Patents by Inventor Chun-Yi Wu
Chun-Yi Wu has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Patent number: 12382561Abstract: An LED driving apparatus, a microcontroller, and a control method for an LED module are provided. The LED driving apparatus includes a power supply module, a switch module, and a control module. The power supply module is configured to supply power to the LED module, in which the power supply module determines whether to trigger an overcurrent protection based on whether an output current exceeds a threshold current. The control module is configured to receive an overcurrent detection signal to control a conduction state of the switch module, so as to affect the current amount of the LED module. When the overcurrent detection signal indicates the output current exceeds the threshold current, the control module outputs a first control signal based on the overcurrent detection signal to control the switch module, to prevent the overcurrent protection from being triggered.Type: GrantFiled: January 8, 2024Date of Patent: August 5, 2025Assignee: NUVOTON TECHNOLOGY CORPORATIONInventors: Chun-Yi Wu, Lian-Cheng Tsai, Chih-Wei Tsai
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Publication number: 20250224637Abstract: An optical film comprises a substrate and a plurality of microstructures positioned on a light incident surface of the substrate. The substrate is defined to have a first direction and a second direction perpendicular to the first direction. The cross-sectional shape of the microstructures in the first direction is different from that in the second direction. Each of the microstructures has multiple optical surfaces and a boundary line connecting the multiple optical surfaces. The boundary line is a straight line and parallel to the light incident surface of the substrate. Through the structural design of the microstructures on the optical film, the light distribution of the light source is expanded to achieve the purpose of specific angle illumination. The present invention also provides a backlight module and a display device including the optical film.Type: ApplicationFiled: March 28, 2025Publication date: July 10, 2025Applicant: Radiant Opto-Electronics CorporationInventors: Chun-Yi WU, Wei-Hsuan CHEN, Yung-Hui TAI, Chung-Yung TAI, Wen-Hao CAI, Chun-Hau LAI, Jun-Ping LIN
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Patent number: 12342436Abstract: A light strip unplugging protection method includes: providing a light strip, wherein the light strip includes a plug including a power pin and a control pin; providing a socket corresponding to the plug, wherein the socket includes a power pin holder and at least one light strip control pin holder for electrically connecting with the power pin and the light strip control pin respectively; using a pulse-width modulation signal to drive the light strip on the light strip control pin holder to control the current passing therethrough; and when the pulse-width modulation signal is in a first state, detecting voltage or current of the light strip control pin holder; determining whether the light strip is unplugged according to the voltage or current; and when it is determined that the light strip is unplugged, power voltage on the power pin holder is turned off.Type: GrantFiled: September 22, 2023Date of Patent: June 24, 2025Assignee: NUVOTON TECHNOLOGY CORPORATIONInventors: Lian-Cheng Tsai, Chun-Yi Wu
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Publication number: 20250201528Abstract: Methods for revitalizing components of a plasma processing apparatus that includes a sensor for detecting a thickness or roughness of a peeling weakness layer on a protective surface coating of a plasma processing tool and/or for detecting airborne contaminants generated by such peeling weakness layer. The method includes detecting detrimental amounts of peeling weakness layer buildup or airborne concentration of atoms or molecules from the peeling weakness layer, and initiating a revitalization process that bead beats the peeling weakness layer to remove it from the component while maintaining the integrity of the protective surface coating.Type: ApplicationFiled: February 26, 2025Publication date: June 19, 2025Applicant: Taiwan Semiconductor Manufacturing Company, Ltd.Inventors: Chi-Hsing LIN, Chen-Fon CHANG, Chun-Yi WU, Shi Yu KE, Chih-Teng LIAO
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Patent number: 12332472Abstract: An optical film comprises a light incident side and a light emitting side opposite to the light incident side. A plurality of light incident microstructures are formed on the light incident side, and the light incident microstructures are tapered structures. According to the structural design of the light incident microstructures of the optical film, the light field of a light source can be expanded to achieve the purpose of emitting light at a specific angle. The invention also provides a backlight module and a display device including the optical film.Type: GrantFiled: September 5, 2023Date of Patent: June 17, 2025Assignee: Radiant Opto-Electronics CorporationInventors: Wei-Hsuan Chen, Chung-Yung Tai, Wen-Hao Cai, Chun-Yi Wu
