Abstract: An inflatable product includes an inflatable body and a tensioning structure disposed in and connected to the inflatable body, for controlling expansion of the inflatable body when the inflatable body is inflated. The tensioning structure comprises a plastic portion connected to the inflatable body by fusion or gluing, and a fabric portion connected to the plastic portion by sewing or gluing.

Abstract: An inflatable watercraft includes an upper wall, a lower wall connected to the upper wall so as to form a bottom main body, an inner wall extended longitudinally, and an outer wall also extended longitudinally. The inner wall, the outer wall and the upper wall are connected to form a tubular body around the bottom main body. Alternatively, the inner wall, the outer wall and the lower wall are connected to form a tubular body around the bottom main body. When deflated, the tubular body collapses due to gravity so that the outer wall is superposed on the inner wall.

Abstract: An inflatable product includes an inflatable body and a supplemental sheet. The supplemental sheet is connected to the inflatable body to form a space. When the inflatable body is inflated, the inflatable body is expanded due to increased air pressure therein and the space becomes reduced in size. Accordingly, when a portion of a sheet or a cover is put in the space and the inflatable body is inflated to reduce the space in size, the portion of the sheet or the cover is held by the supplemental sheet and the inflatable body.

Abstract: An inflatable recliner includes an inflatable body and a side portion disposed beside the inflatable body. The inflatable body includes a backrest portion, and a buttock-and-leg support portion connected to the backrest portion. The side portion is extended backward and beyond where the backrest portion and the buttock-and-leg support portion are connected, thereby providing the inflatable body with a supporting force that prevents the inflatable recliner from being overturned.

Abstract: A floating device and a method of keeping a floating device in position in water are provided. The floating device includes a main body and a projecting portion. The main body is configured to float on water. The projecting portion extends from the main body into the water to surround a part of water for keeping the main body in position.

Abstract: An inflatable product and a method of manufacturing the inflatable product are provided. The inflatable product includes an inflatable pad body and an inflatable backrest body. The inflatable pad body includes a top wall, a bottom wall disposed opposite to the top wall, and a side wall connecting the top wall and the bottom wall. The inflatable backrest body includes a front wall and a back wall connected to the front wall. The front wall adjoins the top wall. The back wall adjoins the side wall.

Abstract: In a method of manufacturing a semiconductor device, a mask pattern is formed over a target layer to be etched, and the target layer is etched by using the mask pattern as an etching mask. The etching is performed by using an electron cyclotron resonance (ECR) plasma etching apparatus, the ECR plasma etching apparatus includes one or more coils, and a plasma condition of the ECR plasma etching is changed during the etching the target layer by changing an input current to the one or more coils.

Abstract: A light-emitting device is provided. The light-emitting device includes a circuit board and a connection board disposed on the circuit board and having a first pad, a second pad, and a third pad. The light-emitting device also includes a first light-emitting element disposed on the connection board and having a first electrode and a second electrode and a second light-emitting element adjacent to the first light-emitting element and having a third electrode and a fourth electrode. The light-emitting device further includes a light-converting layer disposed on the first light-emitting element and the second light-emitting element. The thermal expansion coefficient of the connection board is smaller than the thermal expansion coefficient of the circuit board.

Abstract: A multifunctional cooling and supporting apparatus for a tablet electronic device comprises a protective case including an upper cover and a lower cover assembled to the upper cover; a hollow space formed between the upper cover and the lower cover; the hollow space serving to accommodate the tablet electronic device; the upper cover having an upper opening; the protective case having a waterproof structure which seals the hollow space and prevents external liquid from penetrating the hollow space; and wherein the upper cover is installed with a heat conducting plate which closes and seals the upper opening of the upper cover; the heat conducting plate has a thermal conductive structure; an outer side of the heat conducting plate is exposed from the upper opening; an inner side of the heat conducting plate serves to contact a back end of the tablet electronic device.

Abstract: An anti-loss rope includes a noose unit, for encircling the first target object, the noose unit including: a flexible sleeve including a tube portion which includes two end portions located on two ends of a lengthwise extension direction of the tube portion and a through hole located inside the tube portion and extending along the lengthwise extension direction of the tube portion; an elastic line, accommodated in the through hole and having an exposed section of the two end portions extending from the through hole, wherein the flexible sleeve is rollable around the elastic line, and the flexible sleeve and the exposed section enclose to form an accommodating space for accommodating the first target object; a longitudinal connecting line, one end of the connecting line for connecting with the noose unit and one other end of the connecting line for connecting with the second target object.

Abstract: A method includes forming a first fin and a second fin over a substrate. The method includes forming a first dummy gate structure that straddles the first fin and the second fin. The first dummy gate structure includes a first dummy gate dielectric and a first dummy gate disposed over the first dummy gate dielectric. The method includes replacing a portion of the first dummy gate with a gate isolation structure. The portion of the first dummy gate is disposed over the second fin. The method includes removing the first dummy gate. The method includes removing a first portion of the first dummy gate dielectric around the first fin, while leaving a second portion of the first dummy gate dielectric around the second fin intact. The method includes forming a gate feature straddling the first fin and the second fin, wherein the gate isolation structure intersects the gate feature.

