Abstract: A method for manufacturing a light-emitting diode (LED) includes plural steps as follows. A first type semiconductor layer is formed. A second type semiconductor layer is formed on the first type semiconductor layer. An impurity is implanted into a first portion of the second type semiconductor layer. The concentration of the impurity present in the first portion of the second type semiconductor layer is greater than the concentration of the impurity present in a second portion of the second type semiconductor layer after the implanting, such that the resistivity of the first portion of the second type semiconductor layer is greater than the resistivity of the second portion of the second type semiconductor layer.

Abstract: An electrical connector for use within a machine case includes an insulator and a plurality of contacts. The insulator defines opposite top and bottom surfaces thereon in a vertical direction. The contacts are retained to the insulator via an insert molding process. Each of said contacts is stamped and bent from sheet metal and unitarily formed with an upper contacting section exposed upon the top surface, and a lower contacting sections exposed upon the bottom surface. Each of said upper contacting section and said lower contacting section extends along a longitudinal direction perpendicular to both said vertical direction and said transverse direction. Each of the upper contacting section and the lower contacting section is planar and stationary. One of said upper contacting section and said lower contacting section has an outer end exposed to an exterior for originally linking to a contact carrier.

Abstract: A brightness compensation circuitry includes a data-setting switch unit receiving a data-setting signal, a pixel unit including a pixel driving circuit that receives the data-setting signal during a data-input period to generate a driving current, and a compensation circuit receiving the driving current generated by the pixel driving circuit. The compensation circuit controls the data-setting switch unit to conduct or not conduct by determining whether or not a magnitude of the driving current conforms with a criterion that is associated with target brightness of the pixel unit.

Abstract: A connector assembly includes a first connector and a second connector mating with the first connector. The first connector defines a first mating face, a first cleaning device disposed in the first mating face and a stiff first mating portion exposed upon the first mating face. The second connector defines a second mating face, a second cleaning device disposed in the second mating face and a stiff second mating portion exposed upon the second mating face. During mating the first connector to the second connector along the mating direction, the first cleaning device wipes the second mating face for wiping away the dirty attached to the second mating portion while the second cleaning device wipes the first mating face for wiping away the dirty attached to the first mating portion until the first and second mating portions mated with each other.

Abstract: An optical connector (1) for transferring light sent by fibers (2) and comprises a resin body (10) and a plurality of lenses (11), the resin body (10) includes a bottom surface (102), a top surface (101) opposite to the bottom surface (102), a front surface (103) connecting the top surface (101) and the bottom surface (102), and a slant surface (105) forms an angle with the front surface (103) and the top surface (101), the lenses (11) are set on the slant surface (105), the resin body (10) further includes a first recess (1011) recessed from the top surface (101) to the inner of the resin body (10), when the fibers (2) was assembled to the optical connector (1), the fibers (2) locate in the first recess (1011) and the optical connector (1) further includes optical cement (3) filled in the first recess (1011).

Abstract: A light-emitting diode (LED) includes a first type semiconductor layer, a second type semiconductor layer, a current controlling structure, a first electrode, and a second electrode. The second type semiconductor layer is joined with the first type semiconductor layer. The current controlling structure is joined with the first type semiconductor layer, and the current controlling structure has at least one current-injecting zone therein. The first electrode is electrically coupled with the first type semiconductor layer through the current-injecting zone of the current controlling structure. The second electrode is electrically coupled with the second type semiconductor layer.

Abstract: An optoelectronic assembly includes a printed circuit board (PCB) defining opposite upper and lower surfaces, and equipped, on the upper surface, with an active component and an Integrated Circuit (IC) linked to each other via the flip chip technology, a lens module located on the side of the lower surface and communicating with the active component through via holes in the PCB, and a fiber assembly located in the lens module to be optically coupled to the active component via said lens module.

Abstract: A transfer head array includes a body and a plurality of transfer heads. The body has a first surface, a second surface opposite to the first surface, and a plurality of recesses. The first surface has at least one chucking region and at least one interference avoidance region, and the recesses are separated from each other and are disposed in the interference avoidance region. The transfer heads are disposed on the chucking region.

Abstract: A plug connector includes a mating tongue defining top and bottom surfaces thereon. Each surface is provided with a plurality of conductors in one row wherein the characters/categories of the conductors on the top surface are sequentially arranged to be same with those on the bottom surface with a pair of power conductors in two notches at two lateral side edges. The corresponding receptacle connector mounted upon a printed circuit board, defines a receiving cavity to receive the mating tongue therein. Opposite top and bottom rows of contacts are respectively located by upper and bottom sides of the receiving cavity and categorized essentially in a same sequence with the conductors of the plug connector for respectively connecting to the corresponding conductive pads, respectively. A pair of power contacts are located by two lateral sides of the receiving cavity to couple to the corresponding power conductor portions in the notches.

Abstract: A plug connector includes a mating tongue defining top and bottom surfaces thereon. Each surface is provided with a plurality of conductors in one row wherein the characters/categories of the conductors on the top surface are sequentially arranged to be same with those on the bottom surface with a pair of power conductors in two notches at two lateral side edges. The corresponding receptacle connector mounted upon a printed circuit board, defines a receiving cavity to receive the mating tongue therein. Opposite top and bottom rows of contacts are respectively located by upper and bottom sides of the receiving cavity and categorized essentially in a same sequence with the conductors of the plug connector for respectively connecting to the corresponding conductive pads, respectively. A pair of power contacts are located by two lateral sides of the receiving cavity to couple to the corresponding power conductor portions in the notches.

