Patents by Inventor Colin Blakely

Colin Blakely has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20250261485
    Abstract: Solid-state lighting devices including light-emitting diode (LED) chips and more particularly LED chip structures with electrode extensions and vias are disclosed. Electrode extensions and vias are formed on opposing sides of an active LED structure as part of anode and cathode connections. Electrode extensions are formed with various shapes in positions relative to closest vias to promote improved recombination efficiency in active LED structures. Recombination efficiency is higher in regions between electrode extensions and closest vias where higher electrostatic field strength is exhibited. Layouts of vias relative to electrode extensions are disclosed with improved uniformity in spacings relative to areas of higher electrostatic field strength to increase emission efficiency of LED chips.
    Type: Application
    Filed: February 8, 2024
    Publication date: August 14, 2025
    Inventors: David Suich, Michael Check, Joseph G. Sokol, Natalia da Silva Moura, Colin Blakely
  • Patent number: 12385605
    Abstract: Solid-state lighting devices, and more particularly to a three-dimensional (3D) light-emitting diode (LED) device and a method of manufacture are disclosed. A submount of the LED can have several submount portions that are angled with respect to each other, and LED chips can be mounted on each submount portion, such that the LED chips of the device are angled at different angles with respect to each other. In an embodiment, the LED device can include a heatsink that is in contact with each of the submount portions to channel heat away from the LED chips. The LED chips can be mounted on the submount portions when all submount portions are laying flat, and then the submount portions can be pushed or punched into their respective angles.
    Type: Grant
    Filed: August 12, 2024
    Date of Patent: August 12, 2025
    Assignee: CreeLED, Inc.
    Inventors: Robert Wilcox, Michael Check, Colin Blakely, David Suich, Joseph G. Sokol, Andre Pertuit
  • Patent number: 12355013
    Abstract: Light-emitting diode (LED) packages and more particularly emission height arrangements in LED packages and related devices and methods are disclosed. LED packages, LED chips, and related device arrangements are disclosed that include various combinations of LED chip types, lumiphoric materials, and/or cover structures that are arranged together while also providing a substantially uniform emission height for corresponding light-emitting surfaces. LED chips may be configured with different heights or thicknesses that compensate for variations in lumiphoric materials and/or cover structures utilized to provide different emission colors. Corresponding LED packages and/or LED chips with different emission colors may be assembled near one another with improved emission height uniformity.
    Type: Grant
    Filed: April 21, 2022
    Date of Patent: July 8, 2025
    Assignee: CreeLED, Inc.
    Inventors: Alexis Rile, Robert Wilcox, Colin Blakely
  • Publication number: 20250201184
    Abstract: Active control of light emitting diodes (LEDs) and LED packages within LED displays is disclosed. LED packages are disclosed that include a plurality of LED chips that form at least one LED pixel for an LED display. Each LED package may include an active electrical element that is configured to receive a control signal and actively maintain an operating state, such as brightness or grey level while other LED packages are being addressed. Active electrical elements may include active circuitry that includes one or more of a driver device, a signal conditioning or transformation device, a memory device, a decoder device, an electrostatic discharge (ESD) protection device, a thermal management device, and a detection device, among others. In this regard, each LED pixel of an LED display may be configured for operation with active matrix addressing.
    Type: Application
    Filed: March 4, 2025
    Publication date: June 19, 2025
    Inventors: Christopher P. Hussell, Boris Dzyubenko, Colin Blakely
  • Publication number: 20250194307
    Abstract: Light-emitting diodes (LEDs), and more particularly, lenses formed by additive manufacturing for LED packages are disclosed. Additive manufacturing is used to progressively cure precursor materials for lenses in directions away from corresponding submounts. Progressively curing precursor materials may be performed in a layer-by-layer manner or in a continuous manner. Such additive manufacturing allows complex lens shapes that form primary optics and encapsulation for LED chips of LED packages. Complex shapes include pockets of air or other materials embedded within lens materials, pockets formed about LED chips, progressively increasing lens widths, Fresnel shapes, and/or asymmetric shapes, among others.
