Patents by Inventor Chun Yu
Chun Yu has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Publication number: 20240304741Abstract: A cell module is provided. The cell module includes a first substrate; a second substrate disposed opposite to the first substrate; a cell unit disposed between the first substrate and the second substrate; a first thermosetting resin layer disposed between the cell unit and the first substrate; a first protective layer disposed between the cell unit and the first thermosetting resin layer; and a second thermosetting resin layer disposed between the cell unit and the second substrate. The first protective layer includes a first polymer, wherein the cross-linking degree of the first polymer is 0 to 42.3%.Type: ApplicationFiled: November 30, 2023Publication date: September 12, 2024Applicant: INDUSTRIAL TECHNOLOGY RESEARCH INSTITUTEInventors: Chiou-Chu LAI, Chun-Wei SU, Yi-Chun LIU, Hsin-Hsin HSIEH, Hsin-Chung WU, En-Yu PAN, Chin-Ping HUANG
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Publication number: 20240303408Abstract: The application discloses a method and a system for shaping flexible blocks on a chip canvas in an integrated circuit design. An input is received describing geometric features of flexible blocks. A set of flexible blocks are generated based on the input. Obtained block areas of the set of flexible blocks are computed. Whether the set of flexible blocks are legal is determined based on determining whether area differences between the obtained block areas and a plurality of required areas for the set of flexible blocks meet a requirement. The set of flexible blocks are updated until the set of flexible blocks are all legal.Type: ApplicationFiled: March 7, 2024Publication date: September 12, 2024Inventors: Kun-Yu WANG, Sheng-Tai TSENG, Yi-Ying LIAO, Jen-Wei LEE, Ronald Kuo-Hua HO, Bo-Jiun HSU, Te-Wei CHEN, Chun-Chih YANG, Tai-Lai TUNG
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Publication number: 20240304521Abstract: A device includes: an active region extending in a first direction; a first metal-to-S/D (MD) contact structure extending in a perpendicular second direction, and over and coupled to the active region; a first layer of metallization over the first MD contact structure and having M_1st segments extending in the first direction and each having a substantially same width relative to the second direction, the M_1st segments including M_1st routing segments, and an M_1st power grid (PG) segment having a portion over and coupled to the first MD contact structure; a second layer of metallization over the first layer of metallization and having M_2nd segments that extend in the second direction and include an M_2nd PG rail configured for a first reference voltage, a portion thereof being over and coupled to the M_1st PG segment. the M_2nd PG rail extending across multiple cell regions.Type: ApplicationFiled: September 12, 2023Publication date: September 12, 2024Inventors: Kuan Yu CHEN, Chun-Yen LIN, Wei-Cheng TZENG, Wei-Cheng LIN, Shih-Wei PENG, Jiann-Tyng TZENG
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Publication number: 20240305162Abstract: A damper device and an electronic apparatus are provided. The damper device includes a first holder, a first damper component and a first gel. The first damper component includes a first protrusion part and a first bar part. The first protrusion part includes a first surface. The first bar part includes a first free end and a first fixed end. The first protrusion part is fixed on the first free end, the first fixed end is fixed on the first holder and the first surface protrudes outward from the first free end. The first free end and the first protrusion part are inserted into the first gel, and the first gel moves along the radial direction of the first bar part relative to the first bar part.Type: ApplicationFiled: November 7, 2023Publication date: September 12, 2024Inventors: Chia-Ching HSU, Fu Yuan WU, Shang Yu HSU, Shao Chung CHANG, Meng Ting LIN, Chun Kai CHEN
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Publication number: 20240304685Abstract: A device includes a first transistor layer comprising a first gate electrode and a second transistor layer comprising a second gate electrode that is stacked with the first transistor layer. n intermetal structure comprising a conductive line is disposed between the first transistor layer and the second transistor layer. A first gate contact extends along a sidewall of the first gate electrode from a top surface of the first gate electrode to the conductive line 48G. A second gate contact extends along a sidewall of the second gate electrode from a top surface of the second gate electrode to the conductive line. The first gate electrode is electrically connected to the second gate electrode by the first gate contact, the second gate contact, and the conductive line.Type: ApplicationFiled: June 30, 2023Publication date: September 12, 2024Inventors: Yung-Chin Hou, Lee-Chung Lu, Jiann-Tyng Tzeng, Wei-Cheng Lin, Chun-Yen Lin, Ching-Yu Huang
