Abstract: In one example, a semiconductor device comprises a substrate, an optical device on a top side of the substrate, a translucent cover over the optical device, wherein the translucent cover is a unitary monolithic piece comprising a cover base and a cover pipe. and a cover structure on the top side of the substrate to support the translucent cover over the optical device. Some examples and related methods are also disclosed herein.

Abstract: A substrate having an electronic component embedded therein includes a core structure including a first insulating body and core wiring layers and having a cavity penetrating through a portion of the first insulating body, an electronic component disposed in the cavity, an insulating material covering at least a portion of each of the core structure and the electronic component and disposed in at least a portion of the cavity, a wiring layer disposed on the insulating material, and a build-up structure disposed on the insulating material and including a second insulating body and a build-up wiring layer. A material of the first insulating body has a coefficient of thermal expansion (CTE) less than a CTE of the second insulating body, and the insulating material has a CTE less than a CTE of a material of the second insulating body.

Abstract: A substrate having an electronic component embedded therein includes a core structure including a first insulating body and a plurality of core wiring layers disposed on or in the first insulating body, and having a cavity penetrating at least a portion of the first insulating body in a thickness direction of the substrate and including a stopper layer as a bottom surface of the cavity, and an electronic component disposed in the cavity and attached to the stopper layer, and a surface of the stopper layer connected to the electronic component has a composite including at least two among a metal material, an inorganic particle, a filler, and an insulating resin.

Abstract: A hot-stamping method may include a three-dimensional cooling mode in which, when a closed-section product placed in an upper mold and a lower mold that are coupled each other is heat-treated under control of a controller, an external cooling water direct spraying operation of directly spraying cooling water onto an external portion of the closed-section product is performed and, simultaneously, an internal cooling water direct spraying operation of directly spraying cooling water into an internal of the closed-section product is performed.

Abstract: A substrate having an electronic component embedded therein includes a core structure including a first insulating body and first wiring layers and having a cavity, an electronic component embedded in the cavity, a build-up structure including a second insulating body, covering at least a portion of each of the core structure and the electronic component and filling a portion of the cavity, and second wiring layers, a first passivation layer disposed on a side of the core structure opposing a side of the core structure on which the build-up structure is disposed, and a second passivation layer disposed on a side of the build-up structure opposing a side of the build-up structure on which the core structure is disposed, wherein the first and second passivation layers include different types of materials.

Abstract: The present invention relates to a body insertable device having an outer body being bent; and an inner body positioned inside the outer body, having an accommodation space in which the resource soured is accommodated, and being capable of rotating inside the outer body, wherein a radiation emission direction is continuously adjusted by rotation of the inner body.

Abstract: A substrate having an electronic component embedded therein includes a core structure including a first insulating body and first wiring layers and having a cavity, an electronic component embedded in the cavity, a build-up structure including a second insulating body, covering at least a portion of each of the core structure and the electronic component and filling a portion of the cavity, and second wiring layers, a first passivation layer disposed on a side of the core structure opposing a side of the core structure on which the build-up structure is disposed, and a second passivation layer disposed on a side of the build-up structure opposing a side of the build-up structure on which the core structure is disposed, wherein the first and second passivation layers include different types of materials.

Abstract: A substrate having an electronic component embedded therein includes a core structure including a first insulating body and core wiring layers and having a cavity penetrating through a portion of the first insulating body, an electronic component disposed in the cavity, an insulating material covering at least a portion of each of the core structure and the electronic component and disposed in at least a portion of the cavity, a wiring layer disposed on the insulating material, and a build-up structure disposed on the insulating material and including a second insulating body and a build-up wiring layer. A material of the first insulating body has a coefficient of thermal expansion (CTE) less than a CTE of the second insulating body, and the insulating material has a CTE less than a CTE of a material of the second insulating body.

Abstract: An electronic component embedded substrate includes a core structure including a first insulating body and core wiring layers and having a cavity and having a stopper layer disposed as a bottom surface; an electronic component disposed in the cavity and attached to the stopper layer; and a build-up structure including a second insulating body covering at least a portion each of the core structure and the electronic component and filling at least a portion of the cavity, and build-up wiring layers wherein the stopper layer has a first region in which a portion of one surface is exposed from the first insulating body and a second region in which the other portion of one surface is covered with the first insulating body, and a surface roughness of one surface of the stopper layer in the first region is greater than that of the stopper layer in the second region.

Abstract: A substrate having an electronic component embedded therein includes a core structure including a first insulating body and a plurality of core wiring layers disposed on or in the first insulating body, and having a cavity penetrating at least a portion of the first insulating body in a thickness direction of the substrate and including a stopper layer as a bottom surface of the cavity, and an electronic component disposed in the cavity and attached to the stopper layer, and a surface of the stopper layer connected to the electronic component has a composite including at least two among a metal material, an inorganic particle, a filler, and an insulating resin.