    Type: Application
    Filed: December 7, 2023
    Publication date: June 12, 2025
    Inventors: Andre Pertuit, Michael Check, Colin Blakely, David Suich, Joseph G. Sokol, Robert Wilcox
  • Publication number: 20250133876
    Abstract: Light-emitting diode (LED) chips and, more particularly, LED chips with light extraction films and related methods are disclosed. Light extraction films include antireflective structures that are integrated within LED chip structures. Antireflective structures include one or more antireflective layers positioned to reduce internal reflections at various internal interfaces of LED chips. Certain LED chip structures include antireflective structures positioned between epitaxially grown active LED structures and carrier substrates on which the active LED structures are supported. Wafer level bonding sequences with one or more bonding layers are disclosed that facilitate integration of antireflective structures within LED chip structures.
    Type: Application
    Filed: October 19, 2023
    Publication date: April 24, 2025
    Inventors: David Suich, Michael Check, Colin Blakely, Robert Wilcox, Joseph G. Sokol, Andre Pertuit, Natalia da Silva Moura
  • Patent number: 12272294
    Abstract: Active control of light emitting diodes (LEDs) and LED packages within LED displays is disclosed. LED packages are disclosed that include a plurality of LED chips that form at least one LED pixel for an LED display. Each LED package may include an active electrical element that is configured to receive a control signal and actively maintain an operating state, such as brightness or grey level while other LED packages are being addressed. Active electrical elements may include active circuitry that includes one or more of a driver device, a signal conditioning or transformation device, a memory device, a decoder device, an electrostatic discharge (ESD) protection device, a thermal management device, and a detection device, among others. In this regard, each LED pixel of an LED display may be configured for operation with active matrix addressing.
    Type: Grant
    Filed: April 11, 2019
    Date of Patent: April 8, 2025
    Assignee: CreeLED, Inc.
    Inventors: Christopher P. Hussell, Boris Dzyubenko, Colin Blakely
  • Publication number: 20250079409
    Abstract: Semiconductor devices and more particularly multiple junction light-emitting diode (LED) chips and related methods are disclosed. LED chips include multiple active LED structures that are bonded together. The active LED structures may be vertically bonded within the LED chip. Bonding layers are provided between active LED structures with sufficient thicknesses to maintain mechanical integrity within the LED chip. Bonding layers may be formed of electrically insulating materials with electrically conductive vias formed therethrough to provide electrically conductive paths between active LED structures. Active LED structures may be connected in series for high voltage applications. Emissions from the active LED structures may have same emission colors, multiple distinct emission colors, and/or variations in peak wavelengths within a same color range.
    Type: Application
    Filed: September 5, 2023
    Publication date: March 6, 2025
    Inventors: Joseph G. Sokol, Michael Check, David Suich, Andre Pertuit, Robert Wilcox, Colin Blakely
  • Publication number: 20250081689
    Abstract: Solid-state lighting devices, and more particularly, wire grid polarization structure for current spreading and polarization control for light emitting diode (LED) package, and a method for making the same are disclosed. The wire grid polarization structure can be configured to both polarize light emitted by an LED chip of the LED package as well as spread current on a layer of the LED chip, resulting in more even light emission across the LED chip. The wire grid polarization structure can be formed on a top surface of the LED chip, and be electrically coupled to an electrode to spread the current across the top surface of the LED chip. In an embodiment, the wire grid polarization structure can include interdigitated fingers that are coupled to both an anode and an electrode.
    Type: Application
    Filed: August 29, 2023
    Publication date: March 6, 2025
    Inventors: David Suich, Michael Check, Austin Spencer, Colin Blakely
  • Publication number: 20250056933
    Abstract: Semiconductor devices and more particularly mounting structures for edge-emitting semiconductor devices are disclosed. Exemplary edge-emitting semiconductor devices include light-emitting diode (LED) edge emitters. Mounting structures include submounts with recesses configured to receive edge-emitting semiconductor devices such that emitting edges are positioned toward desired emission directions. Submount recesses are disclosed that include corresponding electrical connections for edge-emitting semiconductor devices. Multiple edge-emitting semiconductor devices are mechanically supported and electrically connected within a single recess or with multiple recesses. Corresponding devices are disclosed that include arrays of edge-emitting semiconductor devices in one or more recesses.
