Abstract: A module is formed in which semiconductor components are soldered to an electrically conductive heat sink. The electrically conductive heat sink is formed so that it will serve as an electrical bus in an electronic device. The chips of the semiconductor component are metallurgically bonded to the surface of the heat sink. The heat sink uses a heat transfer fluid that flows through an interior of the heat sink, the interior containing an internal element. In the preferred embodiment, the internal element is a plurality of silver plated copper balls. The copper balls are brazed to each other and to the walls of the heat sinks in an assembly process. The heat sink housing will typically be made from copper, with one surface made from molybdenum so that the expansion and contraction of the heat sink housing molybdenum surface will be similar to that of the silicon substrate of the chips, thereby avoiding the problem of the chip substrate cracking and breaking due to thermal flexing.

Abstract: A module is formed in which semiconductor components are soldered to an electrically conductive heat sink. The electrically conductive heat sink is formed so that it will serve as an electrical bus in an electronic device. The chips of the semiconductor component are metallurgically bonded to the surface of the heat sink. The heat sink uses a heat transfer fluid that flows through an interior of the heat sink, the interior containing an internal element. In the preferred embodiment, the internal element is a plurality of silver plated copper balls. The copper balls are brazed to each other and to the walls of the heat sinks in an assembly process. The heat sink housing will typically be made from copper, with one surface made from molybdenum so that the expansion and contraction of the heat sink housing molybdenum surface will be similar to that of the silicon substrate of the chips, thereby avoiding the problem of the chip substrate cracking and breaking due to thermal flexing.

Abstract: A module is formed in which semiconductor components are soldered to an electrically conductive heat sink. The electrically conductive heat sink is formed so that it will serve as an electrical bus in an electronic device. The chips of the semiconductor component are metallurgically bonded to the surface of the heat sink. The heat sink uses a heat transfer fluid that flows through an interior of the heat sink, the interior containing an internal element. In the preferred embodiment, the internal element is a plurality of silver plated copper balls. The copper balls are brazed to each other and to the walls of the heat sinks in an assembly process. The heat sink housing will typically be made from copper, with one surface made from molybdenum so that the expansion and contraction of the heat sink housing molybdenum surface will be similar to that of the silicon substrate of the chips, thereby avoiding the problem of the chip substrate cracking and breaking due to thermal flexing.

Abstract: A dispenser, in the form of a sachet, made from a water-soluble plastics material, containing a personal care composition including at least one surfactant together with an effervescent base material, the base material including any material or combination of materials that when in contact with a sufficient amount of water liberates gas.

Abstract: An oil-cooled inverter for an electric traction motor that uses six IGBT switches to generate 3-phase AC electrical current as its output. The switches are mounted on heat sinks that use hot motor oil (hydraulic fluid) as the heat transfer fluid. An interior of each of the heat sinks contains a heat transfer medium. The heat sink housing is made of molybdenum, which has a thermal expansion rate equal to that of silicon. This allows the circuitry of the inverter to be mounted directly on the top surface of the heat sinks, as the expansion and contraction of the heat sink housing will match that of the silicon substrate of the chips. Since both elements, the heat sink housing and the chip substrate, expand and contract at an equal rate during heating and cooling, the problem of the chip substrate cracking and breaking due to thermal flexing is eliminated.

Abstract: Oral rinse and dentifrice compositions, comprising a phenolic selected from the group consisting of menthol, eucalyptol, methyl salicylate, thymol, triclosan, and mixtures thereof; and a cyclodextrin selected from the group consisting of hydroxypropyl &bgr;-cyclodextrin, hydroxyethyl &bgr;-cyclodextrin, hydroxypropyl &ggr;-cyclodextrin, hydroxyethyl &ggr;-cyclodextrin, &agr;-cyclodextrin, methyl &bgr;-cyclodextrin, and mixtures thereof. These compositions are useful in retarding the development of plaque, treating gingivitis, and in treating the presence of micro-organisms in the oral cavity.

Abstract: A motor operator for an electric power switch having a handle moveable along a rectilinear path includes a threaded shaft mounted for rotation parallel to movement of the handle. A molded flexible coupling has a drive section with a threaded through bore engaging the threaded shaft and a yoke section having a hole engaged by the handle. The yoke section is joined to the drive section by an integral flexible intermediate section formed by a pair of slits extending generally parallel to the through bore. As the threaded shaft is rotated by a motor, the drive coupling, and with it the handle, are driven between OFF and ON positions. During startup of the motor, toggling of the handle by a toggle mechanism in the switch, and deceleration at the end of travel, when the drive section of the drive coupling and the yoke section travel at different speeds, one or the other of the slits closes as the intermediate section bends to dampen the effect.

Abstract: A circuit breaker includes an electrically insulating housing, an arc chamber, line and load terminals, separable contacts in series with the terminals, and an operating mechanism. The open position of the separable contacts causes arcing therebetween and the development of ionized gases. The housing includes a first wall, an opposite second wall, a pair of side walls, and a barrier wall forming a compartment for containing the line terminal. The barrier wall has an opening between the arc chamber and the compartment. The first wall has an aperture aligned with the line terminal. A baffle member includes a base portion, a flap and a pair of leg members. The flap extends over the aperture and is deflectable by a tool inserted through the aperture for adjustment of the line terminal. The leg members engage the side walls, thereby supporting the baffle member within the compartment.