Abstract: A substrate embedded electronic component package includes a core member having a cavity in which a metal layer is disposed on a bottom surface thereof, an electronic component disposed in the cavity, an encapsulant filling at least a portion of the cavity and covering at least a portion of each of the core member and the electronic component, and a connection structure disposed on the encapsulant and including a first wiring layer connected to the electronic component. A wall surface of the cavity has at least one groove portion protruding outwardly from a center of the cavity, and the groove portion extends to a same depth in the core member as a depth of the cavity.

Abstract: In one example, a semiconductor device comprises a substrate, an optical device on a top side of the substrate, a translucent cover over the optical device, wherein the translucent cover is a unitary monolithic piece comprising a cover base and a cover pipe. and a cover structure on the top side of the substrate to support the translucent cover over the optical device. Some examples and related methods are also disclosed herein.

Abstract: An electroluminescent display device can include a substrate having a display area and a pad region; a thin film transistor in the display area; first and second pads in the pad region; an insulating layer covering the thin film transistor and the first and second pads; first and second pad contact holes exposing the first and second pads, respectively; a light-emitting diode electrically connected to the thin film transistor and including first and second electrodes and a light-emitting layer interposed therebetween; and first and second auxiliary pads on the insulating layer, the first and second auxiliary pads being electrically connected to the first and second pads, respectively, in which each of the first electrode and the first and second auxiliary pads includes a first layer formed of a transparent conductive material and a second layer formed of a metallic material, and a surface length between the first and second auxiliary pads is greater than a distance between the first and second auxiliary pads.

Abstract: A juicer having a juice extracting screw assembly, in which a housing with a juice extracting screw installed in the housing has a simplified interior structure, thereby reducing the production cost of the juicer and easily dispensing juice and residue separately using respective passages.

Abstract: The present invention relates to a functional hydrated hyaluronic acid and a method for producing 5th generation coated lactic acid bacteria having excellent intestinal mucoadhesive ability and a selective antagonism using the same and, more specifically, to a functional hydrated hyaluronic acid in which components fermented by lactic acid bacteria are captured in hyaluronic acid, which is a natural polymer substance, and a method for producing coated lactic acid bacteria using the same. The quadruply coated lactic acid bacteria coated using the functional hydrated hyaluronic acid according to the present invention is quadruply coated with a water-soluble polymer, a functional hydrated hyaluronic acid, a coating agent having porous particles, and a protein, thereby producing an excellent intestinal mucoadhesive ability, exhibiting an antibacterial action against deleterious bacteria in the intestines, and promoting growth of beneficial bacteria in the intestines.

Abstract: A wireless power transmission apparatus for a vehicle is provided. The apparatus includes a magnetic field shielding sheet that is disposed to shield a magnetic field and a wireless power transmission antenna that is attached to one surface of the magnetic field shielding sheet. Additionally, a wireless communication antenna is attached to the surface of the magnetic field shielding sheet to which the wireless power transmission antenna is attached.

Abstract: A fan-out semiconductor package includes: a first interconnection member having a through-hole; a semiconductor chip disposed in the through-hole and having an active surface and an inactive surface; an encapsulant encapsulating at least portions of the first interconnection member and the inactive surface of the semiconductor chip; a second interconnection member disposed on the first interconnection member and the active surface of the semiconductor chip and including a redistribution layer electrically connected to the connection pads of the semiconductor chip; a passivation layer disposed on the second interconnection member; and an under-bump metal layer including an external connection pad formed on the passivation layer and a plurality of vias connecting the external connection pad and the redistribution layer of the second interconnection member to each other, wherein the first interconnection member includes a redistribution layer electrically connected to the connection pads of the semiconductor chi

Abstract: An organic light emitting diode display device includes a substrate including a display region, wherein a plurality of pixel regions are defined in the display region; a first electrode over the substrate and in each of the plurality of pixel regions; a bank including a lower layer and an upper layer on the first electrode, the lower layer disposed on edges of the first electrode and having a first width and a first thickness, the upper layer disposed on the lower layer and having a second width smaller than the first width; an organic emitting layer on the first electrode and a portion of the lower layer; and a second electrode on the organic emitting layer and covering an entire surface of the display region.

Abstract: An organic light emitting diode display device includes a first substrate including a display region, wherein a plurality of pixel regions are defined in the display region; a first electrode over the first substrate and in each of the plurality of pixel regions; a first bank on edges of the first electrode and including an insulating material blocking penetration of light; a second bank on the first bank and including an insulating material having a hydrophobic property; an organic light emitting layer on the first electrode and a portion of the first bank; and a second electrode on the organic light emitting layer and covering an entire surface of the display region.