    Type: Application
    Filed: August 9, 2023
    Publication date: February 13, 2025
    Inventors: David Suich, Michael Check, Colin Blakely, Andre Pertuit, Joseph G. Sokol, Robert Wilcox
  • Publication number: 20250022983
    Abstract: Solid-state lighting devices including light-emitting diodes (LEDs) and more particularly current injection structures for LED chips are disclosed. Current injection structures include integrated layers or materials with high work functions as part of contact structures for epitaxial layers of active LED structures. Exemplary structures provide high work function contact layers for p-type epitaxial layers to enhance hole mobility and transport. Further contact structures include combinations of high work function layers with other current spreading layers. Exemplary materials for high work function layers include transition metal oxides.
    Type: Application
    Filed: July 13, 2023
    Publication date: January 16, 2025
    Inventors: Michael Check, David Suich, Thomas Celano, Joseph G. Sokol, Colin Blakely
  • Publication number: 20250006709
    Abstract: Semiconductor devices and more particularly edge-emitting semiconductor devices and related methods are disclosed. Exemplary edge-emitting semiconductor devices include LED edge emitters. Electrical connections for edge-emitting devices may be provided along certain device edges with opposing edges forming light-emitting edges. LED edge emitters may be vertically arranged and assembled together to form LED arrays with reduced pitch. Related methods include bonding multiple wafer-level structures, such as LED wafers, together, followed by separation techniques that result in individual edge emitters or groupings of edge emitters in the form of LED arrays.
    Type: Application
    Filed: June 30, 2023
    Publication date: January 2, 2025
    Inventors: Michael Check, David Suich, Colin Blakely, Andre Pertuit, Joseph G. Sokol, Robert Wilcox
  • Publication number: 20250006712
    Abstract: Embodiments of a light-emitting diode (LED) device are disclosed. In some embodiments, the LED device includes a first LED device and one or more other LED devices mounted to the first LED device. By mounting the other LED devices to the first LED device, the LED devices are arranged in a stacked configuration. This allows for better light mixing of the light emitted by the various LED devices since the LED devices are at least partially aligned with one another. Different manners of stacking the LED devices are disclosed. The scope of the disclosure includes the specific embodiments disclosed as well as other combinations depending on the color mixing profile that is desired.
    Type: Application
    Filed: June 30, 2023
    Publication date: January 2, 2025
    Inventors: Andre Pertuit, Robert Wilcox, David Suich, Michael Check, Colin Blakely
  • Patent number: 12176471
    Abstract: Solid-state lighting devices including light-emitting diodes (LEDs), and more particularly polarization structures for LED devices are disclosed. Polarization structures are disclosed that are integrated within light-emitting devices and are capable of receiving unpolarized light and providing polarized light that exits the light-emitting devices. Polarization structures may be formed on or in various surfaces within light-emitting devices, such as one or more surfaces of cover structures and/or LED chips. LED packages with multiple LED chips and multiple polarization structures are also disclosed. The LED chips may be arranged to be electrically activated and deactivated independently of one another such that corresponding LED packages are capable of electronically switching between different orientations of polarized and/or unpolarized light.
    Type: Grant
    Filed: October 29, 2021
    Date of Patent: December 24, 2024
    Assignee: CreeLED, Inc.
    Inventors: Derek Miller, Colin Blakely
  • Publication number: 20240413271
    Abstract: Solid-state lighting devices including light-emitting diodes (LEDs) and more particularly arrangements of lumiphoric materials within LED chips are disclosed. Lumiphoric materials are incorporated or otherwise embedded within LED chips. Embedded lumiphoric materials are provided so that at least some portions of light generated by active LED structures are subject to wavelength conversion before exiting LED chip surfaces. Lumiphoric materials may form dielectric and/or passivation layers between various chip structures, such as between active LED structures and internal reflective layers and/or electrical contacts. Internally converted light propagating within LED chips may pass back through active LED structures with reduced light absorption.
