Abstract: Provided is a water purifier comprising: a filter unit filtering water supplied from a water source, including a reverse osmosis filter; a discharge unit discharging water filtered by the filter unit externally; a flushing portion connected to the reverse osmosis filter; and a controller configured to flow water filtered by the reverse osmosis filter to the flushing portion, and to flush the reverse osmosis filter.

Abstract: A flexible printed circuit board includes a base film; a circuit pattern disposed on one surface of the base film; and a coverlay film covering the circuit pattern. The base film is divided into a flexible area and a rigid area, and the circuit pattern of the flexible area comprises a portion thinner than a portion of the circuit pattern of the rigid area.

Abstract: A printed circuit board includes a first insulating layer having a first modulus; a second insulating layer disposed on the first insulating layer and having a second modulus; and a cavity penetrating the second insulating layer, wherein the second modulus is greater than the first modulus, and wherein an edge portion of a bottom surface of the cavity is formed of an insulating material.

Abstract: An electronic component embedded substrate includes a core structure including a first insulating body and core wiring layers and having a cavity and having a stopper layer disposed as a bottom surface; an electronic component disposed in the cavity and attached to the stopper layer; and a build-up structure including a second insulating body covering at least a portion each of the core structure and the electronic component and filling at least a portion of the cavity, and build-up wiring layers wherein the stopper layer has a first region in which a portion of one surface is exposed from the first insulating body and a second region in which the other portion of one surface is covered with the first insulating body, and a surface roughness of one surface of the stopper layer in the first region is greater than that of the stopper layer in the second region.

Abstract: A substrate embedded electronic component package includes a core member having a cavity in which a metal layer is disposed on a bottom surface thereof, an electronic component disposed in the cavity, an encapsulant filling at least a portion of the cavity and covering at least a portion of each of the core member and the electronic component, and a connection structure disposed on the encapsulant and including a first wiring layer connected to the electronic component. A wall surface of the cavity has at least one groove portion protruding outwardly from a center of the cavity, and the groove portion extends to a same depth in the core member as a depth of the cavity.

Abstract: The present disclosure provides molecularly imprinted polymers (MIPs) for selectively binding one or more viruses of a target viral genus, for example SARS-CoV-2, as well as methods of manufacture and uses thereof.

Abstract: The present invention relates to controlled release formulations for treating hearing loss and a method for preparing the same, and more particularly, to controlled release formulations for treating hearing loss prepared by dispersing a steroidal anti-inflammatory agent encapsulated in low molecular weight hyaluronic acid in an aqueous solution of high molecular weight hyaluronic acid and a method for preparing the same.

Abstract: A substrate having an electronic component embedded therein includes a core structure including a first insulating body and core wiring layers and having a cavity penetrating through a portion of the first insulating body, an electronic component disposed in the cavity, an insulating material covering at least a portion of each of the core structure and the electronic component and disposed in at least a portion of the cavity, a wiring layer disposed on the insulating material, and a build-up structure disposed on the insulating material and including a second insulating body and a build-up wiring layer. A material of the first insulating body has a coefficient of thermal expansion (CTE) less than a CTE of the second insulating body, and the insulating material has a CTE less than a CTE of a material of the second insulating body.

Abstract: A cable substrate includes an insulating layer, a slit portion penetrating through at least a portion of the insulating layer in a thickness direction of the insulating layer, and a dummy pattern disposed on the insulating layer. At least a portion of the dummy pattern is exposed to the slit portion.

Abstract: Disclosed is a UWB antenna module arranged in the lateral direction of a portable terminal so as to prevent deterioration of communication performance while minimizing a mounting space. The disclosed UWB antenna module comprises: a planar base substrate; a plurality of radiation patterns arranged on the upper surface of the base substrate, and arranged so as to be spaced from each other; a switching element arranged on the lower surface of the base substrate and connected to the plurality of radiation patterns; and a communication chipset arranged to be spaced from the switching element on the lower surface of the base substrate, and connected to one of the plurality of radiation patterns through a switching operation of the switching element.