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Patent number: 12089326Abstract: A double-sided flexible circuit board includes a flexible substrate, through circuit lines, first circuit lines and second circuit lines. The first circuit lines are formed on a top surface of the flexible substrate and each includes a first segment, a bent segment and a second segment. One end of the first segment is connected to a first connection end of one of the through circuit lines. Both ends of the bent segment are connected to the other end of the first segment and one end of the second segment, respectively. A second distance between the adjacent second segments is greater than a first distance between the adjacent first segments. The second circuit lines are formed on a bottom surface of the flexible substrate and each is connected to a second connection end of one of the through circuit lines.Type: GrantFiled: May 11, 2022Date of Patent: September 10, 2024Assignee: CHIPBOND TECHNOLOGY CORPORATIONInventors: Yin-Chen Lin, Hui-Yu Huang, Chih-Ming Peng, Chun-Te Lee
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Method for sharing a console variable setting of an application and the electronic device and system
Patent number: 12086390Abstract: A method for sharing a console variable setting of an application and the electronic device and system is provided. The sharing method includes: capturing a display frame of a first electronic device to obtain a set coding image by a second electronic device; transforming the set coding image into a meta file by the second electronic device, wherein the meta file comprises a set of setting parameters for a plurality of first setting options of a first application of the first electronic device; and setting a plurality of second setting options of a second application of the second electronic device as the set of setting parameters for the plurality of first setting options according to the meta file, wherein the second application is the same as the first application.Type: GrantFiled: November 5, 2023Date of Patent: September 10, 2024Assignee: GETAC TECHNOLOGY CORPORATIONInventors: Chun-Yu Kuo, Da-Ke Liu, Shih-Hui Cheng -
Patent number: 12083284Abstract: A respiratory system includes a gas supply unit and a heating and humidifying unit. The gas supply unit includes a gas supply port; the heating and humidifying unit is detachably combined with the gas supply unit. The heating and humidifying unit includes a base, an adapter and a water tank. The base includes a control element, and the adapter is combined with the base and can rotate at least 90 degrees relative to the base. The water tank is detachably combined with the base, and the water tank includes a gas inlet and a gas outlet, wherein when the water tank is combined with the base, the gas inlet penetrates through an aperture of the base to be fluidly connected to the gas supply port, and the gas outlet is fluidly connected to the adapter.Type: GrantFiled: September 25, 2020Date of Patent: September 10, 2024Assignee: APEX MEDICAL CORP.Inventors: Chun-Yen Lin, Chung-Yi Lin, Jhih-Teng Yao, Chih-Tsan Chien, Tsung-Chung Kan, Hao-Yu Chan
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Patent number: 12084766Abstract: In an embodiment, an apparatus includes: a susceptor including substrate pockets; a gas injector disposed over the susceptor, the gas injector having first process regions, the gas injector including a first gas mixing hub and first distribution valves connecting the first gas mixing hub to the first process regions; and a controller connected to the gas injector and the susceptor, the controller being configured to: connect a first precursor material and a carrier gas to the first gas mixing hub; mix the first precursor material and the carrier gas in the first gas mixing hub to produce a first precursor gas; rotate the susceptor to rotate a first substrate disposed in one of the substrate pockets; and while rotating the susceptor, control the first distribution valves to sequentially introduce the first precursor gas at each of the first process regions as the first substrate enters each first process region.Type: GrantFiled: May 20, 2019Date of Patent: September 10, 2024Assignee: TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.Inventors: Yung-Chang Chang, Meng-Yin Tsai, Tung-Hsiung Liu, Liang-Yu Yeh, Chun-Yi Lee, Kuo-Hsi Huang
