Abstract: A method comprises positioning a receiver in a borehole and determining an offset acoustic waveform at a target point. The method includes generating a reverse time sequence waveform of the determined offset acoustic waveform and generating, by a transmitter, an acoustic pulse based on the reverse time sequence waveform. The method includes detecting, by the receiver, an acoustic response to the acoustic pulse.

Abstract: A method and a system for recording an integrated circuit version are provided. The method is adapted to a register in an integrated circuit, which includes the following steps: recording the integrated circuit version with N bits, in which N is an integer greater than 1; and amending only a bit value of at least one bit selected from the N bits that have not been used for denoting any past integrated circuit version each time when the integrated circuit is revised.

Abstract: A semiconductor structure includes: a channel layer; an active layer over the channel layer, wherein the active layer is configured to form a two-dimensional electron gas (2DEG) to be formed in the channel layer along an interface between the channel layer and the active layer; a gate electrode over a top surface of the active layer; and a source/drain electrode over the top surface of the active layer; wherein the active layer includes a first layer and a second layer sequentially disposed therein from the top surface to a bottom surface of the active layer, and the first layer possesses a higher aluminum (Al) atom concentration compared to the second layer. An HEMT structure and an associated method are also disclosed.

Abstract: The present disclosure relates an integrated chip. The integrated chip includes an isolation region disposed within a substrate and surrounding an active area. A gate structure is disposed over the substrate and has a base region and a gate extension finger protruding outward from a sidewall of the base region along a first direction to past opposing sides of the active area. A source contact is disposed within the active area and a drain contact is disposed within the active area and is separated from the source contact by the gate extension finger. A first plurality of conductive contacts are arranged on the gate structure and separated along the first direction. The first plurality of conductive contacts are separated by distances overlying the gate extension finger.

Abstract: A semiconductor device includes a substrate, a plurality of insulators, a liner structure and a gate stack. The substrate has fins and trenches in between the fins. The insulators are disposed within the trenches of the substrate. The liner structure is disposed on the plurality of insulators and across the fins, wherein the liner structure comprises sidewall portions and a cap portion, the sidewall portions is covering sidewalls of the fins, the cap portion is covering a top surface of the fins and joined with the sidewall portions, and a maximum thickness T1 of the cap portion is greater than a thickness T2 of the sidewall portions. The gate stack is disposed on the liner structure and across the fins.

Abstract: A power monitor includes a detecting circuit, a processing circuit, and a warning circuit. The detecting circuit detects a first abnormal condition of a primary side circuit and a second abnormal condition of a secondary side circuit. The processing circuit calculates a first class and a first occurring number of the first abnormal condition, and calculates a second class and a second occurring number of the second abnormal condition. The processing circuit determines whether the first occurring number is larger than a first predetermined number corresponding to the first class; if it is, the processing circuit outputs a first abnormal signal. The processing circuit determines whether the second occurring number is larger than a second predetermined number corresponding to the second class; if it is, the processing circuit outputs a second abnormal signal. The warning circuit outputs a warning signal according to the first or the second abnormal signal.

Abstract: A method for manufacturing an operation rod of a wrench assembly for disassembling a fan clutch, including following steps of: preparing a rod material; fixing the rod material on a forging mold; carrying out a forging process to produce a semi-finished head; carrying out a cutout process, cutting the remainder structure out of the semi-finished head; obtaining a finished product of a head portion, the head portion including two wing plates and a shaft which are integrally formed.

Abstract: An optical element driving mechanism is provided and includes a fixed assembly, a movable assembly, a driving assembly and a circuit assembly. The movable assembly is configured to connect an optical element, the movable assembly is movable relative to the fixed assembly, and the optical element has an optical axis. The driving assembly is configured to drive the movable assembly to move relative to the fixed assembly. The circuit assembly includes a plurality of circuits and is affixed to the fixed assembly.

