Abstract: A method for touchless gesture recognition is provided. The method includes transmitting ultrasonic signals via a speaker. The method includes generating ultrasonic signals. The method includes receiving the reflected ultrasonic signals from an object via two or more microphones. The method includes computing a frequency shift according to the reflected ultrasonic signals. The method includes identifying a gesture that corresponds to a movement of the object according to the frequency shift. The method includes performing a function that corresponds to the gesture.

Abstract: There is provided a moving robot including a first light source module and a second light source module respectively project a first light section and a second light section, which are vertical light sections, in front of a moving direction, wherein the first light section and the second light section cross with each other at a predetermined distance in front of the moving robot so as to eliminate a detection dead zone between the first light source module and the second light source module in front of the moving robot to avoid collision with an object during operation.

Abstract: A semiconductor device and method of fabricating a semiconductor device involves formation of a trench above a fin (e.g. a fin of a FinFET device) of the semiconductor device and formation of a multi-layer dielectric structure within the trench. The profile of the multi-layer dielectric structure can be controlled depending on the application to reduce shadowing effects and reduce cut failure risk, among other possible benefits. The multi-layer dielectric structure can include two layers, three layers, or any number of layers and can have a stepped profile, a linear profile, or any other type of profile.

Abstract: A method for resistance welding at least three steel sheets, a weld structure produced by resistance welding at least three steel sheets and a method for determining weldability solutions when resistance welding at least three steel sheets in a stack are provided. By applying a layer of adhesive/sealer material between a thicker outer sheet of steel and an adjacent thicker inner sheet, thereby generating extra heat that increases penetration into a thinner outer sheet but with no layer of adhesive/sealer material between a thinner outer sheet and an adjacent thicker inner sheet, current density drop issues of a current process are addressed.

Abstract: Methods and systems for joining multiple workpieces are provided. In one example, the method includes dispensing adhesive on a first workpiece. A second workpiece is contacted with the adhesive such that the adhesive is disposed between the first and second workpieces. Resistance heating is produced in the first and second workpieces at first processing conditions to partially cure the adhesive and affix the first and second workpieces together to form a partially cured, adhesive-joined workpiece assembly. The partially cured, adhesive-joined workpiece assembly is exposed to heat at second processing conditions to substantially fully cure the adhesive.

Abstract: An integrated circuit package structure includes a circuit board, an integrated circuit die and a conductive stair structure. The circuit has an upper surface. The integrated circuit die is located on the upper surface of the circuit board. The conductive stair structure is located on the upper surface of the circuit board. The conductive stair structure includes steps along a first direction substantially perpendicular to the upper surface of the circuit board. The steps have different heights relative to the upper surface of the circuit board.

Abstract: A light emitting diode (LED) package includes a substrate, at least one micro LED chip, a black material layer, and a transparent material layer. The substrate has a width ranging from 100 micrometers to 1000 micrometers. The at least one micro LED chip is electrically mounted on a top surface of the substrate and has a width ranging from 1 micrometer to 100 micrometers. The black material layer covers the top surface of the substrate to expose the at least one micro LED chip. The transparent material layer covers the at least one micro LED chip and the black material layer.

Abstract: An inflatable product includes an inflatable chamber and a supplemental layer. The supplemental layer is disposed on the inflatable chamber. Further, the supplemental layer is directly or indirectly fixed to the inflatable chamber by sewing. The inflatable chamber is made of plastic. The material of the supplemental layer is different from that of the inflatable chamber.

Abstract: A method for touchless gesture recognition is provided. The method includes transmitting ultrasonic signals via a speaker. The method includes generating ultrasonic signals. The method includes receiving the reflected ultrasonic signals from an object via two or more microphones. The method includes computing a frequency shift according to the reflected ultrasonic signals. The method includes identifying a gesture that corresponds to a movement of the object according to the frequency shift. The method includes performing a function that corresponds to the gesture.

Abstract: An integrated circuit device includes a gate stack disposed over a substrate. A first L-shaped spacer is disposed along a first sidewall of the gate stack and a second L-shaped spacer is disposed along a second sidewall of the gate stack. The first L-shaped spacer and the second L-shaped spacer include silicon and carbon. A first source/drain epitaxy region and a second source/drain epitaxy region are disposed over the substrate. The gate stack is disposed between the first source/drain epitaxy region and the second source/drain epitaxy region. An interlevel dielectric (ILD) layer disposed over the substrate. The ILD layer is disposed between the first source/drain epitaxy region and a portion of the first L-shaped spacer disposed along the first sidewall of the gate stack and between the second source/drain epitaxy region and a portion of the second L-shaped spacer disposed along the second sidewall of the gate stack.