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Patent number: 12086385Abstract: A scanning method for multiple barcodes is applied in an electronic device. The electronic device loads a tag template, and the tag template has a plurality of detection zones each corresponding to a target barcode and a target barcode type. The electronic device captures a tag image with a plurality of barcode patterns to be detected, and each barcode pattern to be detected has coordinate information on an image coordinate system. The electronic device overlays the tag image with the tag template to determine whether each barcode pattern to be detected is located in one of the detection zones. When the barcode pattern to be detected is located in one of the detection zones and matches the corresponding target barcode type, the electronic device reads the barcode pattern to be detected to obtain a read result.Type: GrantFiled: March 3, 2023Date of Patent: September 10, 2024Assignee: GETAC TECHNOLOGY CORPORATIONInventors: Chun-Yu Kuo, Da-Ke Liu
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Patent number: 12087690Abstract: An integrated circuit includes a cell that is between a substrate and a supply conductive line and that includes a source region, a contact conductive line, a power conductive line, and a power via. The contact conductive line extends from the source region. The power conductive line is coupled to the contact conductive line. The power via interconnects the supply conductive line and the power conductive line.Type: GrantFiled: July 29, 2022Date of Patent: September 10, 2024Assignee: Taiwan Semiconductor Manufacturing Company LimitedInventors: Sheng-Hsiung Chen, Chung-Hsing Wang, Fong-yuan Chang, Lee-Chung Lu, Li-Chun Tien, Po-Hsiang Huang, Shao-huan Wang, Ting Yu Chen, Yen-Pin Chen, Chun-Chen Chen, Tzu-Hen Lin, Tai-Yu Cheng
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Publication number: 20240294913Abstract: Provided herein are methods for the treatment of polycystic kidney disease, including autosomal dominant polycystic kidney disease, using modified oligonucleotides targeted to miR-17.Type: ApplicationFiled: March 20, 2024Publication date: September 5, 2024Applicant: Regulus Therapeutics Inc.Inventors: Denis Drygin, Garth A. Kinberger, Edmund Chun Yu Lee
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Publication number: 20240295825Abstract: In an embodiment, a method includes: heating a byproduct transport ring of an extreme ultraviolet source, the byproduct transport ring disposed beneath vanes of the extreme ultraviolet source; after heating the byproduct transport ring for a first duration, heating the vanes; after heating the vanes, cooling the vanes; and after cooling the vanes for a second duration, cooling the byproduct transport ring.Type: ApplicationFiled: May 10, 2024Publication date: September 5, 2024Inventors: Wei-Chun Yen, Chi Yang, Sheng-Kang Yu, Shang-Chieh Chien, Li-Jui Chen, Heng-Hsin Liu
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Publication number: 20240295659Abstract: The disclosure provides a method, a device, an apparatus, and a storage medium for identifying a type of atmospheric aerosol. The method includes: determining a depolarization ratio and an aerosol extinction coefficient of an atmospheric area to be identified according to a lidar signal and a relative humidity profile of the area; identifying a cloud type of the area according to the signal and the profile; and identifying a type of an atmospheric aerosol in the area based on the cloud type, the ratio and the coefficient. Relevant values are calculated based on lidar signals and the profile, clouds are identified first, and then different types of aerosols are further distinguished in combination with the relevant values, and a numerical determination standard is given to synchronously identify different types of aerosols including types of cloud, fog and other particulates in the atmosphere, thereby improving accuracy of identification.Type: ApplicationFiled: January 9, 2024Publication date: September 5, 2024Inventors: Zhuang WANG, Hao ZHANG, Chun'e SHI, Caixia YU, Jing ZHAI, Guanying YANG