Abstract: Semiconductor structures and methods of forming the same are provided. A method according to the present disclosure includes forming a stack of epitaxial layers over a substrate, forming a first fin-like structure and a second fin-like structure from the stack, forming an isolation feature between the first fin-like structure and the second fin-like structure, forming a cladding layer over the first fin-like structure and the second fin-like structure, conformally depositing a first dielectric layer over the cladding layer, depositing a second dielectric layer over the first dielectric layer, planarizing the first dielectric layer and the second dielectric layer until the cladding layer are exposed, performing an etch process to etch the second dielectric layer to form a helmet recess, performing a trimming process to trim the first dielectric layer to widen the helmet recess, and depositing a helmet feature in the widened helmet recess.

Abstract: An acoustic transducer includes a substrate element having a first side, and a second side opposite the first side. The acoustic transducer also includes first and second piezoelectric elements coupled to the first side, and third and fourth piezoelectric elements coupled to the second side. The first piezoelectric element has a first polarity, and the second piezoelectric element has a second polarity different than the first polarity. The third piezoelectric element has a third polarity, and the fourth piezoelectric element has a fourth polarity different than the third polarity.

Abstract: An imaging system, including a light valve and a projection lens, is provided. The projection lens has a reduction side and a magnification side, and includes a lens group and a convex mirror. The light valve is configured on the reduction side. The projection lens is configured to image the beam from the light valve on a projection surface, and the projection surface is configured on the magnification side. There is an included angle between the projection surface and a light receiving surface. The lens group is configured on an optical path between the magnification side and the reduction side, and includes first to seventh lens elements sequentially arranged from the magnification side to the reduction side. The refractive powers of the first to seventh lens elements are respectively negative, negative, positive, positive, negative, positive, and positive. The convex mirror is configured on an optical path between the lens group and the magnification side.

Abstract: Semiconductor package includes substrate, first barrier layer, second barrier layer, routing via, first routing pattern, second routing pattern, semiconductor die. Substrate has through hole with tapered profile, wider at frontside surface than at backside surface of substrate. First barrier layer extends on backside surface. Second barrier layer extends along sidewalls of through hole and on frontside surface. Routing via fills through hole and is separated from sidewalls of through hole by at least second barrier layer. First routing pattern extends over first barrier layer on backside surface and over routing via. First routing pattern is electrically connected to end of routing via and has protrusion protruding towards end of routing via in correspondence of through hole. Second routing pattern extends over second barrier layer on frontside surface. Second routing pattern directly contacts another end of routing via. Semiconductor die is electrically connected to routing via by first routing pattern.

Abstract: A method includes forming a semiconductor substrate, forming hard mask layers (HMs) over the semiconductor substrate, forming first mandrels over the HMs, forming second mandrels along sidewalls of the first mandrels, forming a protective layer over the first mandrels and the second mandrels, removing a portion of the protective layer to expose portions of the first and the second mandrels, removing the exposed portions of the second mandrels with respect to the exposed portions of the first mandrels, removing remaining portions of the protective layer to expose remaining portions of the first and second mandrels, where the exposed portions of the first mandrels and the remaining portions of the first and second mandrels form a mandrel structure, patterning the HMs using the mandrel structure as an etching mask, and patterning the semiconductor substrate to form a fin structure using the patterned HMs as an etching mask.

Abstract: A portable information handling system pivots a hinge rotational axis as the hinge rotates housing portions between open and closed positions to manage a gap between the housing portions. For example, the hinge couples a base at a perimeter of one housing portion, the base having a many body that slides on sliding members of the base and that supports a bracket extending inward to couple to another housing portion. A bracket gear engages with a pinion gear included in the main body to translate bracket rotation through the pinion gear to a rack integrated in the base, thereby sliding the main body relative to the base as the housing portions rotate so that the distance between the housing portions adjusts with rotational orientation.

