Patents by Inventor Craig Mitchell

Craig Mitchell has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20100150706
    Abstract: Articles having a body including a composite material having at least one toughened region and at least one untoughened region, the toughened region containing a toughening agent selected from the group consisting of polymers, nano fibers, nano particles, and combinations thereof where the toughened region includes a toughened resin having a fracture toughness of at least about 1.0 MPa-m1/2.
    Type: Application
    Filed: July 31, 2007
    Publication date: June 17, 2010
    Inventors: Ming Xie, Donald George Lachapelle, Stephen Craig Mitchell
  • Publication number: 20100148396
    Abstract: Methods of making an article having at least one toughened region and at least one untoughened region involving providing a material, applying a toughening agent to a portion of the material, shaping the material to produce a preform, applying an untoughened resin to the preform, and curing the preform having the applied untoughened resin to produce the at least one toughened region and the at least one untoughened region wherein the toughened region comprises a toughened resin having a fracture toughness of at least about 1.0 MPa-m1/2.
    Type: Application
    Filed: July 31, 2007
    Publication date: June 17, 2010
    Inventors: Ming Xie, Donald George Lachapelle, Stephen Craig Mitchell
  • Patent number: 7677218
    Abstract: A seal for an engine is disclosed. The seal may include a cylinder head gasket. The seal may also include a cylinder head having a top surface and a bottom surface, the bottom surface of the cylinder head attached to the cylinder head gasket. The seal may also include a plurality of adjacent openings extending through the cylinder head, from the top to the bottom surface. The seal may further include one or more elongated slots in the bottom surface of the cylinder head, the one or more slots being located between at least two of the adjacent openings and extending between the openings. The seal may also include filler material filling each of the elongated slots.
    Type: Grant
    Filed: July 31, 2007
    Date of Patent: March 16, 2010
    Assignee: Caterpillar Inc.
    Inventor: Craig Mitchell Berger
  • Patent number: 7604095
    Abstract: An enclosure having at least one wall, the wall includes an inner panel comprising, in sequence outwardly from the enclosure hollow interior, an inner sheet comprising a plurality of perforations extending therethrough, a plurality of panel stiffening members coupled to the inner sheet, and at least one inner panel sound absorption member comprising non-metallic sound absorption material positioned between adjacent of the plurality of panel stiffening members, and an outer panel comprising in sequence inwardly from outside of the enclosure, an outer panel sandwich member comprising non-metallic composite material including spaced-apart first and second walls and a plurality of spaced-apart transverse walls extending between the first and second walls defining hollow chambers therebetween, the outer panel coupled to the inner panel such that an outer surface of the inner panel is substantially flush against an outer surface of the outer panel.
    Type: Grant
    Filed: June 1, 2006
    Date of Patent: October 20, 2009
    Assignee: General Electric Company
    Inventor: Stephen Craig Mitchell
  • Patent number: 7590707
    Abstract: A method and system for identifying network addresses associated with suspect network destinations is described.
    Type: Grant
    Filed: August 7, 2006
    Date of Patent: September 15, 2009
    Assignee: Webroot Software, Inc.
    Inventors: Harry Murphey McCloy, III, Craig Mitchell Shifman
  • Publication number: 20090173786
    Abstract: A system and method for providing to a minor access to a network information dissemination activity. Responsive to an interaction by the minor with a webpage of a website, an information dissemination machine determines whether the interaction is a triggering action. Where a triggering action is determined to have occurred, a credit card transaction form for completing a credit card transaction is provided at a client input/output device. Responsive to completion of the credit card transaction, access to performance of an activity via a further interaction with the website is provided to the minor.
    Type: Application
    Filed: January 7, 2009
    Publication date: July 9, 2009
    Applicant: TURTLE POND PUBLICATIONS
    Inventor: Craig Mitchell HATKOFF
  • Publication number: 20090033035
    Abstract: A seal for an engine is disclosed. The seal may include a cylinder head gasket. The seal may also include a cylinder head having a top surface and a bottom surface, the bottom surface of the cylinder head attached to the cylinder head gasket. The seal may also include a plurality of adjacent openings extending through the cylinder head, from the top to the bottom surface. The seal may further include one or more elongated slots in the bottom surface of the cylinder head, the one or more slots being located between at least two of the adjacent openings and extending between the openings. The seal may also include filler material filling each of the elongated slots.