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Publication number: 20250147223Abstract: A backlight module has a first side viewing angle luminance LAS1 and a first normal viewing angle luminance LAN1 in the side viewing mode, wherein LAS1/LAN1>50%. The backlight module has a second side viewing angle luminance LAS2 and a second normal viewing angle luminance LAN2 in the narrow viewing mode, wherein LAS2/LAN2<0.5%. The first side angle and the second side angle occur in a slanting direction. The first normal view and the second normal view occur in a normal direction. When executing a side viewing execution step, an upper backlight unit and a lower backlight unit are activated to form the side viewing mode. When executing a narrow viewing execution step, the upper backlight unit is turned off and the lower backlight unit is activated to form the narrow viewing mode. The invention also provides a display device including the backlight module.Type: ApplicationFiled: October 25, 2024Publication date: May 8, 2025Applicant: Radiant Opto-Electronics CorporationInventors: Chun-Hau LAI, Wei-Hsuan CHEN, Chun-Yi WU
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Publication number: 20250147071Abstract: An electrical detection method provides a wiring structure including a base material body and a plurality of contact portions bonded to the base material body. Each of the contact portions includes an electrical detection pad exposed from a surface of the base material body, an electrical auxiliary pad exposed from the surface of the base material body, and a conductor that electrically connects the electrical detection pad and the electrical auxiliary pad. When probes of a detection device are connected to the contact portions, each of the probes exerts a force on the electrical detection pad and the electrical auxiliary pad of each of the contact portions at the same time, so that the contact force between the probes and the contact portions is enhanced to facilitate the electrical testing.Type: ApplicationFiled: March 18, 2024Publication date: May 8, 2025Applicant: SILICONWARE PRECISION INDUSTRIES CO., LTD.Inventors: Chun-Yi WU, Cheng-Tsai HSIEH, Cheng-Shao CHEN, Meng-Chieh LIAO, Yu-Hsiang NIEN
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Publication number: 20250121244Abstract: The disclosed weighted vest includes a modular design with a front and back piece body, connected via a reinforcing connection element. The vest is adjustable through detachable shoulder straps and waist bands, incorporating hook-and-loop fasteners for ease of use. The vest features compartments for weights, which can be steel plates or sandbags, providing customizable resistance for training. The design facilitates cleaning and maintenance, improving durability and user comfort.Type: ApplicationFiled: August 20, 2024Publication date: April 17, 2025Inventors: Chun-Yi Wu, Tsu-Wei Liu
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Publication number: 20250104842Abstract: A method and a system for sharing a digital pathological image are provided, where the digital pathological image is presented on a first interactive interface of a first terminal device with an editing permission and a second interactive interface of a second terminal device with an observing permission by a server. In the first terminal device, in response to an image adjustment operation or a tag adding operation performed through the first interactive interface, corresponding image adjustment information or added tag information is transmitted to the second interactive interface of the second terminal device through the first interactive interface. In the second terminal device, in response to receiving the image adjustment information or the added tag information through the second interaction interface, the content presented on the second interaction interface is correspondingly adjusted based on the image adjustment information or the tag adding information.Type: ApplicationFiled: October 20, 2023Publication date: March 27, 2025Applicant: Wistron Medical Technology CorporationInventors: Yi Sheng Chao, Shih Feng Huang, Chun Yi Wu, Chao Yi Huang, Han Chun Kuo
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Patent number: 12261026Abstract: Methods for revitalizing components of a plasma processing apparatus that includes a sensor for detecting a thickness or roughness of a peeling weakness layer on a protective surface coating of a plasma processing tool and/or for detecting airborne contaminants generated by such peeling weakness layer. The method includes detecting detrimental amounts of peeling weakness layer buildup or airborne concentration of atoms or molecules from the peeling weakness layer, and initiating a revitalization process that bead beats the peeling weakness layer to remove it from the component while maintaining the integrity of the protective surface coating.Type: GrantFiled: March 31, 2021Date of Patent: March 25, 2025Assignee: TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.Inventors: Chi-Hsing Lin, Chen-Fon Chang, Chun-Yi Wu, Shi-Yu Ke, Chih-Teng Liao