Abstract: A cable substrate includes an insulating layer, a slit portion penetrating through at least a portion of the insulating layer in a thickness direction of the insulating layer, and a dummy pattern disposed on the insulating layer. At least a portion of the dummy pattern is exposed to the slit portion.

Abstract: A flexible printed circuit board includes a base film; a circuit pattern disposed on one surface of the base film; and a coverlay film covering the circuit pattern. The base film is divided into a flexible area and a rigid area, and the circuit pattern of the flexible area comprises a portion thinner than a portion of the circuit pattern of the rigid area.

Abstract: A substrate having an electronic component embedded therein includes a core structure including a first insulating body and core wiring layers and having a cavity penetrating through a portion of the first insulating body, an electronic component disposed in the cavity, an insulating material covering at least a portion of each of the core structure and the electronic component and disposed in at least a portion of the cavity, a wiring layer disposed on the insulating material, and a build-up structure disposed on the insulating material and including a second insulating body and a build-up wiring layer. A material of the first insulating body has a coefficient of thermal expansion (CTE) less than a CTE of the second insulating body, and the insulating material has a CTE less than a CTE of a material of the second insulating body.

Abstract: According to one embodiment of the present invention, a control method for a water purifier comprises the steps of: filtering inflowing water so as to generate purified water; extracting the generated purified water; measuring the flow rate of the purified water extracted per unit time; flushing a filter part by using purified water generated in the filter part, when the extraction of the purified water is complete; and draining the flushed water to the outside through a residential water outlet of the filter part, wherein, in the purified water generation step, discharging of residential water generated in the purified water generation step is blocked according to the accumulated flow rate during a one-time extraction of the purified water, calculated on the basis of the flow rate of the purified water.

Abstract: A printed circuit board includes a first insulating layer disposed on a flexible region and a rigid region; and a first wiring layer disposed on one surface of the first insulating layer in the rigid region and the flexible region. A thickness of the first wiring layer in at least a portion of the rigid region is greater than a thickness of the first wiring layer in the flexible region.

Abstract: A printed circuit board includes a first substrate portion including a plurality of first insulating layers, a plurality of first wiring layers respectively disposed on the plurality of first insulating layers, and a plurality of first adhesive layers respectively disposed between the plurality of first insulating layers to respectively cover the plurality of first wiring layers; and a second substrate portion disposed on the first substrate portion, and including a plurality of second insulating layers, a plurality of second wiring layers respectively disposed on the plurality of second insulating layers, and a plurality of second adhesive layers respectively disposed between the plurality of second insulating layers to respectively cover the plurality of second wiring layers.

Abstract: A vehicle having a road surface recognition apparatus, may perform obtaining, by a controller, sound data for a sound detected by a sound detector while driving; obtaining, by the controller, driving data for driving information detected by a driving information detector; recognizing, by the controller, a type of road surface based on the obtained sound data and the obtained driving data; and controlling, by the controller, a traction control system based on information related to the recognized type of the road surface.

Abstract: Provided is a water purifier comprising: a filter unit filtering water supplied from a water source, including a reverse osmosis filter; a discharge unit discharging water filtered by the filter unit externally; a flushing portion connected to the reverse osmosis filter; and a controller configured to flow water filtered by the reverse osmosis filter to the flushing portion, and to flush the reverse osmosis filter.

Abstract: A printed circuit board includes a first insulating layer having a first modulus; a second insulating layer disposed on the first insulating layer and having a second modulus; and a cavity penetrating the second insulating layer, wherein the second modulus is greater than the first modulus, and wherein an edge portion of a bottom surface of the cavity is formed of an insulating material.

Abstract: The present invention relates to heat-killed Lactobacillus rhamnosus conjugated to a polysaccharide polymer binder, a preparation method therefor and a use thereof. The heat-killed Lactobacillus rhamnosus conjugated to a polysaccharide polymer binder of the present invention has an excellent therapeutic effect for atopic diseases, and particularly has high industrial applicability because membrane adhesion competitiveness, which is an advantage of existing lactic acid bacteria, is significantly improved, thereby exhibiting dermatitis preventing, alleviating and treating effects of the same level as steroid-based drugs.