Abstract: A lead frame substrate includes a circuitry layer, terminals, a warpage inhibiting dielectric layer and a stiffening dielectric layer. The circuitry layer extends laterally from the terminals and has an external surface facing away from the stiffening dielectric layer and an inner surface facing in and spaced from a top surface of the stiffening dielectric layer by the warpage inhibiting dielectric layer. The stiffening dielectric layer can serve as a robust platform to support the lateral extension of a circuitry layer and avoid crack propagation through the stiffening dielectric layer into the circuitry layer. The warpage inhibiting dielectric layer can absorb stress and alleviate warpage of the structure during bonding the stiffening dielectric layer to a lead frame with the terminals.

Abstract: A method of manufacturing a capacitor structure includes the following. A first, second, third, fourth, fifth, sixth and seventh portions of a contact layer arrange from periphery to center. A first-conductive layer contacting the first portion forms in an opening. A first-dielectric layer contacting the second portion forms on the first-conductive layer. A second-conductive layer forms on the first-dielectric layer. A second-dielectric layer contacting the third portion forms on the second-conductive layer. A third-conductive layer contacting the fourth portion forms on the second-dielectric layer. A third-dielectric layer contacting the fifth portion forms on the third-conductive layer. A fourth-conductive layer contacting the second-conductive layer forms on the third-dielectric layer. A fourth-dielectric layer contacting the sixth portion forms on the fourth-conductive layer. A fifth-conductive layer contacting the seventh portion forms on the fourth-dielectric layer.

Abstract: An image generation method obtains an original image. A character area, a background area, and a position of each flawless character in the original image are determined. The character area is segmented to obtain a first image of each flawless character. A background is removed from the first image to obtain a second image. First image processing is performed on the second image to obtain a third image. Second image processing is performed on the second image to obtain fourth images. Third image processing is performed on the fourth images respectively to obtain fifth images. A similarity between each fifth image and the third image is calculated. When the similarity is greater than a defect threshold, a background image is segmented. Brightness of the background image is adjusted. The target fourth image and adjusted background image are synthesized. The method can generate images with defective characters quickly.

Abstract: An inflatable product includes an inflatable body and a supplemental layer. The inflatable body includes a first wall and a first auxiliary sheet fused with each other. The supplemental layer is configured to cover the first wall and is fixed to the first auxiliary sheet of the inflatable body by sewing and/or gluing.

Abstract: A semiconductor device includes a plurality of fins on a substrate, a fin end spacer plug on an end surface of each of the plurality of fins and a fin liner layer, an insulating layer on the plurality of fins, and a source/drain epitaxial layer in a source/drain recess in each of the plurality of fins.

Abstract: A method for preparing a semiconductor device includes providing an integrated circuit die having a bond pad. The bond pad includes aluminum (Al). The method also includes etching a top portion of the bond pad to form a recess, and bonding a wire bond to the recess in the bond pad. The wire bond includes copper (Cu).

Abstract: A device includes a substrate, a first fin, a second fin, a first isolation structure, a second isolation structure, and a gate structure. The first fin extends from a p-type region of the substrate. The second fin extends from an n-type region of the substrate. The first isolation structure is over the p-type region and adjacent to the first fin. The first isolation structure has a bottom surface and opposite first and second sidewalls connected to the bottom surface, a first round corner is between the bottom surface and the first sidewall of the first isolation structure, and the first sidewall is substantially parallel to the second sidewall. The second isolation structure is over the n-type region and adjacent to the first fin. The first isolation structure is deeper than the second isolation structure. The gate structure is over the first isolation structure and covering the first fin.

Abstract: An inflatable product includes an inflatable chamber and an elongated element. The inflatable chamber includes fusion portions. The elongated element is flexible, is disposed in the inflatable chamber, includes enlarged portions, and is connected to the inflatable chamber with the enlarged portions constrained by the fusion portions. The elongated element is in tension for controlling expansion of the inflatable chamber to a desired shape when the inflatable chamber is inflated to expand. The enlarged portions are constrained by the fusion portions to avoid separation of the elongated element from the inflatable chamber when the inflatable chamber is inflated to expand.

Abstract: A medical image analyzing system and a medical image analyzing method are provided and include inputting at least one patient image into a first model of a neural network module to obtain a result having determined positions and ranges of an organ and a tumor of the patient image; inputting the result into a second model of a first analysis module and a third model of a second analysis module, respectively, to obtain at least one first prediction value and at least one second prediction value corresponding to the patient image; and outputting a determined result based on the first prediction value and the second prediction value. Further, processes between the first model, the second model and the third model can be automated, thereby improving identification rate of pancreatic cancer.