Abstract: A charging load detection circuit includes a charging circuit, a frequency generation unit, and a control unit. The control unit controls the frequency generation unit to generate a pulse voltage with a fixed first frequency and a fixed first amplitude, and the frequency generation unit provides the pulse voltage to an output terminal of the charging circuit. The control unit detects whether a load is coupled to the output terminal by detecting whether the first frequency and the first amplitude are varied, and controls connecting or disconnecting a charging path of the charging circuit according to whether the load is coupled to the output terminal.

Abstract: An optical detection device is applied to an optical finger navigation apparatus and suitable for a variety of appearance demands in order to simplify product qualification procedure. The optical detection device includes a substrate, a housing, an optical sensor and a cover. The housing is disposed on the substrate and comprising a first aperture. The optical sensor is disposed on the substrate and adapted to receive an optical signal through the first aperture. The cover is disposed on the housing to cover the first aperture. The cover has a first surface and a second surface opposite to each other. The first surface with a contour matched with a shape of the housing is attached to the housing, and the second surface with a contour manufactured for a predefined appearance demand does not affect conjunction between the housing and the cover.

Abstract: The present application makes public a method of processing an etching apparatus, which includes a preprocess, repeatedly introducing plasma containing oxygen free radicals and hydrogen free radicals into a reaction chamber of the etching apparatus to remove vapors from the reaction chamber and Si—C bonds from surface of the reaction chamber; and an ashing process, placing a non-product wafer having photoresist at surface thereof into the reaction chamber, treating the photoresist with plasma containing oxygen free radicals to dissociate the photoresist, and removing Si—OH bonds from the surface of the reaction chamber, dissociated products being attachable onto the surface of the reaction chamber.

Abstract: An integrated control management system includes an input output device. The input output device includes a database, a memory module, a first processing module, and a second processing module. The memory module receives and stores a plurality of integrated control commands, and one of the integrated control commands is generated based on a hardware control command for setting a hardware control transmitted by another input and output device. The first processing module reads the integrated control command from the memory module and obtains the hardware control data from the integrated control command. The first processing module updates the hardware control data to the database. The second processing module reads the database and updates the hardware control data stored in the database to another database in another input output device. The second processing module sets the hardware control based on the hardware control data stored in the database.

Abstract: A semiconductor device includes a plurality of fins on a substrate, a fin end spacer plug on an end surface of each of the plurality of fins and a fin liner layer, an insulating layer on the plurality of fins, and a source/drain epitaxial layer in a source/drain recess in each of the plurality of fins.

Abstract: A medical image analyzing system and a medical image analyzing method are provided and include inputting at least one patient image into a first model of a neural network module to obtain a result having determined positions and ranges of an organ and a tumor of the patient image; inputting the result into a second model of a first analysis module and a third model of a second analysis module, respectively, to obtain at least one first prediction value and at least one second prediction value corresponding to the patient image; and outputting a determined result based on the first prediction value and the second prediction value. Further, processes between the first model, the second model and the third model can be automated, thereby improving identification rate of pancreatic cancer.

Abstract: A semiconductor device includes source and a drain above a substrate and spaced apart along a first direction, and a semiconductor channel extending between the source and the drain. The semiconductor device further includes gate spacers, an interfacial layer, and a metal gate structure. The gate spacers are disposed on the semiconductor channel and spaced apart by a spacer-to-spacer distance along the first direction. The interfacial layer is on the semiconductor channel. The interfacial layer extends a length along the first direction, and the length is less than a minimum of the spacer-to-spacer distance along the first direction. The metal gate structure is over the interfacial layer.

Abstract: A method includes forming a first fin and a second fin over a substrate. The method includes forming a first dummy gate structure that straddles the first fin and the second fin. The first dummy gate structure includes a first dummy gate dielectric and a first dummy gate disposed over the first dummy gate dielectric. The method includes replacing a portion of the first dummy gate with a gate isolation structure. The portion of the first dummy gate is disposed over the second fin. The method includes removing the first dummy gate. The method includes removing a first portion of the first dummy gate dielectric around the first fin, while leaving a second portion of the first dummy gate dielectric around the second fin intact. The method includes forming a gate feature straddling the first fin and the second fin, wherein the gate isolation structure intersects the gate feature.

Abstract: In a method of manufacturing a semiconductor device, a mask pattern is formed over a target layer to be etched, and the target layer is etched by using the mask pattern as an etching mask. The etching is performed by using an electron cyclotron resonance (ECR) plasma etching apparatus, the ECR plasma etching apparatus includes one or more coils, and a plasma condition of the ECR plasma etching is changed during the etching the target layer by changing an input current to the one or more coils.

Abstract: A disk-shaped fan impeller structure includes a plate body having an inner rim and an outer rim. The inner rim is connected with a hub via multiple connection members. The outer rim extends in a direction away from the hub. The connection members are annularly disposed on outer circumference of the hub at intervals to radially extend toward the inner rim of the plate body. A top face and a bottom face are defined between the inner rim and outer rim. Multiple upper boss bodies are arranged on the top face at intervals. Multiple first gaps are distributed between the upper boss bodies. By means of the boss bodies, the periodical noise problem of the conventional fan impeller can be improved.