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Publication number: 20250089140Abstract: An LED driving apparatus, a microcontroller, and a control method for an LED module are provided. The LED driving apparatus includes a power supply module, a switch module, and a control module. The power supply module is configured to supply power to the LED module, in which the power supply module determines whether to trigger an overcurrent protection based on whether an output current exceeds a threshold current. The control module is configured to receive an overcurrent detection signal to control a conduction state of the switch module, so as to affect the current amount of the LED module. When the overcurrent detection signal indicates the output current exceeds the threshold current, the control module outputs a first control signal based on the overcurrent detection signal to control the switch module, to prevent the overcurrent protection from being triggered.Type: ApplicationFiled: January 8, 2024Publication date: March 13, 2025Inventors: Chun-Yi WU, Lian-Cheng TSAI, Chih-Wei TSAI
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Patent number: 12211966Abstract: A light-emitting component includes a light-emitting unit and an electrically insulating layer. The light-emitting unit includes a first semiconductor layer, an active layer, and a second semiconductor layer, which are stacked on one another along a stacking direction in such order. The second semiconductor has a lower surface distal from the active layer. The electrically insulating layer is disposed to cover a first portion and to expose a second portion of the lower surface of the second semiconductor layer. A fluorine-containing region is formed in the second semiconductor layer. Methods for making the light-emitting component are also disclosed.Type: GrantFiled: November 15, 2021Date of Patent: January 28, 2025Assignee: Tianjin Sanan Optoelectronics Co., Ltd.Inventors: Dongyan Zhang, Yuehua Jia, Chun-Yi Wu, Wen Liu, Jing Wang, Huan-Shao Kuo, Huiwen Li, Duxiang Wang
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Publication number: 20240429348Abstract: A light-emitting diode includes a light-emitting epitaxial layer having a first surface as a light-emitting surface and a second surface opposing the first surface, a first type semiconductor layer, an active layer, and a second type semiconductor layer; a transparent dielectric layer located on the second surface and in direct contact with the light-emitting epitaxial laminated layer, and having conductive through-holes therein; a transparent conductive layer located on one side surface of the transparent dielectric layer that is distal from the light-emitting epitaxial laminated layer; and a metal reflective layer located on one side surface of the transparent conductive layer that is distal from the transparent dielectric layer; wherein the transparent dielectric layer includes a first layer and a second layer; and wherein the first layer is thicker than the second layer, and a refractivity of the first layer is less than a refractivity of the second layer.Type: ApplicationFiled: September 5, 2024Publication date: December 26, 2024Applicant: XIAMEN SANAN OPTOELECTRONICS TECHNOLOGY CO., LTD.Inventors: Cheng MENG, Yuehua JIA, Jing WANG, Chun-Yi WU, Ching-Shan TAO, Duxiang WANG
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Patent number: 12158604Abstract: An optical film, an optical film set, a backlight module and a display device are provided. The optical film includes a main body, plural first prism structures and plural second prism structures. The main body has a first optical surface and a second optical surface. The first prism structures are disposed on the first optical surface. Each of the first prism structures extends along a first direction. The second prism structures are disposed on the second optical surface. Each of the second prism structures extends along a second direction. The first direction is different from the second direction.Type: GrantFiled: January 24, 2024Date of Patent: December 3, 2024Assignee: Radiant Opto-Electronics CorporationInventors: Wei-Hsuan Chen, Chung-Yung Tai, Chun-Yi Wu
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Publication number: 20240363676Abstract: A semiconductor device structure is provided. The semiconductor device structure includes a substrate and a magnetic element over the substrate. The magnetic element has multiple sub-layers, and each sub-layer is wider than another sub-layer above it. The semiconductor device structure also includes an isolation layer extending exceeding edges the magnetic element, and the isolation layer contains a polymer material. The semiconductor device structure further includes a conductive line over the isolation layer and extending exceeding the edges of the magnetic element.Type: ApplicationFiled: July 9, 2024Publication date: October 31, 2024Applicant: Taiwan Semiconductor Manufacturing Company, Ltd.Inventors: Chi-Cheng CHEN, Wei-Li HUANG, Chun-Yi WU, Kuang-Yi WU, Hon-Lin HUANG, Chih-Hung SU, Chin-Yu KU, Chen-Shien CHEN