Abstract: A manufacturing method of a light emitting diode (LED) display device includes forming at least one sub-pixel circuit on a substrate, forming a primary electrical pad and a first backup electrical pad electrically connected to the sub-pixel circuit, disposing a first micro light emitting device on the primary electrical pad and testing the first micro light emitting device.

Abstract: A manufacturing method of a light emitting diode (LED) display device includes forming at least one sub-pixel circuit on a substrate, forming a primary electrical pad and a first backup electrical pad electrically connected to the sub-pixel circuit, disposing a first micro light emitting device on the primary electrical pad and testing the first micro light emitting device.

Abstract: A flappable plug connector and a complementary receptacle connector are provided wherein the plug connector defining a mating tongue, is made with a pair of insert molding housings which are associated with the contacts thereof, commonly sandwiching a paddle card therebetween with a pair of power contacts exposed on two opposite lateral sides to form a sub-assembly. The corresponding receptacle connector defines a receiving cavity to receive the mating tongue of the plug connector. The plug connector defines a V-Bus clip surrounding the mating tongue for power transfer and the receptacle connector includes a pair of deflectable power contacts by two sides of the receiving cavity.

Abstract: A LED display includes a bottom substrate, a first bottom electrode, a micro light emitting device, a wavelength conversion layer, an opposite electrode, and a first isolation layer. The first bottom electrode is disposed on the bottom substrate. The micro light emitting device is disposed on the first bottom electrode and includes at least one current controlling structure having at least one opening therein. The wavelength conversion layer covers the micro light emitting device, in which the wavelength conversion layer converts the light from a range of initial wavelengths into a range of predetermined wavelengths, and the range of predetermined wavelengths is greater than the range of initial wavelengths. The opposite electrode is electrically connected to the micro light emitting device. The first isolation layer is disposed between the micro light emitting diode and the opposite electrode to isolate the first bottom electrode and the opposite electrode.

Abstract: An electrical connector includes an insulative housing with a base and a mating tongue extending forwardly in a front-to-rear direction from the base, the mating tongue defining a first surface and a second surface opposite to each other. A plurality of contact strips is disposed around the outer surface of the mating tongue of the insulative housing, each contact strip is stamped from a metal sheet and defines a first contacting section exposed upon the first surface and arranged along a transverse direction perpendicular to the front-to-rear direction, and a second contacting section exposed upon the second surface and arranged along the transverse direction.

Abstract: A light-emitting device display includes a substrate, a first bottom electrode, a second bottom electrode, a micro light emitting device, a first isolation layer, an opposite electrode, and an encapsulation layer. The first and second bottom electrodes are disposed on the substrate. The micro light emitting device is disposed on the first bottom electrode and electrically connected to the first bottom electrode. The first isolation layer at least partially covers a side surface of the micro light emitting device, in which the first isolation layer has a refractive index n1, and the micro light emitting device has a refractive index ndevice, and ndevice?n1. The opposite electrode is disposed on the micro light emitting device and electrically connected to the micro light emitting device and the second bottom electrode. The encapsulation layer at least covers the micro light emitting device and the first isolation layer.

Abstract: An optical connector (1) for transferring light sent by fibers (2) and comprises a resin body (10) and a plurality of first lenses (11) and second lenses (12), the resin body (10) includes a bottom surface (102), a top surface (101) opposite to the bottom surface (102), a front surface (103) connecting the top surface (101) and the bottom surface (102), a first slant surface (106) and a second slant surface (105) form an angle with the bottom surface (102), the first lenses (11) are set on the first slant surface (106), the second lenses (121) are set on the second slant surface (105), the projections of the first lenses (11) and second lenses (12) that projected on the bottom surface (102) are not aligned with each other.

Abstract: A plug connector includes a mating tongue defining top and bottom surfaces thereon. Each surface is provided with a plurality of conductors in one row wherein the characters/categories of the conductors on the top surface are sequentially arranged to be same with those on the bottom surface with a pair of power conductors in two notches at two lateral side edges. The corresponding receptacle connector mounted upon a printed circuit board, defines a receiving cavity to receive the mating tongue therein. Opposite top and bottom rows of contacts are respectively located by upper and bottom sides of the receiving cavity and categorized essentially in a same sequence with the conductors of the plug connector for respectively connecting to the corresponding conductive pads, respectively. A pair of power contacts are located by two lateral sides of the receiving cavity to couple to the corresponding power conductor portions in the notches.

Abstract: An optical module (100) set on a substrate for assembling with a fiber (72) and comprises a light signal gathering device (8), a plurality of electrical contacts (2) set on the light signal gathering device (8) and an optoelectronic device (4) soldered to the electrical contacts (2) for receiving the light signals refocused by the light signal gathering device (8) and transferring the light signals to electrical signals, the light signal gathering device (8) includes a resin body (1) and a light signal gathering portion set on the resin body (1) for refocusing light signals.

Abstract: A light-emitting diode (LED) includes a first type semiconductor layer, a second type semiconductor layer, a first current controlling structure, and a first electrode. The second type semiconductor layer is joined with the first type semiconductor layer. The second type semiconductor layer has a first region and a second region, in which the first region has a first threading dislocation density, the second region has a second threading dislocation density, and the first threading dislocation density is greater than the second threading dislocation density. The first current controlling structure is joined with the first type semiconductor layer and has at least one first current-injecting zone therein, in which the vertical projection of the second region on the first current controlling structure at least partially overlaps with the first current-injecting zone. The first electrode is electrically coupled with the first type semiconductor layer.