Abstract: A structure with a capacitor and a fin transistor includes a substrate. The substrate includes a capacitor region and a fin transistor region. A mesa is disposed within the capacitor region of the substrate. The mesa protrudes from a surface of the substrate. The mesa includes a top surface and two sloping surfaces. Each of the sloping surfaces connects to the top surface of the mesa and the surface of the substrate. A doping region is disposed within the mesa. A capacitor electrode is only disposed on the top surface. A capacitor dielectric layer is disposed between the capacitor electrode and the doping region.

Abstract: A semiconductor device includes a fin-shaped structure on the substrate, a shallow trench isolation (STI) around the fin-shaped structure, a single diffusion break (SDB) structure in the fin-shaped structure for dividing the fin-shaped structure into a first portion and a second portion; a first gate structure on the fin-shaped structure, a second gate structure on the STI, and a third gate structure on the SDB structure. Preferably, a width of the third gate structure is greater than a width of the second gate structure and each of the first gate structure, the second gate structure, and the third gate structure includes a U-shaped high-k dielectric layer, a U-shaped work function metal layer, and a low-resistance metal layer.

Abstract: A method for fabricating semiconductor device includes the steps of: providing a substrate having a first region and a second region; forming a first fin-shaped structure on the first region and a second fin-shaped structure on the second region; forming a patterned mask on the second region; and performing a process to enlarge the first fin-shaped structure so that the top surfaces of the first fin-shaped structure and the second fin-shaped structure are different.

Abstract: A semiconductor device includes a semiconductor substrate, an isolation structure, and a first electrically conductive structure. The semiconductor substrate has a planar device region and a fin device region. The semiconductor substrate includes a mesa structure disposed in the planar device region and fin-shaped structures disposed in the fin device region. The isolation structure is disposed on the semiconductor substrate and includes a first portion which is disposed on the planar device region and covers a sidewall of the mesa structure, and the isolation structure further includes a second portion which is disposed on the fin device region and located between the fin-shaped structures. The first electrically conductive structure is disposed on the planar device region. The first electrically conductive structure is partly disposed above the mesa structure in a vertical direction and partly disposed above the first portion of the isolation structure in the vertical direction.

Abstract: A semiconductor device includes a gate structure on a substrate, a single diffusion break (SDB) structure adjacent to the gate structure, a first spacer adjacent to the gate structure, a second spacer adjacent to the SDB structure, a source/drain region between the first spacer and the second spacer, an interlayer dielectric (ILD) layer around the gate structure and the SDB structure, and a contact plug in the ILD layer and on the source/drain region. Preferably, a top surface of the second spacer is lower than a top surface of the first spacer.

Abstract: Disclosed herein are microelectronic assemblies including strengthened glass cores, as well as related devices and methods. In some embodiments, a microelectronic substrate with an in situ capacitor, the capacitor may include a first conductive layer having first microstructures at a first surface, a second conductive layer on the first conductive layer and having second microstructures at a second surface, where the second microstructures vertically interlock with the first microstructures, and a high-k dielectric material between the first microstructures and the second microstructures.

Abstract: A semiconductor device includes a gate isolation structure on a shallow trench isolation (STI), a first epitaxial layer on one side of the gate isolation structure, a second epitaxial layer on another side of the gate isolation structure, first fin-shaped structures directly under the first epitaxial layer, and second fin-shaped structures directly under the second epitaxial layer, in which the STI surrounds the first fin-shaped structures and the second fin-shaped structures.

Abstract: Some implementations described herein include a complementary metal oxide semiconductor image sensor device for an image detection system that is used in a low-light environment. The complementary metal-oxide semiconductor image sensor device includes a photodiode for detecting near infrared and/or short-wave infrared light waves. The photodiode includes a layer of a quantum dot material and a transparent electrode over the layer of the quantum dot material. In addition to the photodiode having an improved quantum efficiency relative to a silicon-based photodiode, the photodiode is integrated within a color filter array structure to obviate the need for separate a separate visible light complementary metal-oxide semiconductor image sensor device in the image detection system.

Abstract: A semiconductor structure comprises: a semiconductor substrate; one or more first implant layers disposed in the semiconductor substrate and forming a circuit portion and a first test portion, the circuit portion forming an at least partially formed semiconductor circuit; and one or more second implant layers disposed in the semiconductor substrate and further forming the circuit portion and a second test portion, wherein the first and second test portions are spaced apart. A first implantation profile of the one or more first implant layers of the first test portion is obtained during a testing procedure, and the first implantation profile is a representation of a second implantation profile of the one or more first implant layers of the circuit portion.

Abstract: Some implementations described herein include an optoelectronic device for a low-lighting application and techniques to form the optoelectronic device. The optoelectronic device includes near infrared light emitting diodes, near infrared photodiodes, and visible light photodiodes combined in a single substrate. The near infrared light emitting diodes and the near infrared photodiodes are formed using a selectively grown epitaxial material. The selectively grown epitaxial material (e.g., silicon germanium, gallium arsenide, or another type III/V material) improves a quantum efficiency performance of the near infrared photodiode relative to another photodiode that may be formed through doping a silicon material.