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Publication number: 20240296299Abstract: A barcode image recognition method includes the following steps: capturing at least one barcode to generate a preview image, the preview image having at least one barcode image of the at least one barcode; decoding the barcode image to obtain barcode information and a plurality of vertex coordinates of the barcode image; caching the barcode information of the barcode image; forming a plurality of image boundaries of the barcode image with the plurality of vertex coordinates of the barcode image; generating a detection beeline from a specified point to a side edge of the preview image; determining the number of intersections of the plurality of image boundaries of the barcode image and the detection beeline; identifying the barcode image with odd number of intersections from the at least one barcode image as a target image; and outputting the barcode information of the target image.Type: ApplicationFiled: July 3, 2023Publication date: September 5, 2024Inventors: Chun-Yu Kuo, Da-Ke Liu
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Patent number: 12074193Abstract: A semiconductor device structure is provided. The semiconductor device structure includes a substrate and a magnetic element over the substrate. The semiconductor device structure also includes an isolation layer extending exceeding edges the magnetic element. The isolation layer contains a polymer material. The semiconductor device structure further includes a conductive line over the isolation layer and extending exceeding the edges of the magnetic element.Type: GrantFiled: March 30, 2023Date of Patent: August 27, 2024Assignee: Taiwan Semiconductor Manufacturing Company, Ltd.Inventors: Chi-Cheng Chen, Wei-Li Huang, Chun-Yi Wu, Kuang-Yi Wu, Hon-Lin Huang, Chih-Hung Su, Chin-Yu Ku, Chen-Shien Chen
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Patent number: 12074103Abstract: A circuit assembly includes an integrated circuit (IC) die and a capacitor die. The IC die has a first hybrid bonding layer. The capacitor die is stacked with the IC die, and is configured to include a capacitor coupled to the IC die, and has a second hybrid bonding layer in contact with the first hybrid bonding layer; wherein the IC die is electrically coupled to the capacitor die through the first hybrid bonding layer and the second hybrid bonding layer.Type: GrantFiled: June 1, 2022Date of Patent: August 27, 2024Assignee: AP Memory Technology Corp.Inventors: Wenliang Chen, Jun Gu, Masaru Haraguchi, Takashi Kubo, Chien-An Yu, Chun Yi Lin
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Patent number: 12074041Abstract: The present disclosure describes an apparatus for processing one or more objects. The apparatus includes a carrier configured to hold the one or more objects, a tank filled with a processing agent and configured to receive the carrier, and a spinning portion configured to contact the one or more objects and to spin the one or more objects to disturb a flow field of the processing agent.Type: GrantFiled: May 15, 2019Date of Patent: August 27, 2024Assignee: Taiwan Semiconductor Manufacturing Co., Ltd.Inventors: Chung-Yu Lin, Shih-Chi Kuo, Chun-Chieh Mo
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Patent number: 12075599Abstract: An electronic apparatus includes at least one heat generating component and an immersion cooling system. The immersion cooling system includes a main tank and a liquid amount adjusting module. The main tank is adapted to contain a heat dissipation medium, and the heat generating component is disposed in the main tank to be immersed in the heat dissipation medium. The liquid adjusting module includes an auxiliary tank and a pump. The auxiliary tank is adjacent to the main tank, and the heat dissipation medium in the main tank is adapted to be overflowed into the auxiliary tank. The pump is disposed in the auxiliary tank and adapted to drive the heat dissipation medium in the auxiliary tank to flow into the main tank.Type: GrantFiled: April 9, 2021Date of Patent: August 27, 2024Assignee: Wiwynn CorporationInventors: Chun-Wei Lin, Ting-Yu Pai, Pai-Chieh Huang, Chin-Han Chan, Hsien-Chieh Hsieh
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Publication number: 20240282843Abstract: A method for fabricating semiconductor device includes the steps of: forming a fin-shaped structure on a substrate; forming a gate dielectric layer on the fin-shaped structure; forming a gate electrode on the fin-shaped structure; performing a nitridation process to implant ions into the gate dielectric layer adjacent to two sides of the gate electrode; and forming an epitaxial layer adjacent to two sides of the gate electrode.Type: ApplicationFiled: May 2, 2024Publication date: August 22, 2024Applicant: UNITED MICROELECTRONICS CORP.Inventors: Chung-Fu Chang, Kuan-Hung Chen, Guang-Yu Lo, Chun-Chia Chen, Chun-Tsen Lu