    Type: Application
    Filed: July 31, 2007
    Publication date: February 5, 2009
    Inventor: Craig Mitchell Berger
  • Patent number: 7467687
    Abstract: An enclosure for apparatus that, during operation, generates heat and/or sound energy comprises at least one wall defining at least a portion of the enclosure hollow interior. The wall comprises in sequence outwardly from the enclosure hollow interior an inner panel, an outer panel, a support frame between the inner and outer panels to hold the inner and outer panels spaced apart, and a vibrator isolator between the support frame and the panels. Panels or panel segments of the wall primarily are made of non-metallic composites to provide a structurally strong, lightweight enclosure that includes enhanced acoustic characteristics and reduced heat transfer through enclosure walls, along with fire protection and in-plane shear loading capabilities.
    Type: Grant
    Filed: November 12, 2004
    Date of Patent: December 23, 2008
    Assignee: General Electric Company
    Inventors: Stephen Craig Mitchell, Jay Alan Benson, Glen William Royal
  • Publication number: 20080262961
    Abstract: A method of managing risk associated with processing merchant credit card transactions includes establishing a plurality of merchant processing relationships with a plurality of merchants, compiling transaction history for each of the plurality of merchants, identifying a business relationship between at least two of the plurality of merchants, based on the business relationship, associating the at least two merchants into a single processing relationship, and periodically calculating a measure of processing risk for the single processing relationship by, at least in part, combining the transaction history compiled for each of the at least two merchants. In some embodiments the method includes, based on the measure of processing risk, changing a periodic review schedule for the processing relationship.
    Type: Application
    Filed: April 17, 2007
    Publication date: October 23, 2008
    Applicant: First Data Corporation
    Inventors: Todd A. Dellomo, Brian K. Gallagher, Craig Mitchell, Edward Wang
  • Patent number: 7429166
    Abstract: A method for manufacturing a turbine engine component includes forming a component to include a first side and an opposite second side, positioning at least one capillary adjacent to an external surface of at least one of the first and second sides, and securing the at least one capillary to the component with at least one composite layer.
    Type: Grant
    Filed: December 20, 2005
    Date of Patent: September 30, 2008
    Assignee: General Electric Company
    Inventor: Stephen Craig Mitchell
  • Publication number: 20080034073
    Abstract: A method and system for identifying network addresses associated with suspect network destinations is described.
    Type: Application
    Filed: August 7, 2006
    Publication date: February 7, 2008
    Inventors: Harry Murphey McCloy, Craig Mitchell Shifman
  • Publication number: 20070278035
    Abstract: An enclosure having at least one wall, the wall includes an inner panel comprising, in sequence outwardly from the enclosure hollow interior, an inner sheet comprising a plurality of perforations extending therethrough, a plurality of panel stiffening members coupled to the inner sheet, and at least one inner panel sound absorption member comprising non-metallic sound absorption material positioned between adjacent of the plurality of panel stiffening members, and an outer panel comprising in sequence inwardly from outside of the enclosure, an outer panel sandwich member comprising non-metallic composite material including spaced-apart first and second walls and a plurality of spaced-apart transverse walls extending between the first and second walls defining hollow chambers therebetween, the outer panel coupled to the inner panel such that an outer surface of the inner panel is substantially flush against an outer surface of the outer panel.
    Type: Application
    Filed: June 1, 2006
    Publication date: December 6, 2007
    Inventor: Stephen Craig Mitchell
  • Publication number: 20070148819
    Abstract: A microelectronic assembly includes two or more microelectronic packages stacked at a fine pitch, which is finer than the pitch that is possible when using solder balls for making the joint. Each stackable package desirably includes a substrate having pins projecting from one surface of the substrate and solder balls projecting from the other surface of the substrate. Each stackable package may have one or more die attached to one or more of the surfaces of the substrate. In certain embodiments, die may be attached to both surfaces of the substrate. The dies may be electrically interconnected with the substrate using wire bonds, flip chip bonding, leads and/or stud bumping. The die may be encapsulated in an encapsulated material, under-filled or glob topped. In certain preferred embodiments, the combination of the conductive post height and ball height is equal to or greater than the height of the encapsulated or molded chip structure.
    Type: Application
    Filed: December 23, 2005
    Publication date: June 28, 2007
    Applicant: Tessera, Inc.
    Inventors: Belgacem Haba, Craig Mitchell
  • Publication number: 20070145550
    Abstract: A dielectric structure is formed by a molding process, so that a first surface of a dielectric structure is shaped by contact with the mold. The opposite second surface of the dielectric structure is applied onto the front surface of a wafer element. The dielectric layer may include protruding bumps and terminals may be formed on the bumps. The bumps may be of a precise height. The terminals lie at a precisely controlled height above the front surface of the wafer element. The terminals may include projecting posts which extend above a surrounding solder mask layer to facilitate engagement with a test fixture. The posts are immersed within solder joints when the structure is bonded to a circuit panel.
    Type: Application
    Filed: December 27, 2005
    Publication date: June 28, 2007
    Applicant: Tessera, Inc.