Abstract: An electronic device and a method of transmitting USB commands are provided. The method includes: (A) allocating a buffer area in a memory; (B) receiving a USB command; (C) retrieving control transfer information of the USB command; (D) storing the control transfer information in the buffer area; (E) repeating steps (B) to (D) until a condition for ending a control aggregation is met; (F) generating an aggregated USB command according to the content of the buffer area; and (G) transmitting the aggregated USB command.

Abstract: A semiconductor device includes a gate structure on a substrate, a single diffusion break (SDB) structure adjacent to the gate structure, a first spacer adjacent to the gate structure, a second spacer adjacent to the SDB structure, a source/drain region between the first spacer and the second spacer, an interlayer dielectric (ILD) layer around the gate structure and the SDB structure, and a contact plug in the ILD layer and on the source/drain region. Preferably, a top surface of the second spacer is lower than a top surface of the first spacer.

Abstract: A semiconductor device includes a gate isolation structure on a shallow trench isolation (STI), a first epitaxial layer on one side of the gate isolation structure, a second epitaxial layer on another side of the gate isolation structure, first fin-shaped structures directly under the first epitaxial layer, and second fin-shaped structures directly under the second epitaxial layer, in which the STI surrounds the first fin-shaped structures and the second fin-shaped structures.

Abstract: A method of manufacturing a semiconductor wafer is disclosed. The method includes exposing the semiconductor wafer to one or more dopant species to form one or more first implant layers on the semiconductor wafer, testing one or more geometric parameter values of the formed one or more first implant layers, after testing the one or more geometric parameter values, conditionally exposing the semiconductor wafer to one or more dopant species to form one or more additional implant layers on the semiconductor wafer, after forming the one or more additional implant layers, conditionally forming one or more additional circuit layers on the semiconductor wafer to form a plurality of functional electronic circuits on the semiconductor wafer, and conditionally testing the semiconductor wafer with a wafer acceptance test (WAT) operation.

Abstract: A processor chip includes a logic circuit. The logic circuit is configured to be coupled to an electronic device. A configuration of the logic circuit corresponds to a plurality of candidate configurations. The configuration of the logic circuit is switched among the candidate configurations, and the electronic device associates with the processor chip to implement a function corresponding to the configuration of the logic circuit. When the configuration of the logic circuit is a first configuration and the electronic device executes a first driver program, the function is a first network-connection function. When the configuration of the logic circuit is a second configuration and the electronic device executes a second driver program, the function is a second network-connection function different from the first network-connection function.

Abstract: Dynamic management method and system for an active state power management (ASPM) mechanism are provided. The method is applicable to a peripheral component interconnect express (PCIe) transmission architecture that includes a host and a PCIe downstream component. The method includes: configuring the PCIe downstream component to perform: determining whether data transmission status between a PCIe upstream component and the PCIe downstream component is in a busy state, a stable idle state or a temporary state; in response to determining that the data transmission status is in the busy state, forcibly disabling the ASPM function; in response to determining that the data transmission state is in the stable idle state, forcibly enabling the ASPM function; and in response to determining that the data transmission state is in the temporary state, determining whether the data transmission state is the busy state, the stable idle state or the temporary state again.

Abstract: A capacitor on a fin structure includes a fin structure. A dielectric layer covers the fin structure. A first electrode extension is embedded within the fin structure. A first electrode penetrates the dielectric layer and contacts the first electrode extension. A second electrode and a capacitor dielectric layer are disposed within the dielectric layer. The capacitor dielectric layer surrounds the second electrode, and the capacitor dielectric layer is between the second electrode and the first electrode extension.

Abstract: A method for managing a memory buffer, a memory control circuit unit, and a memory storage apparatus are provided. The method includes the following steps. Multiple consecutive first commands are received from a host system. A command ratio of read command among the first commands is calculated. The memory storage apparatus is being configured in a first mode or a second mode according to the command ratio and a ratio threshold. A first buffer is configured in a buffer memory to temporarily store a logical-to-physical address mapping table in response to the memory storage device being configured in the first mode, in which the first buffer has a first capacity. A second buffer is configured in the buffer memory in response to the memory storage device being configured in the second mode, in which the second buffer has a second capacity, which is greater than the first capacity.

Abstract: A semiconductor structure includes a semiconductor substrate, a first gate structure, and a first spacer structure. The semiconductor substrate includes a first active structure, and the first gate structure is disposed on the first active structure. The first gate structure includes a first gate oxide layer and a first high dielectric constant (high-k) dielectric layer. The first gate oxide layer includes a U-shaped structure in a cross-sectional view of the first gate structure, and the first high-k dielectric layer is disposed on the first gate oxide layer The first spacer structure is disposed on a sidewall of the first gate structure, and a first portion of the gate oxide layer is located between the first spacer structure and the first high-k dielectric layer in a horizontal direction.

Abstract: A method for fabricating semiconductor device includes the steps of: providing a substrate having a first region and a second region; forming a first fin-shaped structure on the first region and a second fin-shaped structure on the second region; forming a patterned mask on the second region; and performing a process to enlarge the first fin-shaped structure so that the top surfaces of the first fin-shaped structure and the second fin-shaped structure are different.