Abstract: An organic light emitting diode display device includes a substrate including a display region, wherein a plurality of pixel regions are defined in the display region; a first electrode over the substrate and in each of the plurality of pixel regions; a bank including a lower layer and an upper layer on the first electrode, the lower layer disposed on edges of the first electrode and having a first width and a first thickness, the upper layer disposed on the lower layer and having a second width smaller than the first width; an organic emitting layer on the first electrode and a portion of the lower layer; and a second electrode on the organic emitting layer and covering an entire surface of the display region.

Abstract: A hot-stamping method may include a three-dimensional cooling mode in which, when a closed-section product placed in an upper mold and a lower mold that are coupled each other is heat-treated under control of a controller, an external cooling water direct spraying operation of directly spraying cooling water onto an external portion of the closed-section product is performed and, simultaneously, an internal cooling water direct spraying operation of directly spraying cooling water into an internal of the closed-section product is performed.

Abstract: Provided are a system and a method for correcting a tracing-position of another vehicle sensed by a radar sensor using a laser scanner, which compare an unspecific tracing position of the radar sensor sensing another vehicle and a contour point acquired by a laser scanner and correct the tracing position of the radar sensor with a position most approximate to the vehicle in the contour point. Therefore, the radar sensor sensing an object in the vicinity of the vehicle recognizes a tracing position of another vehicle to facilitate design of a radar sensor based system.

Abstract: A fan-out semiconductor package includes: a first interconnection member having a through-hole; a semiconductor chip disposed in the through-hole and having an active surface having connection pads disposed thereon and an inactive surface; a second interconnection member disposed on the first interconnection member and the active surface of the semiconductor chip and including a redistribution layer electrically connected to the connection pads; and an encapsulant encapsulating at least portions of the first interconnection member and the semiconductor chip.

Abstract: A juicer having a juice extracting screw assembly, in which a housing with a juice extracting screw installed in the housing has a simplified interior structure, thereby reducing the production cost of the juicer and easily dispensing juice and residue separately using respective passages.

Abstract: A fan-out semiconductor package includes: a first interconnection member having a through-hole; a semiconductor chip disposed in the through-hole; an encapsulant encapsulating at least portions of the first interconnection member and the semiconductor chip; a second interconnection member disposed on the first interconnection member and the semiconductor chip and including redistribution layers electrically connected to the connection pads of the semiconductor chip; a passivation layer disposed on the second interconnection member and having openings exposing at least portions of the redistribution layer of the second interconnection member; and an under-bump metal layer disposed on the passivation layer and filling at least portions of the openings. In the under-bump metal layer, the number of conductor layers formed on a surface of the passivation layer is different from that of conductor layers formed on the exposed redistribution layer and walls of the openings.

Abstract: A gear reducer and a juicer including the gear reducer are disclosed. The gear reducer transfers rotational force, provided by a drive unit, to a juice extraction screw assembly after gear reduction. The gear reducer includes one or more gear reduction units. At least one of the one or more gear reduction units includes a sun gear coaxially connected to a rotating shaft of the drive unit; a ring gear configured such that a plurality of gear teeth are formed on the inner circumferential surface thereof around the sun gear, and configured to output a rotation speed slower than the rotation speed of the sun gear; and a plurality of planetary gears disposed between the sun gear and the ring gear, and configured to transfer the rotational force of the sun gear to the ring gear.

Abstract: A fan-out semiconductor package includes: a first interconnection member having a through-hole; a semiconductor chip disposed in the through-hole; an encapsulant encapsulating at least portions of the first interconnection member and the semiconductor chip; a second interconnection member disposed on the first interconnection member and the semiconductor chip and including redistribution layers electrically connected to the connection pads of the semiconductor chip; a passivation layer disposed on the second interconnection member and having openings exposing at least portions of the redistribution layer of the second interconnection member; and an under-bump metal layer disposed on the passivation layer and filling at least portions of the openings. In the under-bump metal layer, the number of conductor layers formed on a surface of the passivation layer is different from that of conductor layers formed on the exposed redistribution layer and walls of the openings.

Abstract: A mobile terminal device includes a receiver circuit and a processing circuit. The receiver circuit is configured to receive a plurality of reference signal patterns from a plurality of transmission locations, wherein each of the plurality of reference signal patterns corresponds to a respective transmission location of the plurality of transmission locations. The processing circuit is configured to determine a synchronization offset estimate for each of the plurality of transmission locations based on the plurality of reference signal patterns to generate a plurality of synchronization offset estimates; determine if a minimum-valued synchronization offset estimate of the plurality of synchronization offset estimates satisfies predefined criteria; and determine a reception time window for processing data based on the minimum-valued synchronization offset estimate if the minimum-valued synchronization offset estimate satisfies the predefined criteria.