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Patent number: 12095010Abstract: A light-emitting diode includes a light-emitting epitaxial layer having a first surface as a light-emitting surface and a second surface opposing the first surface, a first type semiconductor layer, an active layer, and a second type semiconductor layer; a transparent dielectric layer located on the second surface and in direct contact with the light-emitting epitaxial laminated layer, and having conductive through-holes therein; a transparent conductive layer located on one side surface of the transparent dielectric layer that is distal from the light-emitting epitaxial laminated layer; and a metal reflective layer located on one side surface of the transparent conductive layer that is distal from the transparent dielectric layer; wherein the transparent dielectric layer includes a first layer and a second layer; and wherein the first layer is thicker than the second layer, and a refractivity of the first layer is less than a refractivity of the second layer.Type: GrantFiled: October 31, 2022Date of Patent: September 17, 2024Assignee: XIAMEN SANAN OPTOELECTRONICS TECHNOLOGY CO., LTD.Inventors: Cheng Meng, Yuehua Jia, Jing Wang, Chun-Yi Wu, Ching-Shan Tao, Duxiang Wang
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Publication number: 20240298392Abstract: A light strip unplugging protection method includes: providing a light strip, wherein the light strip includes a plug including a power pin and a control pin; providing a socket corresponding to the plug, wherein the socket includes a power pin holder and at least one light strip control pin holder for electrically connecting with the power pin and the light strip control pin respectively; using a pulse-width modulation signal to drive the light strip on the light strip control pin holder to control the current passing therethrough; and when the pulse-width modulation signal is in a first state, detecting voltage or current of the light strip control pin holder; determining whether the light strip is unplugged according to the voltage or current; and when it is determined that the light strip is unplugged, power voltage on the power pin holder is turned off.Type: ApplicationFiled: September 22, 2023Publication date: September 5, 2024Inventors: Lian-Cheng Tsai, CHUN-YI WU
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Publication number: 20240290908Abstract: A light emitting device includes an epitaxial structure and first and second electrodes on a side of the epitaxial structure. The epitaxial structure includes a first-type semiconductor layer, an active layer, and a second-type semiconductor layer. The active layer is disposed between the first-type semiconductor layer and the second-type semiconductor layer. The first electrode is disposed on the epitaxial structure to be electrically connected with the first-type semiconductor layer. The second electrode is disposed on the epitaxial structure to be electrically connected with the second-type semiconductor layer. The second electrode is in ohmic contact with a second-type window sublayer of the second-type semiconductor layer.Type: ApplicationFiled: April 3, 2024Publication date: August 29, 2024Inventors: ChingYuan TSAI, Chun-Yi WU, Fulong LI, Duxiang WANG, Chaoyu WU, Wenhao GAO, Xiaofeng LIU, Weihuan LI, Liming SHU, Chao LIU
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Patent number: 12074193Abstract: A semiconductor device structure is provided. The semiconductor device structure includes a substrate and a magnetic element over the substrate. The semiconductor device structure also includes an isolation layer extending exceeding edges the magnetic element. The isolation layer contains a polymer material. The semiconductor device structure further includes a conductive line over the isolation layer and extending exceeding the edges of the magnetic element.Type: GrantFiled: March 30, 2023Date of Patent: August 27, 2024Assignee: Taiwan Semiconductor Manufacturing Company, Ltd.Inventors: Chi-Cheng Chen, Wei-Li Huang, Chun-Yi Wu, Kuang-Yi Wu, Hon-Lin Huang, Chih-Hung Su, Chin-Yu Ku, Chen-Shien Chen
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Publication number: 20240234481Abstract: A method of forming a semiconductor device, the method including forming a first insulation layer over a substrate, depositing a first stack of magnetic layers over the first insulation layer, etching the first stack of magnetic layers such that a sidewall of the first stack of magnetic layers forms a stairstep pattern, forming a first photosensitive layer over the first stack of magnetic layers, the first insulation layer, and the substrate, wherein a thickness of the first photosensitive layer above a center of a first step of the stairstep pattern is different from a thickness of the first photosensitive layer above a center of a second step of the stairstep pattern, forming a first conductive feature over the first photosensitive layer, depositing a second insulation layer over the first photosensitive layer and the first conductive feature, and depositing a second magnetic layer over the second insulation layer.Type: ApplicationFiled: January 6, 2023Publication date: July 11, 2024Inventors: Szu-Shu Yang, Chun Yi Wu, Kai Tzeng, Yuh-Sen Chang, Chi-Cheng Chen, Chi-Chun Peng