Abstract: A striking device includes a swing arm unit, an impact member and two restoring units. Each of the restoring units includes a stationary seat removably connected to the swing arm unit, a moving seat removably and co-movably connected to the impact member, first and second coupling sets, and a resilient member interconnecting the stationary seat and the moving seat to bias the moving seat toward the stationary seat. For each of the restoring units, two portions of the first coupling set are formed respectively on the stationary seat and the swing arm unit and coupled removably with each other, and two portions of the second coupling set are formed respectively on the moving seat and the impact member and coupled removably with each other.

Abstract: Disclosed is an elastic fastener assembly for fastening objects to gap between the car window and the trim panel. The elastic fastener assembly includes an elastic fastener having a first piece for supporting the elastic fastener assembly and a second piece serving as a fastener of the elastic fastener assembly. The second piece has an opening provided with a flange for allowing the elastic fastener to be inserted in a gap between a trim panel and a car window glass to securely fasten the elastic fastener assembly to an inner side of the trim panel. The elastic fastener assembly includes an object jointer for jointing objects. The neck of the object jointer is spaced apart from the flange by a distance longer than the thickness of the trim panel, thereby ensuring the elastic fastener assembly to be fastened to the inner side of the trim panel during the installation process.

Abstract: Disclosed is a method of manufacturing a piezoelectric thin film resonator on a non-silicon substrate, including the following steps: depositing a copper thin film on a silicon wafer; coating photoresist on the copper thin film to perform photoetching so as to remove photoresist in an air gap region under the piezoelectric thin film resonator to be disposed; electroplating-depositing a copper layer, and removing photoresist to obtain a stepped peel sacrifice layer; coating polyimide and performing imidization by heat treatment, making a sandwich structure of the piezoelectric thin film resonator above the polyimide layer; performing etching for the polyimide layer in a region not covered by the piezoelectric thin film resonator by oxygen plasma; placing the obtained device into a copper corrosion solution to dissolve the copper around and under the piezoelectric thin film resonator, attaching a drum coated with polyvinyl alcohol glue onto the piezoelectric thin film resonator, releasing and peeling it from th

Abstract: A mounting structure for connecting an electronic device to a mounting surface is provided. The mounting structure includes a mounting base, a linkage, and a bracket. The first end of the linkage pivots on the mounting base. The bracket is rotatably connected to the second end of the linkage, wherein the bracket includes a cable receiving groove. The electronic device is disposed on the bracket. The electronic device includes a cable. At least a portion of the cable extends into the cable receiving groove.

Abstract: A power tool structure including a main body, a socket, a positioning ball, a pressing ring, a locking mechanism and a head is provided. The socket is connected to the main body and includes an arc space and a through hole passing through an annular wall of the socket to communicate with the arc space. The positioning ball is movably received in the through hole. The pressing ring includes a track. The locking mechanism sleeves on the pressing ring and is coupled to the pressing ring. The locking mechanism includes a coupling portion corresponding to the track, and the locking mechanism is forced to rotate so as to switch between a first position and a second position relative to the pressing ring, thereby allowing the locking mechanism to selectively press against the positioning ball. The head is pivotally inserted in the socket and includes a positioning portion.

Abstract: A method for making a semiconductor device is disclosed. A substrate comprising semiconductor device elements is provided. A top conductive pad and an anti-reflective coating are patterned over the substrate. The anti-reflective coating is disposed on the top conductive pad. At least one passivation film is formed over the substrate and the anti-reflective coating. The at least one passivation film and the anti-reflective coating are etched to form a trench therein so as to expose a portion of the top conductive pad.

Abstract: An image capturing assembly includes an encapsulation layer, embedded with functional components. The top surface and bottom surface of the encapsulation layer expose the functional components. A through hole is formed in the encapsulation layer; and the functional components have soldering pads facing away from a bottom of the encapsulation layer. A photosensitive unit including a photosensitive chip and an optical filter is mounted on the photosensitive chip. The photosensitive chip is embedded in the through hole; the optical filter is outside the through hole; the top surface and bottom surface of the encapsulation layer expose the photosensitive chip; and the photosensitive chip includes soldering pads facing away from the bottom of the encapsulation layer. A redistribution layer structure is on the top side of the encapsulation layer and electrically connects the soldering pads of the photosensitive chip with the soldering pads of the functional components.

