abutment connector (3) connect with the contacts (12).

Abstract: A micro-light-emitting diode (micro-LED) includes a first type semiconductor layer, a second type semiconductor, a first current controlling layer, a first electrode, and a second electrode. The second type semiconductor layer and the first current controlling layer are joined with the first type semiconductor layer. The first current controlling layer has at least one opening therein. The first electrode is electrically coupled with the first type semiconductor layer through the opening. The second electrode is electrically coupled with the second type semiconductor layer. At least one of the first electrode and the second electrode has a light-permeable part. A vertical projection of the first current controlling layer on said one of the first electrode and the second electrode overlaps with the light-permeable part. The light-permeable part is transparent or semi-transparent.

Abstract: A micro-light-emitting diode (micro-LED) includes a first type semiconductor layer, a second type semiconductor layer, a first edge isolation structure, a first electrode, and a second electrode. The second type semiconductor layer and the first edge isolation structure are joined with the first type semiconductor layer. The first electrode is electrically coupled with the first type semiconductor layer. At least a part of a vertical projection of an edge of the first type semiconductor layer on the first electrode overlaps with the first electrode. The first edge isolation structure is at least partially located on the part of the first type semiconductor layer. The second electrode is electrically coupled with the second type semiconductor layer.

Abstract: An optical module (8) set on a substrate (6) for assembling with a fiber (72) and includes a resin seat (1), an optical member (2) assembled on the resin seat (1) for receiving and transferring light signals sent by the fiber (72) to electrical signals and a connecting member (3) set on the optical member (2), the optical member (2) includes a first surface (21) perpendicular to the fiber (72) and a second surface (22) opposite to the first surface (21), the first surface (21) faces to the fiber (72), the connecting member (3) set on the first surface (21) of the optical member (2) and soldered to the substrate (6).

Abstract: An optical connector for optically coupling light between an optical fiber and an opto-electronic device (OED) includes a lens body having a first lens array, a second lens array, and a reflecting surface on the optical path between the first lens array and the second lens array for reflecting the light between the optical fiber and the OED; and a seat separated from the lens body and located under the lens body for receiving the lens body therein. The seat includes an alignment feature as a datum for aligning the OED and an alignment structure for aligning the lens body, and wherein there is a predetermined position relationship between the alignment feature and the alignment structure so that the lens body aligns with the OED when the lens body is assembled in the seat.

Abstract: An electrical connector electrically connecting a chip module to a printed circuit board, and includes an insulative housing, a plurality of terminals received in the insulative housing and a block assembled to the insulative housing, the electrical connector comprises a bottom wall and a plurality of side walls, between the bottom wall and the side walls forms a receiving space to receive the chip module for assembling the chip module from top to bottom in vertical direction, the block is configured with frame shape and comprises a plurality of tabs, the insulative housing comprises a plurality of slots matched with the tabs, the block can prevent the chip module coming off from the insulative housing while the chip module received in the receiving space.

Abstract: A flappable plug connector and a complementary receptacle connector are provided wherein the plug connector defining a mating tongue, is made with a pair of insert molding housings which are associated with the contacts thereof, commonly sandwiching a paddle card therebetween with a pair of power contacts exposed on two opposite lateral sides to form a sub-assembly. The corresponding receptacle connector defines a receiving cavity to receive the mating tongue of the plug connector. The plug connector defines a V-Bus clip surrounding the mating tongue for power transfer and the receptacle connector includes a pair of deflectable power contacts by two sides of the receiving cavity.

Abstract: An electrical connector assembly (100) for electrically connecting an abutment connector (3) comprises an electrical connector (1) with a plurality of contacts (12) and a support device, the support device includes a support member (2) for positioning the abutment connector (3) being assembled in a horizontal direction and a press member (4) assembled to the support member (2), the support member (2) includes a bottom wall (22) and a top wall (21) opposite to each other, the bottom wall (22) includes a spring portion (221) supports the abutment connector (3) to make it disconnect with the contacts (12), when the press member (4) is inserted into the support member (2), the spring portion (221) moves downwardly to make the abutment connector (3) connect with the contacts (12).

Abstract: The invention discloses a chemical plating product and method forming thereof, the chemical plating product includes an insulating member (1) and a metal coating covering the insulating member (1), the metal coating includes a pre-plating scope (2) formed by a coating catalyst and a chemical copper layer (3) covering the pre-plating scope (2).