Abstract: An optical lens assembly includes a stop and includes, in order from an object side to an image side: a first lens, a second lens, a third lens, a fourth lens and a fifth lens. A focal length of the second lens is f2, a focal length of the third lens is f3, a focal length of the fourth lens is f4, a curvature radius of the object-side surface of the third lens is R5, a curvature radius of the object-side surface of the fourth lens is R7, a distance from the object-side surface of the first lens to the image plane along the optical axis is TL, and the following conditions are satisfied: 50.7<f3*R7/TL<378.7 and ?1375.8<(f2/f4)*R5<?21.

Abstract: A power supply system includes an output terminal, a power supply control chip, a power supply switch and a detection device. The power supply control chip is configured to adjust the amount of an input power providing to an electronic device by the power supply device. The power supply switch is configured to control the connection between the power supply device and the power supply control chip. The detection device is configured to detect whether the power supply control chip operates normally. When the power supply control chip operates abnormally, the detection device controls the connection between the power supply device and the power supply control chip through the power supply switch for restarting the power supply control chip. The power supply control chip, the power supply switch and the detection device are disposed in an enclosed space.

Abstract: The present application provides a temperature control method, an apparatus, an electronic device and a storage medium for an etching workbench. A real-time temperature of an etching workbench and a real-time temperature of a temperature control fluid are acquired firstly; then, a temperature control instruction is determined according to the real-time temperature of the etching workbench, the real-time temperature of the temperature control fluid and a limit temperature; and finally, in response to the temperature control instruction, a target operating temperature of the etching workbench is stabilized within a preset range by a circulating temperature control fluid loop.

Abstract: A method for preparing a semiconductor device includes providing an integrated circuit die having a bond pad. The bond pad includes aluminum (Al). The method also includes etching a top portion of the bond pad to form a recess, and bonding a wire bond to the recess in the bond pad. The wire bond includes copper (Cu).

Abstract: A semiconductor assembly includes a top substrate and a base substrate attached to top and bottom electrode layers of a semiconductor device, respectively. The top substrate includes an electrode connection plate thermally conductible with and electrically connected to the top electrode layer of the semiconductor device and vertical posts protruding from the electrode connection plate and electrically connected to the base substrate. The base substrate includes an electrode connection slug embedded in a dielectric layer and thermally conductible with and electrically connected to the bottom electrode layer of the semiconductor device and first and second routing circuitries deposited on two opposite surfaces of the dielectric layer, respectively, and electrically connected to each other.

Abstract: An integrated control management system includes an input output device. The input output device includes a database, a memory module, a first processing module, and a second processing module. The memory module receives and stores a plurality of integrated control commands, and one of the integrated control commands is generated based on a hardware control command for setting a hardware control transmitted by another input and output device. The first processing module reads the integrated control command from the memory module and obtains the hardware control data from the integrated control command. The first processing module updates the hardware control data to the database. The second processing module reads the database and updates the hardware control data stored in the database to another database in another input output device. The second processing module sets the hardware control based on the hardware control data stored in the database.

Abstract: Welding electrodes, methods, and vehicles are provided. The welding electrodes include a body that includes a weld face on a distal end of the body configured to contact a workpiece and apply an electrical current thereto. The body has a maximum diameter of 13 millimeters or less. The welding electrode includes an insulative material covering at least a portion of the body, the insulative material configured to mitigate current shunting upon contact between the insulative material and a workpiece of a workpiece stack-up while using the welding electrode to resistance weld the workpiece stack-up.

Abstract: The present disclosure provides a wafer testing method, including: assigning multiple testing programs to multiple wafers, wherein each of the testing programs includes testing algorithms configured to measure parameters of the wafers; setting multiple sets of testing conditions for the testing programs; and testing at least one of the wafers by executing a corresponding one of the testing programs according to a corresponding one of the testing conditions.

Abstract: In some embodiments, a method for forming an integrated chip (IC) is provided. The method incudes forming an interlayer dielectric (ILD) layer over a substrate. A first opening is formed in the ILD layer and in a first region of the IC. A second opening is formed in the ILD layer and in a second region of the IC. A first high-k dielectric layer is formed lining both the first and second openings. A second dielectric layer is formed on the first high-k dielectric layer and lining the first high-k dielectric layer in both the first and second regions. The second high-k dielectric layer is removed from the first region. A conductive layer is formed over both the first and second high-k dielectric layers, where the conductive layer contacts the first high-k dielectric layer in the first region and contacts the second high-k dielectric in the second region.