Abstract: The present invention is an action agent architecture in a scalable multi-service virtual assistant platform that can construct a fluid and dynamic dialogue by assembling responses to end user utterances from two kinds of agents, information agents and action agents. The virtual assistant platform comprises a plurality of action agents to perform two or more actions in response to parsed user input, contextual data, and/or an information value obtained from an information agent. The plurality of action agents are interrelated via at least one follow-up connection which interrelates any two of the action agents such that a second action agent follows-up with a second action after a first action agent completes a first action based on a trigger condition. The second action agent utilizes at least one information value set by the first action agent or a system state change triggered by the first action agent.

Abstract: Disclosed is a method of manufacturing a piezoelectric thin film resonator on a non-silicon substrate, including the following steps: depositing a copper thin film on a silicon wafer; coating photoresist on the copper thin film to perform photoetching so as to remove photoresist in an air gap region under the piezoelectric thin film resonator to be disposed; electroplating-depositing a copper layer, and removing photoresist to obtain a stepped peel sacrifice layer; coating polyimide and performing imidization by heat treatment, making a sandwich structure of the piezoelectric thin film resonator above the polyimide layer; performing etching for the polyimide layer in a region not covered by the piezoelectric thin film resonator by oxygen plasma; placing the obtained device into a copper corrosion solution to dissolve the copper around and under the piezoelectric thin film resonator, attaching a drum coated with polyvinyl alcohol glue onto the piezoelectric thin film resonator, releasing and peeling it from th

Abstract: A projection lens structure mainly includes a first group of lenses with a negative dioptric value, a second group of lenses with a positive dioptric value, a third group of lenses with a positive dioptric value and a fourth group of lenses with a negative dioptric value. The first group of lenses further includes at least a first lens and a second lens, of which the first lens ha a plastic aspheric lens in a meniscus shape with a focal length between ?25˜?80 mm. The second group of lenses further includes at least a third lens. The third group of lenses further includes at least a first doublet with a focal length between 25˜80 mm. The fourth group of length further includes at least a group of doublets, a fourth lens and a fifth lens.

Abstract: A cabinet is provided, which is adapted to receive a device. The cabinet includes a plurality of first pillars, a plurality of second pillars, a plurality of track units, and two sliders. Each track unit is bridged between one of the first pillars and one of the second pillars. The sliders are disposed on two sides of the device, wherein the sliders are slidably connected to the track units. Each track unit includes a first connection base and a track portion. The first connection base is disposed on one end of the track portion. The first connection base includes a first connection side, a first base side, and a second base side. The first connection side is located between the first base side and the second base side. The first connection side is connected to the first pillar.

Abstract: The present disclosure provides a photosensitive assembly and formation method thereof, a lens module, and an electronic device. The method for forming the photosensitive assembly includes providing a transparent cover plate; providing a photosensitive chip, including a photosensitive region and a peripheral region surrounding the photosensitive region; bonding the transparent cover plate to the photosensitive chip through a bonding layer, the bonding layer located in the peripheral region of the photosensitive chip, and the transparent cover plate, the bonding layer, and the photosensitive chip enclosing a cavity that accommodates the photosensitive region; and forming a sealing layer to at least cover the sidewall of the bonding layer and the sidewall of the transparent cover plate. According to the present disclosure, a sealing layer is formed on the sidewall of the bonding layer and the sidewall of the transparent cover plate to increase the effect for sealing the cavity.

Abstract: The present disclosure provides a method for packaging a camera assembly. The method includes providing a photosensitive chip having a plurality of first soldering pads; mounting a filter on the photosensitive chip; providing a first carrier substrate; and bonding a plurality of functional components and the photosensitive chip to the first carrier substrate. The plurality of functional components has a plurality of second soldering pads, and the first soldering pads and the second soldering pads all face away from the first carrier substrate. The method includes forming an encapsulation layer to cover the first carrier substrate, the photosensitive chip, and the functional components. The encapsulation layer exposes the filter. The method further includes forming a redistribution layer structure, on one side of the encapsulation layer close to the filter, to electrically connect to the first soldering pads and the second soldering pads; and removing the first carrier substrate.