    Type: Application
    Filed: June 7, 2023
    Publication date: December 12, 2024
    Inventors: Michael Check, David Suich, Colin Blakely, Andre Pertuit, Robert Wilcox, Joseph G. Sokol
  • Publication number: 20240401756
    Abstract: Solid-state lighting devices, and more particularly to a three-dimensional (3D) light-emitting diode (LED) device and a method of manufacture are disclosed. A submount of the LED can have several submount portions that are angled with respect to each other, and LED chips can be mounted on each submount portion, such that the LED chips of the device are angled at different angles with respect to each other. In an embodiment, the LED device can include a heatsink that is in contact with each of the submount portions to channel heat away from the LED chips. The LED chips can be mounted on the submount portions when all submount portions are laying flat, and then the submount portions can be pushed or punched into their respective angles.
    Type: Application
    Filed: August 12, 2024
    Publication date: December 5, 2024
    Inventors: Robert Wilcox, Michael Check, Colin Blakely, David Suich, Joseph G. Sokol, Andre Pertuit
  • Publication number: 20240404998
    Abstract: Solid-state lighting devices, and more particularly, cover structures for beamshaping for multi-chip light emitting diode (LED) components are disclosed. The cover structure can reduce the far field emission pattern variation due to having different light emission sources on a multi-chip LED component. The cover structure can include channels, or tunnels, within an otherwise light-transmissive material that perform beamshaping of at least a portion of the light emitted from the multiple LED chips. The beamshaping can be a result of a predetermined orientation and/or distribution pattern of the channels that redirect the light. The cover structure can also include textured surfaces or light-altering materials that can further diffuse the light emitted from the multi-chip LED component.
    Type: Application
    Filed: May 31, 2023
    Publication date: December 5, 2024
    Inventors: Robert Wilcox, Cherif Ghoul, Colin Blakely
  • Publication number: 20240372052
    Abstract: Solid-state lighting devices including light-emitting diodes (LEDs) and more particularly LED packages for environmental indication are disclosed. LED packages include one or more LED chips and reactive materials that preferentially react with environmental ingress. After sufficient reactant exposure, the reactive materials may degrade and exhibit reduced electrical conductivity. Reactive material arrangements relative to electrical connections are provided so that the one or more LED chips either turn on, turn off, or lose brightness to provide visual indication of environmental reactants. Reactive materials may form electrical shorting paths that bypass one or more LED chips until sufficient reactant exposure when the shorting paths fail and the one or more LED chips are electrically activated.
    Type: Application
    Filed: May 5, 2023
    Publication date: November 7, 2024
    Inventors: Robert Wilcox, David Suich, Colin Blakely
  • Publication number: 20240355979
    Abstract: Solid-state lighting devices including light-emitting diodes (LEDs) and more particularly LED packages with materials for reducing effects of environmental ingress are disclosed. Reactive materials are provided within LED packages that preferentially absorb environmental ingress away from other package elements, thereby extending operating lifetimes. Such reactive materials may be configured with redox potentials that are lower than the other package elements to more readily attract and react with environmental ingress that may enter LED packages under various operating environments. Arrangements of reactive materials are described relative to LED chips and corresponding electrical connections. Reactive materials may be formed as coatings, layers, pre-formed structures, and/or distributions of particles within LED packages.
    Type: Application
    Filed: April 21, 2023
    Publication date: October 24, 2024
    Inventors: Robert Wilcox, Michael Check, Andre Pertuit, David Suich, Joseph G. Sokol, Colin Blakely
  • Patent number: D1060278
    Type: Grant
    Filed: June 13, 2023
    Date of Patent: February 4, 2025
    Assignee: CreeLED, Inc.
    Inventors: Sarah Trinkle, Alexis Rile, Robert Wilcox, Colin Blakely