Abstract: Strain relief for the electrical leads of attachment devices for electric power switches is provided by pairs of diverging through apertures extending through a molded wall of the switch casing from a first face to a second face to form opposed acute angles at the second face. Each lead is routed through a first aperture of a diverging pair from the first face to the second face, then along the second face and back through the second aperture to the first face. Separate pairs of diverging apertures can be provided for each lead, or they may all be routed through a common, laterally widened pair of apertures. Any tension applied to the leads so routed causes the edges created by the opposed acute angles to bite into and restrain the leads. An adhesive can be injected into the apertures to prevent the leads from being pushed back through the apertures.

Abstract: A terminal wire clamp is provided with a fastener and a connection plate, in which the connection plate has a connection surface that is formed with a retention channel, and in which the retention channel is structured to receive a wire therein and resist movement of the wire after the wire has electrically conductively engaged a conductor. The abstract shall not be used for interpreting the scope of the claims.

Abstract: Halogen substituents in the 5-position of 4-aminopicolinic acids are selectively reduced in the presence of halogen substituents in the 3- and 6-positions by electrolysis.

Abstract: A method of manufacturing a heat sink for an inverter that utilizes a housing with a porous metallic interior formed from a large plurality of metal balls bonded together to provide a plurality of fluid flow paths. The metal balls serve as heat sinks to dissipate the heat in the fluid that flows through the heat sink. The metal balls must therefore be in thermally conductive contact with each other, and the bond area between the balls must be as large as is feasible to provide a sufficient heat path for the heat from the fluid. The heat sink is intended to be sued with an inverter for an electric motor, so the heat sink housing must be formed from molybdenum to accommodate mounting of circuitry. In order to be susceptible to receiving soldered components the molybdenum surface is nickel plated. The porous metal medium for the heat sink is formed from small (approximately {fraction (3/32)}″ diameter) copper balls.

Abstract: Halogen substituents in the 5-position of 4-aminopicolinic acids are selectively reduced in the presence of halogen substituents in the 3- and 6-positions by electrolysis.

Abstract: A circuit interrupter including a housing, separable main contacts disposed in the housing, and an operating mechanism disposed in the housing and interconnected with the contacts. A trip mechanism is disposed in the housing and has an automatic trip assembly that selectively generates a tripping operation to cause the operating mechanism to open the contacts upon a predetermined current threshold. The automatic trip assembly includes a magnetic yoke, an armature, and an electrical terminal. The magnetic yoke has pivot supports on which are positioned pivot arms of a head portion of the armature. A clamp member applies a clamping force to the head portion of the armature in a direction to normally rotationally displace a bottom portion of the armature away from the yoke and the terminal.

Abstract: A socket for establishing a releasable connection between terminals of electronic modules and a circuit board includes a base having a module support surface for supporting the module in test position. A contact holder cooperates with the base for supporting contact elements for each terminal of the module. Each of the contact modules include a projecting portion projecting from the socket and before engagement with the circuit board, a support section which is supported on the contact holder in grooves defined between ribs and oriented with respect thereto by tabs on the contact elements engaging gaps in the grooves, and a deflecting section which extends over slots in the contact holder. When a module to be tested, the module is placed on the test surface and a lid pivotally mounted on the socket is closed to thereby push the terminals into engagement with the contact elements and thereafter downward force being accommodated by deflection of the deflectable portion of the contact elements into the grooves.

Abstract: A motor operator for a circuit breaker has a motor driven carriage which engages a circuit breaker handle and drives it between an on position and a reset position beyond off. When the carriage drives the handle to the on position, an on limit switch is actuated to deenergize the motor. A fastener releasably secures a bracket slidably mounted on the carriage to a fixed member when the carriage reaches the on position of the handle so that if the circuit breaker is not reset and rebounds toward a trip position, the bracket is extended and maintains actuation of the on limit switch. Hence, the motor is not repeatedly energized and burned out in unsuccessful attempts to turn on the circuit breaker. A similar arrangement prevents the motor from cycling when the off relay is latched.

Abstract: A purge chamber for purging oxygen from interlocking, solid material, such as shredded tire pieces, prior to further processing of the material in a liquefaction apparatus. The purge chamber includes a chamber for holding interlocking, solid material An entrance port is connected to the chamber for passing the interlocking, solid material into the chamber. A purge device communicates with the chamber for providing a purging gas to the chamber. An exit port of the chamber passes the interlocking, solid material from the chamber. An auger screw mounted in the chamber, when rotated, moves the interlocking, solid material from within the chamber into the exit port.

Abstract: A discharge system is used with a tire liquefaction process using a reactor. The system includes a receiver receiving unreacted components, including oil coated metal from the reactor. The unreacted components are moved through a pyrolysis reactor where they are heated to a temperature sufficient to convert the unreacted hydrocarbon components to a liquid and to a gas by way of pyrolysis. The liquid and the majority of gas are drawn off from the pyrolysis reactor. Discharge apparatus connected to the pyrolysis reactor converts the remaining gas to a condensate and discharges the metal. The condensate is also removed for further use.

Abstract: A multifunctional chip includes first and second electrically isolated bonding pads. The chip also includes a control circuit coupled to the second bonding pad. The control circuit commands the chip to perform the first function if the first and second bonding pads are coupled. Alternatively, the control circuit commands the chip to perform the second function if the first and second bonding pads remain electrically isolated. The coupling or isolation between the first and second bonding pads is determined by wire bonds. Therefore, the use of wire bonds selects the function for the chip.