Patents by Inventor Da Chen

Da Chen has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 11253059
    Abstract: A cabinet is provided, which is adapted to receive a device. The cabinet includes a plurality of first pillars, a plurality of second pillars, a plurality of track units, and two sliders. Each track unit is bridged between one of the first pillars and one of the second pillars. The sliders are disposed on two sides of the device, wherein the sliders are slidably connected to the track units. Each track unit includes a first connection base and a track portion. The first connection base is disposed on one end of the track portion. The first connection base includes a first connection side, a first base side, and a second base side. The first connection side is located between the first base side and the second base side. The first connection side is connected to the first pillar.
    Type: Grant
    Filed: February 13, 2020
    Date of Patent: February 22, 2022
    Assignee: WISTRON NEWEB CORP.
    Inventors: Yan-Da Chen, Chien-Ming Peng
  • Publication number: 20220053664
    Abstract: An electronic device includes a substrate, at least one electronic element and a heat dissipating electromagnetic shielding structure. The heat dissipating electromagnetic shielding structure is disposed on the substrate and covers the at least one electronic element, wherein the heat dissipating electromagnetic shielding structure includes a shielding frame and a heatsink. The shielding frame includes a plurality of spring members. The spring members are bent toward the substrate and partially abut against the heatsink. When the heatsink and the shielding frame are correspondingly arranged, a shielding space is defined, the electronic element is disposed in the shielding space, and a heat generated by the at least one electronic element is conducted out of the shielding space via the heatsink.
    Type: Application
    Filed: June 18, 2021
    Publication date: February 17, 2022
    Inventors: Yan-Da CHEN, Chien-Ming PENG, Yu-Jen LIU, Chih-Chuan LIN, Chi-Te LIN
  • Publication number: 20220045112
    Abstract: The present disclosure provides a camera assembly, a lens module, and an electronic device. The camera assembly includes a photosensitive unit, functional components, a redistribution layer (RDL) structure, and an encapsulation layer, embedded with the photosensitive unit, the functional components, and the RDL structure. The photosensitive unit includes a photosensitive chip and an optical filter mounted on the photosensitive chip. The RDL structure and the optical filter are exposed from a top surface of the encapsulation layer. A highest top of the photosensitive chip and the functional components is exposed from a bottom surface of the encapsulation layer. The photosensitive chip and the functional components have solder pads facing the RDL structure and electrically connecting with the RDL structure.
    Type: Application
    Filed: October 13, 2021
    Publication date: February 10, 2022
    Inventors: Da CHEN, Mengbin LIU
  • Publication number: 20220015235
    Abstract: An electronic device with a connector structure is provided. The electronic device includes a first circuit board, a first connector, a first shielding cover, a second circuit board, a second connector, and a second shielding cover. The first connector is disposed on the first circuit board. The first shielding cover is disposed on the first circuit board and surrounds the first connector. The second connector is disposed on the second circuit board, wherein the second connector is connected to the first connector. The second shielding cover is disposed on the second circuit board and surrounds the second connector, wherein the first shielding cover is electrically connected to the second shielding cover.
    Type: Application
    Filed: April 23, 2021
    Publication date: January 13, 2022
    Inventors: Yan-Da CHEN, Shih-Hao OU
  • Patent number: 11222629
    Abstract: The present invention is a masterbot architecture in a scalable multi-service virtual assistant platform that can construct a fluid and dynamic dialogue by assembling responses to end user utterances from two kinds of agents, information agents and action agents. A plurality of information agents obtain at least one information value from a parsed user input and/or contextual data. A plurality of action agents perform one or more actions in response to the parsed user input, the contextual data, and/or the information value. A masterbot arbitrates an activation of the plurality of information agents and the plurality of action agents. The masterbot comprises an action agent selector module to select an appropriate action agent; a prerequisite validator module to validate that one or more prerequisite conditions of the selected action agent have been met; and an action invocation module to perform one or more selected actions of the selected action agent.
    Type: Grant
    Filed: June 7, 2021
    Date of Patent: January 11, 2022
    Assignee: Linc Global, Inc.