Abstract: A method for tempering steel for riveting includes positioning a first component having a first composition over a second component having a second composition, and resistance spot welding the first component to the second component using a resistance spot weld gun to form a spot weld. The method includes tempering at least one of the first component, the second component and the spot weld with the resistance spot weld gun, and coupling a third component having a third composition to the first component and the second component with a rivet, and the third composition is different than the first composition and the second composition.

Abstract: A terminal structure includes an electrically conductive post, an electrically conductive flange, and a stress buffer. The electrically conductive post has a bottom surface at a first level and an upper sidewall laterally covered by the stress buffer. The stress buffer has a bottom surface at a second level between the top surface and the bottom surface of the electrically conductive post. The electrically conductive flange extends laterally from the upper sidewall of the electrically conductive post to an outer peripheral edge thereof, and has a depression surface at a third level between the top surface and the bottom surface of the electrically conductive post. Accordingly, the terminal structure has multi-level staggered configuration and is advantageous to achieving the desired wetting height for robust visual inspection and improving primary and secondary board-level reliability.

Abstract: The anti-loss component of the present invention is used for fastening to a wireless earphone, and the wireless earphone includes a main body part, an earplug part and a clamped part connected to the main body part and the earplug part. The anti-loss component includes: a circlip made of bent metallic wire, wherein the circlip includes a first arm and a second arm; a fastening space located between the first arm and the second arm; a gap linked and located on one side of the fastening space; and a tether connection part located on other side of the fastening space; the gap is used for allowing the circlip to elastically deform when the circlip is fastened to the clamped part; the first arm and the second arm are respectively provided with a guiding structure on two sides of the gap; the fastening space is used for storing the clamped part.

Abstract: A system for obstacle detection adapted to a self-guiding machine is provided. The system includes a controller, a linear light source and a light sensor. The linear light source and the light sensor are set apart at a distance. When the linear light source emits an indicator light being a vertical linear light projected onto a path the self-guiding machine travels toward, the light sensor senses the indicator light. The vertical linear light is segmented into a first segment projected to a ground and a second segment projected to a floating obstacle when the self-guiding machine approaches the floating obstacle with a height from the ground and the indicator light is projected to the floating obstacle, in which the second segment of the light sensed by the light sensor is determined as the floating obstacle in front of the self-guiding machine.

Abstract: The current disclosure describes techniques for forming a low resistance junction between a source/drain region and a nanowire channel region in a gate-all-around FET device. A semiconductor structure includes a substrate, multiple separate semiconductor nanowire strips vertically stacked over the substrate, a semiconductor epitaxy region adjacent to and laterally contacting each of the multiple separate semiconductor nanowire strips, a gate structure at least partially over the multiple separate semiconductor nanowire strips, and a dielectric structure laterally positioned between the semiconductor epitaxy region and the gate structure. The first dielectric structure has a hat-shaped profile.

Abstract: The disclosure belongs to the field of motors, and discloses a motor vibration reduction control method comprising: step a, determining whether an actual vibration amplitude of the motor exceeds a preset amplitude; step b, if the actual vibration amplitude exceeds the preset amplitude, determining peak time periods and valley time periods of a cogging torque of the motor, and controlling a duty cycle of a pulse signal for driving the motor during the peak time periods to be higher than a duty cycle of the pulse signal during the valley time periods. The motor vibration reduction method of the present disclosure can reduce adverse effect of the cogging torque fluctuation of the motor on the output torque of the motor, thereby reducing the vibration of the motor, prolonging its service life and reducing its noise.

Abstract: An optical lens assembly includes a stop and includes, in order from an object side to an image side: a first lens, a second lens, a third lens, a fourth lens and a fifth lens. A focal length of the second lens is f2, a focal length of the third lens is f3, a focal length of the fourth lens is f4, a curvature radius of the object-side surface of the third lens is R5, a curvature radius of the object-side surface of the fourth lens is R7, a distance from the object-side surface of the first lens to the image plane along the optical axis is TL, and the following conditions are satisfied: 50.7<f3*R7/TL<378.7 and ?1375.8<(f2/f4)*R5<?21.

Abstract: A power supply system includes an output terminal, a power supply control chip, a power supply switch and a detection device. The power supply control chip is configured to adjust the amount of an input power providing to an electronic device by the power supply device. The power supply switch is configured to control the connection between the power supply device and the power supply control chip. The detection device is configured to detect whether the power supply control chip operates normally. When the power supply control chip operates abnormally, the detection device controls the connection between the power supply device and the power supply control chip through the power supply switch for restarting the power supply control chip. The power supply control chip, the power supply switch and the detection device are disposed in an enclosed space.