Abstract: A plastic thread bonding method and structure for folding edge of a FIBC includes setting the folding edge of the FIBC flatly on a metal solid surface; using a cooling device to maintain a condensation temperature of the solid surface; performing a needle insertion action of the folding edge by a plastic injection needle, and condensing and crystallizing at the eyelet to form a base point; performing a needle withdrawal action by the plastic injection needle to fill up a melted plastic into the eyelet, applying a pressurized cold air to condense the melted plastic to from a thread post; performing a horizontal translation action of the plastic injection needle or the folding edge, and applying the pressurized cold air to condense the melted plastic to form a thread bridge; and repeating the aforementioned procedure to form a next base point, a next thread post and a thread bridge.

Abstract: A semiconductor package includes a substrate, a composite seed-barrier layer, a routing via, and a semiconductor die. The substrate has a through hole formed therethrough. The composite seed-barrier layer extends on sidewalls of the through hole and includes a first barrier layer, a seed layer, and a second barrier layer sequentially stacked on the sidewalls of the through hole. The routing via fills the through hole and is separated from the substrate by the composite seed-barrier layer. The semiconductor die is electrically connected to the routing via. Along the sidewalls of the through holes, at a level height corresponding to half of a total thickness of the substrate, the seed layer is present as inclusions of seed material surrounded by barrier material of the first barrier layer and the second barrier layer.

Abstract: The disclosure provides an acoustic logging device comprising a first tubular member comprising a plurality of grooves disposed on an exterior of the first tubular member. The acoustic logging device further comprises a ring transmitter module disposed around an exterior of the first tubular member, which comprises a piezoelectric (PZT) ring transmitter, a transmitter sleeve, wherein the PZT ring transmitter is disposed within the transmitter sleeve, and a cage, wherein the transmitter sleeve is disposed between the cage and the exterior of the first tubular member, wherein the transmitter sleeve is disposed over the plurality of grooves. The acoustic logging device further comprises a plurality of dual bender transmitters, wherein there is a gap disposed the plurality of dual bender transmitters in the exterior of the first tubular member, wherein there is an array of holes connecting each of the gaps together and providing fluid communication between the gaps.

Abstract: A semiconductor device includes a pair of fin structures on a semiconductor substrate, each including a vertically stacked plurality of channel layers, a dielectric fin extending in parallel to and between the fin structures, and a gate structure on and extending perpendicularly to the fin structures, the gate structure engaging with the plurality of channel layers. The dielectric fin includes a fin bottom and a fin top over the fin bottom. The fin bottom has a top surface extending above a bottom surface of a topmost channel layer. The fin top includes a core and a shell, the core having a first dielectric material, the shell surrounding the core and having a second dielectric material different from the first dielectric material.

Abstract: A display panel and a spliced display are provided. The display panel includes a substrate, a plurality of light-emitting elements, a driving circuit, and an optical sensor. The substrate includes a through hole, and the through hole includes a hole. The plurality of the light-emitting elements are disposed on the substrate. The through hole is located in a region between two of the plurality of the light-emitting elements. The driving circuit is disposed on the substrate and electrically connected to the plurality of the light-emitting elements. The optical sensor is disposed corresponding to the through hole and receives sensing light through the hole. The width W of the hole meets the equation of H?W<D. H is the depth of the hole, and D is the distance between the two of the plurality of the light-emitting elements.

Abstract: An HMD apparatus includes an image source, a light guiding element, a first modulating element, and a second modulating element. The image source provides an image beam. The light guiding element is arranged on a transmission path of the image beam to transmit the image beam. The light guiding element has a first surface and a second surface opposite to each other. The image beam undergoes total internal reflection at the first surface and is emitted from the second surface. The first modulating element is arranged on one side of the first surface of the light guiding element and configured to adjust a transmittance of an ambient beam. The light guiding element is arranged between the first and second modulating elements, and the second modulating element is configured to adjust a focus position of the image beam. The HMD apparatus may improve wearing comfort and achieve good display effects.