Abstract: The present invention is an action agent architecture in a scalable multi-service virtual assistant platform that can construct a fluid and dynamic dialogue by assembling responses to end user utterances from two kinds of agents, information agents and action agents. The virtual assistant platform comprises a plurality of action agents to perform two or more actions in response to parsed user input, contextual data, and/or an information value obtained from an information agent. The plurality of action agents are interrelated via at least one follow-up connection which interrelates any two of the action agents such that a second action agent follows-up with a second action after a first action agent completes a first action based on a trigger condition. The second action agent utilizes at least one information value set by the first action agent or a system state change triggered by the first action agent.

Abstract: An image capturing assembly and its packaging method are provided. The method includes: providing a photosensitive chip having soldering pads and a mounted optical filter; bonding functional components on a provided first carrier substrate temporarily, where the functional components have soldering pads facing away from or facing toward the first carrier substrate; forming an encapsulation layer at least being filled between the functional components on the first carrier substrate, and forming a through hole in the encapsulation layer; placing the photosensitive chip in the through hole and bonding the photosensitive chip on the first carrier substrate temporarily, where the soldering pads of the photosensitive chip face away from the first carrier substrate; and after the photosensitive chip is temporarily bonded on the first carrier substrate, forming a redistribution layer structure to electrically connect the soldering pads of the photosensitive chip with the soldering pads of the functional components.

Abstract: An undulator is adapted to a synchrotron storage ring or free electron lasers (FEL), especially to an undulator capable of switching polarization mode rapidly. In comparison with the EPU (elliptically polarized undulator) of APPLE II (Advanced Planar Polarized Light Emitter II) which conceived by Dr. S. Sasaki, the provided undulator does not use mechanical transmission mechanisms to drive the four magnetic pole arrays composed of permanent magnets. Hence, the polarization mode can be switched rapidly. Moreover, a polarization method of electron beam is also provided.

Abstract: A data storage device is provided. The data storage device includes a flash memory and a controller. The flash memory stores a firmware that includes a plurality of mode page settings, and each mode page setting includes a plurality of mode parameters. The controller receives a data out message arranged to rewrite a first mode page setting among the plurality of mode page settings from a host. The controller determines whether the data out message will change the mode parameters which cannot be rewritten in the first mode page setting by performing bitwise logic operations on a new mode page setting in the data out message, preset values of the plurality of mode parameters of the first mode page setting, and a rewriteable setting for each bit of the first mode page setting.

Abstract: A data storage device is provided. The data storage device includes a flash memory and a controller. The flash memory stores a firmware. The firmware includes a plurality of mode page settings, and each mode page setting includes a plurality of mode parameters. The controller receives a mode selection command and a data out message arranged to rewrite a first mode page setting among the plurality of mode page settings from a host. The controller determines whether the data out message will change the mode parameters which cannot be rewritten in the first mode page setting according to the data out message. When the data out message will not change the mode parameters which cannot be rewritten in the first mode page setting, the controller determines whether a plurality of new mode parameters are kept in the flash after the data storage device is turned off.

Abstract: A data storage device includes a memory device and a controller. The memory device includes multiple memory blocks. The memory blocks include single-level cell blocks and multiple-level cell blocks. The controller is coupled to the memory device. When the controller executes a predetermined procedure to write data stored in the single-level cell blocks into the multiple-level cell blocks, the controller is configured to determine whether a valid page count corresponding to each single-level cell block is greater than a threshold, and when the valid page count corresponding to more than one single-level cell block is greater than the threshold, the controller is configured to execute a first merge procedure to directly write the data stored in the single-level cell blocks with the valid page count greater than the threshold into one or more of the multiple-level cell blocks.

Abstract: A data storage device utilized for confirming firmware data includes a flash memory and a controller. The controller is coupled to the flash memory to receive first firmware data and first sorting hash data related to the first firmware data, and it divides a first hash data generated from the first firmware data into a plurality of data groups, and re-assembles the data groups according to a mapping and sorting algorithm to generate second sorting hash data. The controller includes an efuse region for writing the mapping and sorting algorithm. When the controller determines that the second sorting hash data is identical to the first sorting hash data, the first firmware data is allowed to update the controller.