    Inventors: Fang Cheng, Dennis Wu, Jian Da Chen
  • Patent number: 11199970
    Abstract: A data storage device is provided. The data storage device includes a flash memory and a controller. The flash memory stores a firmware that includes a plurality of mode page settings, and each mode page setting includes a plurality of mode parameters. The controller receives a data out message arranged to rewrite a first mode page setting among the plurality of mode page settings from a host. The controller determines whether the data out message will change the mode parameters which cannot be rewritten in the first mode page setting by performing bitwise logic operations on a new mode page setting in the data out message, preset values of the plurality of mode parameters of the first mode page setting, and a rewriteable setting for each bit of the first mode page setting.
    Type: Grant
    Filed: July 15, 2020
    Date of Patent: December 14, 2021
    Assignee: SILICON MOTION, INC.
    Inventors: Te-Kai Wang, Yu-Da Chen
  • Patent number: 11171166
    Abstract: The present disclosure provides a camera assembly and a packaging method thereof, a lens module, and an electronic device.
    Type: Grant
    Filed: December 28, 2018
    Date of Patent: November 9, 2021
    Assignee: Ningbo Semiconductor International Corporation
    Inventors: Da Chen, Mengbin Liu
  • Publication number: 20210341423
    Abstract: A gate detection robot based on a giant magnetoresistance element includes a support, a guide wheel, and two driving wheels are provided at the bottom of the support. The support is provided with a controller, a range-based localization module, and a magnetic flaw detection sensor based on the giant magnetoresistance element. The magnetic flaw detection sensor includes an excitation mechanism, a giant magnetic sensor, and two magnetic concentrators. During detection, the excitation mechanism magnetizes a gate with a magnetic field as a medium. When the surface of the gate has a defect, the magnetic conductivity of the local area is reduced and the magnetic resistance is increased so that magnetic lines are distorted and diffused outside the gate to form a detectable leakage magnetic field signal, the signal is transmitted to the controller, so that the controller obtains a specific location of the detection robot.
    Type: Application
    Filed: November 9, 2018
    Publication date: November 4, 2021
    Applicant: HOHAI UNIVERSITY
    Inventors: Da CHEN, Baodong LOU, Yingdi LIAO, Yazhou ZHAO, Lijun HOU
  • Publication number: 20210320095
    Abstract: A camera assembly includes a photosensitive unit, including a photosensitive chip and an optical filter mounted on the photosensitive chip; functional components; and an encapsulation layer, embedded with the photosensitive unit and the functional components. The photosensitive chip and the functional components are exposed from a bottom surface of the encapsulation layer. A top surface of the encapsulation layer is higher than the photosensitive chip and functional components and exposes the optical filter. The photosensitive chip has soldering pads facing away from the bottom surface of the encapsulation layer. The functional components have soldering pads exposed from the bottom surface of the encapsulation layer. The camera assembly further includes a redistribution layer structure, disposed on the bottom surface of the encapsulation layer and electrically connecting to the soldering pads.
    Type: Application
    Filed: June 25, 2021
    Publication date: October 14, 2021
    Inventors: Da CHEN, Mengbin LIU
  • Publication number: 20210304740
    Abstract: The present invention is a masterbot architecture in a scalable multi-service virtual assistant platform that can construct a fluid and dynamic dialogue by assembling responses to end user utterances from two kinds of agents, information agents and action agents. A plurality of information agents obtain at least one information value from a parsed user input and/or contextual data. A plurality of action agents perform one or more actions in response to the parsed user input, the contextual data, and/or the information value. A masterbot arbitrates an activation of the plurality of information agents and the plurality of action agents. The masterbot comprises an action agent selector module to select an appropriate action agent; a prerequisite validator module to validate that one or more prerequisite conditions of the selected action agent have been met; and an action invocation module to perform one or more selected actions of the selected action agent.
    Type: Application
    Filed: June 7, 2021
    Publication date: September 30, 2021
    Inventors: Fang Cheng, Dennis Wu, Jian Da Chen
  • Patent number: 11073683
    Abstract: A projection lens structure mainly includes a first group of lenses with a negative dioptric value, a second group of lenses with a positive dioptric value, a third group of lenses with a positive dioptric value and a fourth group of lenses with a negative dioptric value. The first group of lenses further includes at least a first lens and a second lens, of which the first lens ha a plastic aspheric lens in a meniscus shape with a focal length between ?25˜?80 mm. The second group of lenses further includes at least a third lens. The third group of lenses further includes at least a first doublet with a focal length between 25˜80 mm. The fourth group of length further includes at least a group of doublets, a fourth lens and a fifth lens.