Abstract: An organic light emitting diode display device includes a substrate including a display region, wherein a plurality of pixel regions are defined in the display region; a first electrode over the substrate and in each of the plurality of pixel regions; a bank including a lower layer and an upper layer on the first electrode, the lower layer disposed on edges of the first electrode and having a first width and a first thickness, the upper layer disposed on the lower layer and having a second width smaller than the first width; an organic emitting layer on the first electrode and a portion of the lower layer; and a second electrode on the organic emitting layer and covering an entire surface of the display region.

Abstract: The present disclosure relates to a juicer having a housing and a juice extracting screw assembly. In one implementation, the juice extracting screw assembly may include a juice extracting screw and a strainer.

Abstract: A fan-out semiconductor package includes: a first interconnection member having a through-hole; a semiconductor chip disposed in the through-hole and having an active surface and an inactive surface; an encapsulant encapsulating at least portions of the first interconnection member and the inactive surface of the semiconductor chip; a second interconnection member disposed on the first interconnection member and the active surface of the semiconductor chip and including a redistribution layer electrically connected to the connection pads of the semiconductor chip; a passivation layer disposed on the second interconnection member; and an under-bump metal layer including an external connection pad formed on the passivation layer and a plurality of vias connecting the external connection pad and the redistribution layer of the second interconnection member to each other, wherein the first interconnection member includes a redistribution layer electrically connected to the connection pads of the semiconductor chi

Abstract: A fan-out semiconductor package includes: a fan-out semiconductor package may include: a first interconnection member having a through-hole; a semiconductor chip disposed in the through-hole of the first interconnection member and having an active surface having connection pads disposed thereon and an inactive surface opposing the active surface; an encapsulant encapsulating at least portions of the first interconnection member and the inactive surface of the semiconductor chip; a second interconnection member disposed on the first interconnection member and the active surface of the semiconductor chip; and a reinforcing layer disposed on the encapsulant. The first interconnection member and the second interconnection member respectively include redistribution layers electrically connected to the connection pads of the semiconductor chip.

Abstract: Methods and apparatus for generating a standard pattern for data signals from a set of multiple data signals are provided. The standard pattern consists of a signal length, a centerline, an upper limit, and a lower limit. One of methods comprises, receiving first and second data signals, determining a standard pattern length for each of the first and second data signals, sampling each of the first and second data signals by as much as the determined standard pattern length, aligning the sampled first and second data signals, and generating a standard pattern for the first and second data signals by overlapping the aligned first and second data signals, wherein the generated standard pattern is a standard pattern having reflected thereinto upper and lower limit ranges that are determined using levels of the aligned first and second data signals.

Abstract: The apparatus for detecting damage to the tool in the machine and the method of detecting damage to the tool according to the present disclosure are applied to a machine, such as a CNC, to detect and control damage to a tool and possibility of damage in advance, thereby efficiently managing processing work by the machine while achieving safety of the machine.

Abstract: An organic light emitting diode display device includes a substrate including a display region, wherein a plurality of pixel regions are defined in the display region; a first electrode over the substrate and in each of the plurality of pixel regions; a bank including a lower layer and an upper layer on the first electrode, the lower layer disposed on edges of the first electrode and having a first width and a first thickness, the upper layer disposed on the lower layer and having a second width smaller than the first width; an organic emitting layer on the first electrode and a portion of the lower layer; and a second electrode on the organic emitting layer and covering an entire surface of the display region.

Abstract: An organic light emitting display (OLED) device is disclosed. The OLED device includes a substrate configured to include a sub-pixel defined into an emission region and a driving region. A first bank pattern configured to define the emission region of the sub-pixel is formed on the substrate. A second bank pattern configured to include an opening, which exposes the emission region and a part of the driving region, is formed on a part of an upper surface of the first bank pattern. An organic emission layer is formed in the opening. As such, the occupied area of the organic emission layer becomes wider. Therefore, the thickness deviation of the organic emission layer is prevented or minimized.

Abstract: A method and mobile communications device for receiving a composite signal composed of a plurality of resource elements, the plurality of resource elements including: a plurality of data resource elements subject to interference; measuring a first noise plus interference level on at least one predefined resource element from the plurality of resource elements; measuring a noise plus interference level on the plurality of data resource elements subject to interference; determining a baseline noise plus interference level common to the plurality of data resource elements subject to interference; and generating a hybrid noise plus interference level by replacing the baseline noise plus interference level with the first noise plus interference level from the at least one predefined resource element.

Abstract: Disclosed an organic electroluminescent device and a method for fabricating the same. The device may include a thin film transistor disposed on a substrate; a first electrode formed for each pixel on the thin film transistor; a first pixel define layer formed to cover an edge portion of the first electrode; a second pixel define layer formed on the first pixel define layer; an organic layer formed on the first electrode; and a second electrode formed on the organic layer.

Abstract: An image processing device includes a guided image filtering circuit and an image summation circuit. The guided image filtering circuit is configured to receive an input image including a green channel, a red channel and a blue channel, and to generate a corrected red channel and a corrected blue channel by applying a guided filter with respect to the red channel and the blue channel based on the green channel. The image summation circuit is configured to generate an output image by summing the green channel, the corrected red channel, and the corrected blue channel.