Abstract: A method for preparing a semiconductor device includes providing an integrated circuit die having a bond pad. The bond pad includes aluminum (Al). The method also includes etching a top portion of the bond pad to form a recess, and bonding a wire bond to the recess in the bond pad. The wire bond includes copper (Cu).

Abstract: An optical detection device includes a substrate, a housing, an optical modulating component, an optical sensor and a cover. The housing is disposed on the substrate and includes a first aperture. The housing is unvaried due to inspection standard or design requirement of the optical detection device. The optical modulating component is disposed on the housing and aligning with the first aperture. The optical sensor is disposed on the substrate and adapted to receive an optical signal passing through the optical modulating component and the first aperture. The cover is disposed on the housing to cover the first aperture. The cover is replaceable for attaching the cover varied for the inspection standard or the design requirement to the unvaried housing in response to a surface of the cover opposite to the housing matched and engaged with a light penetrating area on the optical navigation apparatus.

Abstract: Provided are a system and a method for cardiovascular risk prediction, where artificial intelligence is utilized to perform segmentation on non-contrast or contrast medical images to identify precise regions of the heart, pericardium, and aorta of a subject, such that the adipose tissue volume and calcium score can be derived from the medical images to assist in cardiovascular risk prediction. Also provided is a computer readable medium for storing a computer executable code to implement the method.

Abstract: The present system combines, on a host server, clinician software for accessing a case history database of past results/feedback from users seeking stimulation therapy, other users within a member network and other users outside the member network and pharmacy software for generating, in the form of a database, an expert system/artificial intelligence program and signal processing software, stimulation waveforms required by the users according to prescriptions from clinicians (completed by clinical experts/server knowledge software) and/or pain points indicated by the users, wherein an innovative open terminal data format and file format and an innovative high-efficiency frequency band waveform compression technique are used.

Abstract: A boot method for an embedded system is provided. The embedded system includes two mainboards each provided with a baseboard management controller (BMC), a non-volatile memory unit and a network adapter. When the embedded system is turned on, each of the BMCs performs a boot procedure, and then loads an operating system (OS) image file from a corresponding non-volatile memory unit to execute an operating system. When one BMC fails to load the OS image file or to execute the operating system, the BMC causes the corresponding network adapter to communicate with the other network adapter to acquire the OS image file from the non-volatile memory unit on the other mainboard, so as to replace the OS image file in the corresponding non-volatile memory unit, and directly loads the OS image thus acquired to execute the operating system.

Abstract: A MEMS microphone package is provided. The MEMS microphone package includes a substrate and a circuit device, the substrate has a conductive structure, and the circuit device has through silicon via structures that are electrically connected to the conductive structure. The MEMS microphone package also includes a sensor disposed on the substrate and having a connecting structure disposed on the bottom of the sensor. The connecting structure is electrically connected to the substrate and the circuit device. The MEMS microphone package further includes a cap covering the circuit device and the sensor and separated from the circuit device and the sensor.

Abstract: The current disclosure describes techniques for forming a low resistance junction between a source/drain region and a nanowire channel region in a gate-all-around FET device. A semiconductor structure includes a substrate, multiple separate semiconductor nanowire strips vertically stacked over the substrate, a semiconductor epitaxy region adjacent to and laterally contacting each of the multiple separate semiconductor nanowire strips, a gate structure at least partially over the multiple separate semiconductor nanowire strips, and a dielectric structure laterally positioned between the semiconductor epitaxy region and the gate structure. The first dielectric structure has a hat-shaped profile.

Abstract: A pressure detection device of detecting a forced state of a deformable object includes a body, an image sensor and a processor. The body is a deformable hollow structure. The body has an inner surface and an outer surface, and an identifiable vision feature is disposed on the inner surface. The image sensor is disposed inside the body and faces the inner surface of the body, and is adapted to capture a frame containing the identifiable vision feature on the inner surface. The processor is electrically connected with the image sensor, and adapted to analyze position variation of the identifiable vision feature within the captured frame for identifying a motion type of a gesture applied to the outer surface of the body.

Abstract: A fastening assembly includes a panel defining an aperture, a fastener having a head, a shaft portion extending from the head, and a recess formed in the head, and a sacrificial primary anode insert disposed in the recess. The sacrificial primary anode insert is configured to corrode at a rate faster than a corrosion rate of the fastener.