    Type: Grant
    Filed: July 31, 2019
    Date of Patent: July 27, 2021
    Assignee: Sun Yang Optics Development Co., Ltd.
    Inventors: Sheng-Che Wu, Yu-Hung Chou, You-Da Chen
  • Patent number: 11069670
    Abstract: The present disclosure provides a method for packaging a camera assembly. The method includes: providing a photosensitive chip; mounting an optical filter on the photosensitive chip; temporarily bonding the photosensitive chip and functional components on a carrier substrate, where the photosensitive chip has soldering pads facing away from the carrier substrate and the functional components have soldering pads facing toward the carrier substrate; forming an encapsulation layer covering the carrier substrate, the photosensitive chip, and the functional components, and exposing the optical filter; after the encapsulation layer is formed, removing the carrier substrate; and after the carrier substrate is removed, forming a redistribution layer structure on a side of the encapsulation layer facing away from the optical filter to electrically connect the soldering pads of the photosensitive chip with the soldering pads of the functional components.
    Type: Grant
    Filed: December 28, 2018
    Date of Patent: July 20, 2021
    Assignee: Ningbo Semiconductor International Corporation
    Inventors: Da Chen, Mengbin Liu
  • Publication number: 20210201901
    Abstract: The present invention is an action agent architecture in a scalable multi-service virtual assistant platform that can construct a fluid and dynamic dialogue by assembling responses to end user utterances from two kinds of agents, information agents and action agents. A plurality of information agents obtain at least one information value from a parsed user input and/or contextual data. A plurality of action agents perform two or more actions in response to the parsed user input, the contextual data, and/or an information value obtained from at least one of the information agents. The plurality of action agents are configured by specifying one or more triggering conditions, one or more action invocation parameters, one or more information agents as pre-requisites, and one or more responses. A natural language generation (NLG) module renders a response back to the user after the two or more actions are performed.
    Type: Application
    Filed: February 22, 2021
    Publication date: July 1, 2021
    Inventors: Fang Cheng, Dennis Wu, Jian Da Chen
  • Patent number: 11031001
    Abstract: The present invention is an action agent architecture in a scalable multi-service virtual assistant platform that can construct a fluid and dynamic dialogue by assembling responses to end user utterances from two kinds of agents, information agents and action agents. A plurality of information agents obtain at least one information value from a parsed user input and/or contextual data. A plurality of action agents perform one or more actions in response to the parsed user input, the contextual data, and/or an information value obtained from at least one of the information agents. The plurality of action agents are created through a declarative language by specifying one or more triggering conditions, one or more action invocation parameters, one or more information agents as pre-requisites, and one or more responses. A natural language generation (NLG) module renders a response back to the user after the one or more actions are performed.
    Type: Grant
    Filed: February 22, 2021
    Date of Patent: June 8, 2021
    Assignee: Linc Global, Inc.
    Inventors: Fang Cheng, Dennis Wu, Jian Da Chen
  • Patent number: 11011251
    Abstract: A method of verifying a hard post package repair (hPPR) includes steps as follows. A predetermined data background is written into a partial array of a volatile memory. First data are read out from a target row of the partial array of the volatile memory. The volatile memory is commanded to perform the hPPR on the target row. The predetermined data background is written into the partial array of the volatile memory anew after the hPPR has been performed. Second data are read out from a target row of the partial array of the volatile memory. The first data are compared with the second data to verify whether the hPPR fails.
    Type: Grant
    Filed: August 10, 2020
    Date of Patent: May 18, 2021
    Assignee: NANYA TECHNOLOGY CORPORATION
    Inventors: Jyun-Da Chen, Nung Yen
  • Publication number: 20210122019
    Abstract: A striking device includes a swing arm unit, an impact member and two restoring units. Each of the restoring units includes a stationary seat removably connected to the swing arm unit, a moving seat removably and co-movably connected to the impact member, first and second coupling sets, and a resilient member interconnecting the stationary seat and the moving seat to bias the moving seat toward the stationary seat. For each of the restoring units, two portions of the first coupling set are formed respectively on the stationary seat and the swing arm unit and coupled removably with each other, and two portions of the second coupling set are formed respectively on the moving seat and the impact member and coupled removably with each other.