    Inventors: Belgacem Haba, IIyas Mohammed, Craig Mitchell, Michael Warner, Jesse Thompson
  • Publication number: 20070105282
    Abstract: A microelectronic package includes a microelectronic element having contacts, a dielectric element, at least a portion of the dielectric element extending beneath the microelectronic element, and a structure including portions of a lead frame. The structure includes a plurality of terminals and leads formed integrally with the terminals, at least some of the terminals and at least some of the leads being disposed entirely beneath the microelectronic element, and at least some of the contacts being connected to at least some of the terminals by at least some of the leads. The leads and terminals are at least about 50 microns thick.
    Type: Application
    Filed: December 28, 2006
    Publication date: May 10, 2007
    Applicant: Tessera, Inc.
    Inventors: Craig Mitchell, Belgacem Haba
  • Publication number: 20070096295
    Abstract: A packaged microelectronic device is provided which includes: (a) a unit having a chip with an upwardly-facing front surface and a downwardly-facing rear surface, a lid overlying at least a portion of the front surface of the chip, the lid having a top surface facing upwardly away from the chip and unit connections exposed at the top surface of the lid. At least some of the unit connections are electrically connected to the chip. The packaged microelectronic device also includes a package structure including structure defining package terminals, at least some of the package terminals being electrically connected to the chip. The package structure, the unit or both define a downwardly-facing bottom surface of the package, the terminals being exposed at the bottom surface.
    Type: Application
    Filed: December 19, 2006
    Publication date: May 3, 2007
    Applicant: Tessera, Inc.
    Inventors: Robert Burtzlaff, Belgacem Haba, Giles Humpston, David Tuckerman, Michael Warner, Craig Mitchell
  • Publication number: 20070096311
    Abstract: Capped chips and methods of forming a capped chip are provided in which electrical interconnects are made by conductive elements which extend from bond pads of a chip at least partially through a plurality of through holes of a cap. The electrical interconnects may be solid, so as to form seals extending across the through holes. In some cases, stud bumps extend from the bond pads, forming parts of the electrical interconnects. In some cases, a fusible conductive medium forms a part of the electrical interconnects.
    Type: Application
    Filed: December 19, 2006
    Publication date: May 3, 2007
    Applicant: Tessera, Inc.
    Inventors: Giles Humpston, David Tuckerman, Bruce McWilliams, Belgacem Haba, Craig Mitchell
  • Publication number: 20060099789
    Abstract: Microelectronic packages include a microelectronic element and portions of a lead frame disposed beneath the microelectronic element. The lead frame may be laminated with a dielectric element and the resulting laminate may be punched to remove the bus bar included in the lead frame, thereby forming an in-process unit having the leads and terminals of the original lead frame attached to the dielectric element. A microelectronic element such as a semiconductor chip may be assembled with such an in-process element and, desirably, encapsulated to form a package.
    Type: Application
    Filed: October 22, 2004
    Publication date: May 11, 2006
    Applicant: Tessera, Inc.
    Inventors: Craig Mitchell, Belgacem Haba
  • Publication number: 20060049498
    Abstract: An assembly includes a structure, a plurality of terminals and a plurality of compliant pads disposed between said terminals and said structure. The terminals are aligned with at least some of said pads, with the pads providing a standoff between the structure and the terminals. The compliant pads are preferably made of a non-conductive material such as a silicone elastomer.
    Type: Application
    Filed: October 26, 2005
    Publication date: March 9, 2006
    Applicant: Tessera, Inc.
    Inventors: Zlata Kovac, Craig Mitchell, Thomas DiStefano, John Smith
  • Publication number: 20060033216
    Abstract: A stacked chip assembly includes individual units having chips mounted on dielectric layers and traces on the dielectric layers interconnecting the contacts of the chips with terminals disposed in peripheral regions of the dielectric layers. At least some of the traces are multi-branched traces which connect chip select contacts to chip select terminals. The units are stacked one above the other with corresponding terminals of the different units being connected to one another by solder balls or other conductive elements so as to form vertical buses. Prior to stacking, the multi-branched traces of the individual units are selectively connected, as by forming solder bridges, so as to leave chip select contacts of chips in different units connected to different chip select terminals and thereby connect these chips to different vertical buses. The individual units desirably are thin and directly abut one another so as to provide a low-height assembly with good heat transfer from chips within the stack.
    Type: Application
    Filed: October 17, 2005
    Publication date: February 16, 2006
    Applicant: Tessera, Inc.
    Inventors: L. Pflughaupt, David Gibson, Young-Gon Kim, Craig Mitchell, Wael Zohni, Ilyas Mohammed