Abstract: The present application provides a detaching and installing device for a gas distribution plate of an etching machine, and the etching machine, and relates to the field of semiconductor manufacturing technologies, aiming at addressing the problems that it is quite difficult to detach and install the gas distribution plate of the etching machine and that the gas distribution plate is highly likely to be polluted. The detaching and installing device for the gas distribution plate of the etching machine includes a gripping member, a connecting member and a fixing member, the fixing member is detachably connected to the gas distribution plate of the etching machine, and the gripping member and the fixing member are connected through the connecting member; the gripping member is provided thereon with a gripping portion for grip by a user hand.

Abstract: A method of forming a patterned hard mask includes: forming first photoresist features on a hard mask layer; forming at least one sacrificial feature between immediately-adjacent two of the first photoresist features on the hard mask layer; performing a trimming process to the first photoresist features to form second photoresist features; and using the at least one sacrificial feature and the second photoresist features as etching mask, and performing a first etching process to the hard mask layer, in which a plurality of trenches are formed in the hard mask layer to obtain the patterned hard mask.

Abstract: A method of resistance spot brazing a workpiece stack-up that includes a first thin-gauge steel workpiece and a second thin-gauge steel workpiece. The method includes several steps. A first step involves applying a filler material to a surface of the first thin-gauge steel workpiece. A second step involves bringing a surface of the second thin-gauge steel workpiece to adjoin the filler material. A third step involves clamping a first welding electrode and a second welding electrode on the first and second thin-gauge steel workpieces and over the filler material. A fourth step involves passing electrical current between the first and second welding electrodes and hence through the filler material. And a fifth step involves terminating passage of the electrical current in order to establish a brazed joint between the first and second thin-gauge steel workpieces.

Abstract: A medical image analyzing system and a medical image analyzing method are provided and include inputting at least one patient image into a first model of a first neural network module to obtain a result having determined positions and ranges of an organ and a tumor of the patient image; inputting the result into a plurality of second models of a second neural network module, respectively, to obtain a plurality of prediction values corresponding to each of the plurality of second models and a model number predicting having cancer in the plurality of prediction values; and outputting a determined result based on the model number predicting having cancer and a number threshold value. Further, processes between the first model and the second models can be automated, thereby improving identification rate of pancreatic cancer.

Abstract: A manufacturing method of a carbide includes steps as follows. A carbon source is provided, a contacting step, a heating step and an electrochemical step are performed. The carbon source includes an amorphous carbon and a compound. The compound is a chalcogen compound, a pnictide compound, a halide, a hydroxide or a salt of a metal or a metalloid. In the contacting step, the carbon source is disposed in an alkaline earth metal halide to form a reactant. In the heating step, the reactant is heated to form a heated reactant. In the electrochemical step, a current is applied to the heated reactant, wherein the current passes through the carbon source, so as to make the alkaline earth metal halide, the amorphous carbon and the compound react with one another to form a carbide of the metal or the metalloid.

Abstract: A manufacturing apparatus of carbide of the present disclosure includes a tank, a lid, a molten salt crucible, an electrode assembly, an air intake device and a heating device. The lid is connected to the tank to jointly delimit a compartment. The molten salt crucible is disposed in the compartment for containing a salt. The electrode assembly includes a working electrode and a counter electrode. An end of the working electrode and an end of the counter electrode both contact the salt in the molten salt crucible, and the end of the working electrode contacting the salt is for fixing a reactant tablet. The air intake device is configured to exchange the air in the compartment. The heating device is configured to heat the compartment.

Abstract: The leadframe substrate mainly includes a modulator, a plurality of metal leads, a resin layer and a crack inhibiting structure. The resin layer provides mechanical bonds between the modulator and the metal leads disposed about peripheral sidewalls of the modulator. The crack inhibiting structure includes a continuous interlocking fiber sheet that covers the modulator/resin interfaces, so that the segregation induced along the modulator/resin interfaces or cracks formed within the resin layer can be prevented or restrained from extending to the top surfaces, thereby ensuring the signal integrity of the flip chip assembly.

Abstract: A light emitting diode includes a first type semiconductor layer, an active layer, a second type semiconductor layer, a patterned electrode layer, a flat layer and a reflective layer. The active layer is disposed on the first type semiconductor layer. The second type semiconductor layer is disposed on the active layer. The second type semiconductor layer includes a first surface and a second surface having a first arithmetic mean roughness. The patterned electrode layer is disposed on the second surface of the second type semiconductor layer. The planarization layer is disposed on the second type semiconductor layer. The planarization layer includes a third surface and a fourth surface. The third surface is in contact with the second surface of the second type semiconductor layer. The fourth surface has a second arithmetic mean roughness that is less than the first arithmetic mean roughness.

Abstract: The present disclosure provides a testing fixture. The testing fixture includes a carrier, a plurality of sets of electrical lines and a plurality of electrical lines. The carrier includes a base and a frame extending along an upper surface of the base. The base and the frame define a first recess, a second recess extending longitudinally from the first recess, and a third recess extending transversely from the first recess. The plurality of sets of electrical contacts are disposed on the base and arranged in a rotationally symmetrical manner, and the electrical lines are electrically connected to the plurality of sets of electrical contacts.

Abstract: A semiconductor device includes a plurality of fins on a substrate, a fin end spacer plug on an end surface of each of the plurality of fins and a fin liner layer, an insulating layer on the plurality of fins, and a source/drain epitaxial layer in a source/drain recess in each of the plurality of fins.