    Type: Application
    Filed: October 22, 2020
    Publication date: April 29, 2021
    Applicant: BASSO INDUSTRY CORP.
    Inventors: Chun-Chi LAI, Liang-Chi HUNG, Sheng-Man WANG, Hung-Da CHEN, Chia-Yu CHIEN, Jian-Rung WU
  • Patent number: 10989238
    Abstract: Disclosed is an elastic fastener assembly for fastening objects to gap between the car window and the trim panel. The elastic fastener assembly includes an elastic fastener having a first piece for supporting the elastic fastener assembly and a second piece serving as a fastener of the elastic fastener assembly. The second piece has an opening provided with a flange for allowing the elastic fastener to be inserted in a gap between a trim panel and a car window glass to securely fasten the elastic fastener assembly to an inner side of the trim panel. The elastic fastener assembly includes an object jointer for jointing objects. The neck of the object jointer is spaced apart from the flange by a distance longer than the thickness of the trim panel, thereby ensuring the elastic fastener assembly to be fastened to the inner side of the trim panel during the installation process.
    Type: Grant
    Filed: March 3, 2020
    Date of Patent: April 27, 2021
    Inventor: Chin-Da Chen
  • Patent number: 10979013
    Abstract: Disclosed is a method of manufacturing a piezoelectric thin film resonator on a non-silicon substrate, including the following steps: depositing a copper thin film on a silicon wafer; coating photoresist on the copper thin film to perform photoetching so as to remove photoresist in an air gap region under the piezoelectric thin film resonator to be disposed; electroplating-depositing a copper layer, and removing photoresist to obtain a stepped peel sacrifice layer; coating polyimide and performing imidization by heat treatment, making a sandwich structure of the piezoelectric thin film resonator above the polyimide layer; performing etching for the polyimide layer in a region not covered by the piezoelectric thin film resonator by oxygen plasma; placing the obtained device into a copper corrosion solution to dissolve the copper around and under the piezoelectric thin film resonator, attaching a drum coated with polyvinyl alcohol glue onto the piezoelectric thin film resonator, releasing and peeling it from th
    Type: Grant
    Filed: May 5, 2019
    Date of Patent: April 13, 2021
    Assignee: SHANDONG UNIVERSITY OF SCIENCE AND TECHNOLOGY
    Inventors: Da Chen, Hongfei Wang, Peng Wang, Xiaojun Zhang, Zhongli Li
  • Publication number: 20210102661
    Abstract: A mounting structure for connecting an electronic device to a mounting surface is provided. The mounting structure includes a mounting base, a linkage, and a bracket. The first end of the linkage pivots on the mounting base. The bracket is rotatably connected to the second end of the linkage, wherein the bracket includes a cable receiving groove. The electronic device is disposed on the bracket. The electronic device includes a cable. At least a portion of the cable extends into the cable receiving groove.
    Type: Application
    Filed: August 26, 2020
    Publication date: April 8, 2021
    Inventors: Yan-Da CHEN, Bing-Sheng HSIEH
  • Publication number: 20210094103
    Abstract: A power tool structure including a main body, a socket, a positioning ball, a pressing ring, a locking mechanism and a head is provided. The socket is connected to the main body and includes an arc space and a through hole passing through an annular wall of the socket to communicate with the arc space. The positioning ball is movably received in the through hole. The pressing ring includes a track. The locking mechanism sleeves on the pressing ring and is coupled to the pressing ring. The locking mechanism includes a coupling portion corresponding to the track, and the locking mechanism is forced to rotate so as to switch between a first position and a second position relative to the pressing ring, thereby allowing the locking mechanism to selectively press against the positioning ball. The head is pivotally inserted in the socket and includes a positioning portion.
    Type: Application
    Filed: September 27, 2020
    Publication date: April 1, 2021
    Inventors: San-Yih SU, Tian-Chi LAI, Yu-Da CHEN